Winter 2026

Packaging Engineering Intern

Winter

Posted on 8/15/2025

Atomic Semi

Atomic Semi

51-200 employees

Compact semiconductor fab producing chips

Compensation Overview

$50.48 - $60.58/hr

+ Overtime Pay (1.5x)

H1B Sponsorship Available

San Francisco, CA, USA

In Person

Category
Process Engineering
Requirements
  • Pursuing a Bachelor's Degree or higher in engineering
  • At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
  • Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
  • Hands-on prototyping experience and the ability to move through design cycles quickly
Responsibilities
  • Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
  • Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
  • Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
  • Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)
Desired Qualifications
  • Proven experience in mechatronics or electromechanical system design
  • Familiarity with lasering and 3D printing (stereolithography)
  • Reliability testing, soldering, and reflow testing
  • Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)

Atomic Semi builds and operates a compact semiconductor fabrication facility to manufacture chips for electronics, automotive, telecom, and more. It uses its own tools and processes to create chips with smaller, more efficient geometries and can offer custom fabrication services to clients. The company distinguishes itself from large fabs by being small, fast, and agile, developing its own manufacturing tools to quickly adapt to new technologies and market needs. Its goal is to provide nimble, efficient chip manufacturing that helps a wide range of tech companies get high-quality chips faster and with flexibility for evolving technology trends.

Company Size

51-200

Company Stage

Seed

Total Funding

$15M

Headquarters

San Francisco, California

Founded

2023

Simplify Jobs

Simplify's Take

What believers are saying

  • 60 engineers across disciplines drive rapid low-cost fab development.
  • Small-scale tools support high-speed prototyping for tech firms.
  • SF-based fab pushes quickly to advanced chip geometries.

What critics are saying

  • ASML's 80% lithography dominance blocks Atomic Semi's tool performance.
  • Zeloof's garage tech fails at scale; zero chips shipped since 2023.
  • TSMC and Samsung billions crush small-fab high-volume viability.

What makes Atomic Semi unique

  • Atomic Semi builds compact fabs for smaller wafers unlike traditional 300mm giants.
  • Founders Sam Zeloof and Jim Keller bring garage fab and 40-year expertise.
  • In-house 3D printers and e-beam writers enable agile tool invention.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

Unlimited Paid Time Off

401(k) Retirement Plan

Paid Parental Leave

Commuter Benefits

Wellness Program

Growth & Insights

Headcount

6 month growth

2%

1 year growth

8%

2 year growth

1%
INACTIVE