Full-Time

Wafer Fab Process Engineer

Updated on 1/18/2025

Broadcom Limited

Broadcom Limited

10,001+ employees

Designs and supplies semiconductor and software solutions

Data & Analytics
Hardware
Enterprise Software

Compensation Overview

$107k - $171kAnnually

+ Bonus + Equity

Senior, Expert

Allentown, PA, USA

Category
Microelectronics Engineering
Electrical Engineering
Required Skills
Data Science
Data Analysis
Requirements
  • Bachelor’s Degree in Physics or Electrical/Chemical/Material/Mechanical Engineering with 8+ years’ related industry experience or Master’s in Physics or Electrical/Chemical/Material/Mechanical Engineering with 6+ years’ experience; or Ph.D. in Physics or Electrical/Chemical/Material/Mechanical Engineering and 3+ years of related experience.
  • Hands-on semiconductor wafer fabrication experience, preferably in an Indium Phosphide (InP) production environment or any other compound semiconductor manufacturing environment.
  • Good problem-solving skills. Sound analytical reasoning and ability to solve problems systematically. Familiar with Design of Experiment (DOE), characterization, and process optimization. Strong understanding of Statistical Process Control (SPC) and proficiency with data science and SPC software. Experience applying Lean Manufacturing, Six-Sigma, and similar principles to complex issues.
  • Strong problem-solving, teamwork, and communication skills.
  • Able to work in a cleanroom environment and outside of normal business hours when needed.
Responsibilities
  • Work with an operations team to develop, improve, and sustain wafer fab processes including photolithography, RIE/ICP dry etch, wet etch, metallization, and thin film deposition processes for high-volume photonic integrated circuit manufacturing.
  • Conduct data analysis, failure analysis, and yield improvement.
  • Plan and lead projects including design of experiments.
  • Lead/take ownership of projects to develop/qualify new processes and tools.
  • Complete projects on time and within budget.
  • Define and document standard operating procedures and provide oral and written instructions to operators for wafer processing.
  • Maintain or define quality management standards, including creating and reviewing SPC charts, for robust quality control.
  • Maintain a working knowledge of safety policies and regulations to ensure that duties of self and others are performed in a safe manner.
  • Work with equipment technicians to resolve process/equipment issues.
  • Provide 24x7 manufacturing support.
Desired Qualifications
  • Direct experience in RIE/ICP, wet chemistry, thin-film deposition, metrology, or photolithography (including the use of steppers) a plus.
  • Familiarity with material and process characterization methods including SEM/EDS, mechanical / optical profilometry, ellipsometry, stress measurement techniques, and automated wafer-inspection techniques a plus.

Broadcom Limited specializes in designing and supplying semiconductor and infrastructure software solutions. Its products are used by a wide range of clients, including enterprises, data centers, and telecommunications providers, to enhance data processing and connectivity. Broadcom's semiconductor products and software solutions are essential for applications in networking, broadband, wireless communications, and data storage. A key offering is the DX Unified Infrastructure Management solution, which helps manage various infrastructure environments, including traditional, public cloud, and hybrid setups, ensuring they perform reliably. What sets Broadcom apart from its competitors is its focus on high-performance products that cater to diverse technology and infrastructure needs. The company's goal is to provide efficient solutions that optimize performance and reliability across different applications.

Company Stage

IPO

Total Funding

N/A

Headquarters

San Jose, California

Founded

2005

Simplify Jobs

Simplify's Take

What believers are saying

  • Broadcom's AI server chip collaboration with Apple boosts AI hardware market share.
  • 3.5D F2F XPU technology positions Broadcom as a leader in high-performance computing.
  • Partnership with ByteDance opens new revenue channels in AI semiconductor market.

What critics are saying

  • U.S. export restrictions may impact Broadcom's partnership with ByteDance.
  • VMware price hikes could lead to customer dissatisfaction and loss of smaller clients.
  • Potential delays in Apple AI server chip project may affect financial forecasts.

What makes Broadcom Limited unique

  • Broadcom's 3.5D F2F XPU technology leads in AI processing efficiency.
  • Collaboration with Apple enhances Broadcom's AI infrastructure capabilities.
  • Broadcom's acquisition of VMware strengthens its enterprise software solutions.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

401(k) Retirement Plan

401(k) Company Match

Employee Stock Purchase Plan

Employee Assistance Program

Paid Vacation

Paid Sick Leave

Paid Holidays