Full-Time

Process Integration Engineer

Updated on 8/1/2026

Black Semiconductor

Black Semiconductor

51-200 employees

Graphene photonics enable optical chip interconnects

No salary listed

Aachen, Germany

Hybrid

Hybrid onsite role at the Aachen manufacturing facility.

Category
Architecture & Civil Engineering (1)
Required Skills
Data Analysis

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Requirements
  • A Master of Science or Doctor of Philosophy degree in Electrical Engineering, Physics, Photonics, Materials Science, or a related field is required.
  • At least 7 years of experience in Process Integration within a semiconductor fabrication facility, ideally 300 mm; diverse experience as a process engineer or in yield, integration, or new product introduction roles will also be considered.
  • A proven track record of independently leading complex projects in technology development, process optimization, yield improvement, defect reduction, or reliability enhancement is required.
  • Strong expertise in Failure Mode and Effects Analysis, Statistical Process Control, Design of Experiments, and data analysis is required, with hands-on experience using statistical tools such as JMP.
  • Excellent English communication skills and the ability to analyze complex data and clearly present technical recommendations across teams are required.
  • Project management skills and cross-functional coordination with stakeholders at all levels are required.
Responsibilities
  • Develop and qualify process flows and integration schemes for integrated photonic devices to meet product requirements.
  • Conceive, plan, execute, and interpret process integration studies to support technology maturation and enable transition to mass production, including leading small-to-medium integration and optimization projects while contributing to more complex development programs.
  • Develop data collection strategies that provide quantitative insights for evidence-based decision-making, analyze complex datasets, and distill key observations.
  • Connect observations from past and current studies into recommendations that improve process quality, manufacturability, and yield.
  • Communicate findings and recommendations across the organization and collaborate closely with Optical Design, System Design, Characterization, Graphene, and other cross-functional teams.
  • Engage with Process Engineering and related teams to define and continuously refine process specifications for the 300 mm manufacturing facility.
  • Abide by change-management protocols to introduce evidence-based improvements to manufacturing sequences.
  • Manage ambiguity, navigate interconnected dependencies, and proactively address gaps in a dynamic startup environment.
Desired Qualifications
  • Prior experience and technical knowledge of photonics process technologies and Back-End-of-Line processing is considered a strong plus.

Black Semiconductor develops chips that combine graphene-based photonics with traditional electronics to enable optical chip-to-chip communication. Its process embeds optical components into the outer layers of CMOS-like chips, allowing electrons to be converted to photons and back via graphene acting as a translator. This integration aims to overcome interconnect bottlenecks, enabling multiple chips to act as a single faster, more energy-efficient system for AI hardware, data centers, HPC, and autonomous driving. The company plans wafer-scale fabrication with a 300mm FabONE in Aachen, targeting pilot production by 2027 and mass production by 2031, supported by European funding and equity investors.

Company Size

51-200

Company Stage

Growth Equity (Non-Venture Capital)

Total Funding

$287.4M

Headquarters

Aachen, Germany

Founded

2020

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Simplify Jobs

Simplify's Take

What believers are saying

  • Graphene photonics overcomes bandwidth, heat, and latency limits of silicon, targeting AI, data centers, and autonomous driving.
  • The CMOS-compatible process reduces manufacturing steps by 60%, significantly cutting costs and improving yield for optical interfaces.
  • Secured €254.4M Series A funding in June 2024 to scale production and create ~120 high-tech jobs in Aachen by 2028.

What critics are saying

  • Graphene quality and scalability failure in FabONE pilot production within 12–18 months has 40–60% probability and high impact.
  • Direct competition from Lightelligence and Teramount with superior silicon photonics market traction has 50–70% probability in 9–15 months.
  • IPCEI ME/CT public funding delayed or reduced due to EU budget cuts has 25–45% probability in 12–18 months, crippling development.

What makes Black Semiconductor unique

  • Black Semiconductor uniquely integrates graphene photonics directly onto CMOS wafers, eliminating traditional electronic interconnects.
  • The company's IGP technology enables chips to compute with electricity and communicate with photons on a single chip.
  • Black Semiconductor is the only firm enabling native photonics integration onto glass panel interposers for limitless data throughput.

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Benefits

Health Insurance

Flexible Work Hours

Stock Options

Growth & Insights and Company News

Headcount

6 month growth

3%

1 year growth

3%

2 year growth

3%
Black Semiconductor
Mar 28th, 2025
[Press Release] Black Semiconductor acquires material specialist Applied Nanolayers - Black Semiconductor

Black Semiconductor, a chip connectivity pioneer integrating photonics and electronics on the same wafer, has announced the acquisition of Applied Nanolayers (ANL).

Black Semiconductor
Mar 28th, 2025
Press Release: Black Semiconductor acquires Applied Nanolayers

Black Semiconductor acquires material specialist Applied Nanolayers to accelerate technology development of energy-efficient, high-performance chip technology.