Full-Time

Digital Design Lead/Manager

Omni Design Technologies

Omni Design Technologies

51-200 employees

Licenses high-performance IP cores for SoCs

No salary listed

Hyderabad, Telangana, India

Hybrid

Category
Hardware Engineering (1)
Required Skills
Verilog
Python
SAS
Perl
C/C++
FPGA
Requirements
  • BSEE Required
  • MSEE Preferred
  • 10+ years of experience in RTL design and verification of silicon
  • At least 3+ years experience in leading low-power mixed-Signal System-on-Chip design
  • 10+ years of experience with FPGA architecture specification and design (Altera or Xilinx) for high-speed serial protocols, including USB-3.0, PCIe, SATA/SAS, DisplayPort
  • Experience in leading, specifying, and working with Analog/RF team in developing, verifying, and productizing SERDES, CDR, and PLL/DLL designs
  • Experience with USB 3.0, DisplayPort, PCIe, or SATA based silicon designs preferred
  • Strong background in analog/mixed-signal integrated SoC Development
  • Strong hardware design knowledge and familiarity with signal integrity
  • Strong foundation in SoC architecture, design, verification and physical implementation
  • Strong analytical problem solving, and attention to details
  • Knowledge of wireless, mobile, and storage domains
  • Expertise in Verilog/System Verilog, C/C++/SystemC, UVM, Scripting languages like Perl/Python, etc.
  • Excellent technical documentation skills
  • Excellent written and verbal communication skills
  • Excellent interpersonal skills, self-motivated, self-starter
  • Experience in startup environment
  • Senior Management experience preferred
  • Proven track record of success in high-performance/high-volume semiconductor industry
  • SoC, embedded CPU and bus architectures, networking, and control interfaces
  • Communications / DSP algorithms and power / area efficient implementations
  • Digital IC design, design for low power and high speed, design for test (DFT)
  • System modeling, RTL coding, Lint / CDC checking, simulation, synthesis, power analysis, timing analysis in Cadence / Synopsys design environments
  • Directed and constrained random verification, UVM methodology
  • Embedded systems FPGA emulation, lab debug and chip validation
  • Project planning and execution, and performing design tradeoffs to achieve performance, power, die size, and schedule targets
  • Self-motivated, excellent communication skills, and ability to excel and to provide leadership in a fast-paced environment
  • Work with architecture, physical design, and design teams to lead the implementation of the digital architecture
  • Develop and refine specification of the micro-architecture for the digital architecture
  • Is in tune with industry trends and contributes to consistent roadmap decisions
Responsibilities
  • Manage digital team, hire, and retain best talent
  • Lead SOC integration design team to develop and productize next generation mixed-signal RF/communication SOCs
  • Work with cross-functional project teams to define product specifications, system architecture, HW/SW partitioning, and execution plan
  • Implement best SoC development practices and improve design methodology to maximize efficiency and predictability
  • Deliver chip architecture, design, integration, programming model, verification, and manage hand-off to backend
  • Support Silicon and System Validation, support system integration, and production testing
  • Drive innovation and provides leadership to the organization to ensure world-class system solutions and flawless execution
Desired Qualifications
  • Senior Management experience preferred
  • Experience managing large teams in semiconductor environment
  • Strong preference for candidates with experience in automotive or space applications
  • Is in tune with industry trends and contributes to consistent roadmap decisions
  • Mentor and lead a team of Digital design engineers
  • Experience with cross-functional collaboration with architecture, physical design, and test teams
  • Proven track record of delivering high-volume silicon products on schedule and within power/area budgets
  • Ability to lead and deliver RTL for the full chip
  • Experience licensing IP such as PCIe, LPDDR4, JESD 204C PHY
Omni Design Technologies

Omni Design Technologies

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Omni Design Technologies delivers high-performance, ultra-low power IP cores for mixed-signal SoCs that power devices across 5G, LiDAR, automotive networks, AI, image sensing, and IoT. It develops and validates IP blocks and licenses them to chip makers, offering customization and support to ensure seamless integration into customer designs. The cores are designed to work on FinFET processes down to 28nm, with proven silicon such as gigasample low-power ADCs and DACs on TSMC 28nm. The company differentiates itself through validated, silicon-proven IP, deep collaboration with customers and partners (e.g., LeddarTech, MegaChips), and a global design footprint (new Fort Collins design center). Its goal is to enable customers to build sophisticated, power-efficient, mixed-signal SoCs quickly by providing ready-to-license IP plus engineering services that fit their specific needs.

Company Size

51-200

Company Stage

Series A

Total Funding

$35M

Headquarters

Milpitas, California

Founded

2015

Simplify Jobs

Simplify's Take

What believers are saying

  • Secured over $35M Series A funding to lead AI data revolution signal processing.
  • Appointed Hinesh Shah VP Sales to accelerate revenue in AI, 5G/6G, automotive.
  • Joined Intel Foundry April 2024 for advanced nodes in radar and LiDAR applications.

