Full-Time

Senior Process Engineer

Lithography

Updated on 8/1/2026

Black Semiconductor

Black Semiconductor

51-200 employees

Graphene photonics enable optical chip interconnects

No salary listed

Aachen, Germany

Hybrid

Hybrid work in Aachen.

Category
Process Engineering
Required Skills
Data Science
Process Engineering
Data Analysis

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Requirements
  • Three to seven years of experience developing and sustaining processes on 200mm and/or 300mm lithography systems.
  • Experience with installation, start-up, and qualification of lithography tools and overlay/alignment metrology systems.
  • Familiarity with process qualification and optimization for lithography processes, including photoresist, bottom anti-reflective coating, organic planarization layer, and spin-on carbon.
  • Expertise with 193nm and 248nm lithography processes, including scanner and track optimization, process engineering, and practical equipment knowledge.
  • Proficiency in developing or supporting overlay/alignment strategies and designing alignment schemes for complex process flows.
  • A hands-on, proactive approach suitable for a startup environment, supported by design of experiments experience and skills in data analysis, modelling, or data mining.
  • Strong communication skills and fluency in English.
Responsibilities
  • Execute and support equipment installation and process qualification activities for the Lithography area.
  • Work with internal and external customers to develop lithography processes that meet defined Unit Process Deliverables.
  • Collaborate with the Integration team to support future applications and process modules aligned with the long-term technology roadmap.
  • Mentor technical engineering team members and train less-experienced personnel on lithography processes and best practices.
  • Develop and implement process control methodologies for assigned lithography equipment and processes, ensuring stability, repeatability, and continuous improvement.
  • Contribute across lithography topics and take ownership of bringing lithography processes online for new and existing layers.
  • Collaborate with Integration, Equipment Engineering, and internal and external partners on photoresist evaluation, overlay strategies, and process control development.
Desired Qualifications
  • Experience with ASML, Nikon, and/or Canon scanners and DNS and/or TEL tracks.
  • Experience developing and sustaining processes on 200mm and/or 300mm lithography systems.

Black Semiconductor develops chips that combine graphene-based photonics with traditional electronics to enable optical chip-to-chip communication. Its process embeds optical components into the outer layers of CMOS-like chips, allowing electrons to be converted to photons and back via graphene acting as a translator. This integration aims to overcome interconnect bottlenecks, enabling multiple chips to act as a single faster, more energy-efficient system for AI hardware, data centers, HPC, and autonomous driving. The company plans wafer-scale fabrication with a 300mm FabONE in Aachen, targeting pilot production by 2027 and mass production by 2031, supported by European funding and equity investors.

Company Size

51-200

Company Stage

Growth Equity (Non-Venture Capital)

Total Funding

$287.4M

Headquarters

Aachen, Germany

Founded

2020

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Simplify Jobs

Simplify's Take

What believers are saying

  • Graphene photonics overcomes bandwidth, heat, and latency limits of silicon, targeting AI, data centers, and autonomous driving.
  • The CMOS-compatible process reduces manufacturing steps by 60%, significantly cutting costs and improving yield for optical interfaces.
  • Secured €254.4M Series A funding in June 2024 to scale production and create ~120 high-tech jobs in Aachen by 2028.

What critics are saying

  • Graphene quality and scalability failure in FabONE pilot production within 12–18 months has 40–60% probability and high impact.
  • Direct competition from Lightelligence and Teramount with superior silicon photonics market traction has 50–70% probability in 9–15 months.
  • IPCEI ME/CT public funding delayed or reduced due to EU budget cuts has 25–45% probability in 12–18 months, crippling development.

What makes Black Semiconductor unique

  • Black Semiconductor uniquely integrates graphene photonics directly onto CMOS wafers, eliminating traditional electronic interconnects.
  • The company's IGP technology enables chips to compute with electricity and communicate with photons on a single chip.
  • Black Semiconductor is the only firm enabling native photonics integration onto glass panel interposers for limitless data throughput.

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Benefits

Health Insurance

Flexible Work Hours

Stock Options

Growth & Insights and Company News

Headcount

6 month growth

3%

1 year growth

3%

2 year growth

3%
Black Semiconductor
Mar 28th, 2025
[Press Release] Black Semiconductor acquires material specialist Applied Nanolayers - Black Semiconductor

Black Semiconductor, a chip connectivity pioneer integrating photonics and electronics on the same wafer, has announced the acquisition of Applied Nanolayers (ANL).

Black Semiconductor
Mar 28th, 2025
Press Release: Black Semiconductor acquires Applied Nanolayers

Black Semiconductor acquires material specialist Applied Nanolayers to accelerate technology development of energy-efficient, high-performance chip technology.