What critics are saying

  • TSMC 3nm capacity prioritizes Apple, NVIDIA, delaying Omni's CPO AFE access.
  • Broadcom, Marvell commoditize AI optical interconnects, slashing IP licensing.
  • Broadcom or Analog Devices acquires Omni's IP portfolio within 18-36 months.

What makes Omni Design Technologies unique

  • Omni Design delivers ultra-low power Wideband Signal Processing IP for 3nm CPO AFEs.
  • Specializes in high-speed ADCs and DACs validated on TSMC 28nm for AI and 5G SoCs.
  • Partners with Aura for AI-native digital radar in ADAS and autonomous vehicles.

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Benefits

Company Equity

Performance Bonus

Company News

Business Wire
Feb 6th, 2026
Omni Design Technologies advances 200G-class co-packaged optics IP for AI data centres

Omni Design Technologies has announced advancements in its 200G-class Co-Packaged Optics analogue front-end intellectual property portfolio for AI infrastructure. The development includes a high-swing linear transmit driver and low-noise receive transimpedance amplifier using advanced 3nm process technology. The CPO AFE products address power and bandwidth challenges in data centres by positioning optical I/O closer to switch and compute packages, enabling higher density and lower energy consumption per bit. The technology supports 224Gb/s PAM4 throughput with programmable transfer functions for robust link performance. The advancement expands Omni Design's portfolio beyond ultra-high-speed data conversion, targeting both optical and electrical interconnects for AI data centres. The company, founded in 2015 and headquartered in Milpitas, California, specialises in wideband signal processing solutions for AI infrastructure and networking applications.

Yahoo Finance
Dec 18th, 2025
Omni Design Technologies Appoints Hinesh Shah as Vice President of Strategic Sales

Omni Design Technologies appoints Hinesh Shah as Vice President of Strategic Sales. Veteran semiconductor sales leader to accelerate global revenue growth and expand strategic customer partnerships across AI, data center, 5G/6G, satellite communication and automotive markets. MILPITAS, Calif., December 18, 2025-(BUSINESS WIRE)-Omni Design Technologies, a leading provider of high-performance, ultra-low power Wideband Signal Processing(TM) solutions, today announced the appointment of Hinesh Shah as Vice President of Strategic Sales. In this role, Shah will lead global sales strategy and execution, focusing on accelerating revenue growth, expanding strategic customer partnerships, and supporting increased demand across key markets. "We are thrilled to welcome Hinesh to the Omni Design leadership team as we execute our strategy to usher in the next phase of rapid growth for the company," said Dr. Kush Gulati, Co-founder, President, and CEO of Omni Design Technologies. "Hinesh's deep experience strategically growing revenue across a broad range of semiconductor technologies is critical as we scale the adoption of our high-performance, ultra-low power Wideband Signal Processing(TM) solutions." Hinesh Shah brings over 25 years of experience accelerating revenue growth and building high-performing sales organizations in the semiconductor industry. Shah previously held leadership positions at prominent semiconductor companies, such as Astera Labs, amsOSRAM, Maxim Integrated, SiTime, and Avago Technologies (now Broadcom). "Omni Design Technologies is a recognized leader in ultra-low power data conversion solutions, a foundation for the next wave of innovation in AI infrastructure, 5G/6G, space-based cellular networks and automotive ADAS (Advanced Driver Assistance Systems)," said Hinesh Shah, Vice President of Strategic Sales, Omni Design Technologies. "I am excited to join this dynamic team and leverage my experience to deepen customer partnerships and drive the strategic initiatives that will define the company's market leadership for years to come." Omni Design Technologies is expanding its team across engineering, product, and sales roles to accelerate innovation and support growing customer demand for its advanced analog and mixed-signal IP portfolio. Open positions can be found at www.omnidesigntech.com/company/careers. Visit Omni Design Technologies at CES 2026, January 6-9, in Las Vegas Omni Design Technologies experts will be onsite at CES 2026 to discuss how its high-performance low-power Wideband Signal Processing(TM) solutions are enabling next-generation AI, data center, 5G/6G, satellite communication, and automotive ADAS applications. To schedule a meeting, please contact [email protected].

Business Wire
Sep 18th, 2025
Omni Design Technologies Secures over $35 Million in Series A Funding to Advance Its Leadership in Wideband Signal Processing™ for the AI Data Revolution

Omni Design Technologies, a leader in Wideband Signal Processing™ solutions for the AI data revolution, today announced that it has successfully raised over ...

FinSMEs
Sep 17th, 2025
Omni Design Technologies Raises Over $35M in Series A Funding

Omni Design Technologies, a Milpitas, California-based leader in Wideband Signal Processing(TM) solutions for the AI data revolution, raised over $35m in Series A equity financing round.

Stock Titan
Sep 17th, 2025
Omni Design Secures $35M Series A Funding

Omni Design Technologies has secured over $35 million in Series A funding to enhance its leadership in Wideband Signal Processing™ for the AI data revolution.