Full-Time

Senior – Principal Engineer

Electrical Engineering, Controls and Hardware Design

ASM International

ASM International

1,001-5,000 employees

Semiconductor deposition equipment and ALD tech

No salary listed

Mt Laurel Township, NJ, USA

In Person

Category
Electrical Engineering (2)
,
Required Skills
PSpice
OrCAD
Requirements
  • Master’s degree or higher in Electrical Engineering, Computer Engineering, or a related engineering discipline
  • 10+ years of progressive experience designing embedded controls and hardware systems, with demonstrated technical leadership
  • Recognized expertise in embedded controls and control system design
  • Extensive experience with microprocessors and microcontroller‑based architectures
  • Advanced proficiency in analog, digital, and mixed‑signal circuit design and simulation
  • Strong hands‑on experience with electrical circuit simulation using OrCAD PSpice or similar tools
  • Proven ability to debug and resolve complex hardware‑level issues across analog, digital, and mixed‑signal systems
  • Deep experience designing electronic boards incorporating microcontrollers, ADCs, DACs, and supporting circuitry
  • Solid understanding of embedded systems environments and hardware/firmware interfaces
  • Expert use of oscilloscopes, logic analyzers, and electronic test equipment
  • Exceptional attention to detail, technical judgment, and documentation rigor
  • Proficiency with Microsoft Office applications
Responsibilities
  • Lead the architecture and design of embedded control hardware for semiconductor manufacturing equipment
  • Define and implement control system hardware strategies, standards, and best practices across programs
  • Design complex electronic systems incorporating microprocessors, microcontrollers, ADCs, DACs, and mixed‑signal circuitry
  • Own schematic capture, design integrity, and review using OrCAD Capture or equivalent EDA tools
  • Perform and review analog, digital, and mixed‑signal circuit simulation using OrCAD PSpice or similar tools
  • Lead hardware bring‑up, validation, and root‑cause analysis using oscilloscopes, logic analyzers, and advanced lab instrumentation
  • Troubleshoot complex system‑level issues at the hardware and controls interface, including analog, digital, and mixed‑signal domains
  • Partner closely with software, embedded firmware, mechanical, and systems engineers to ensure cohesive control system integration
  • Provide technical leadership through design reviews, mentoring, and cross‑functional collaboration
  • Guide prototype development, risk mitigation, and design trade‑offs across the full product lifecycle
  • Author and review high‑quality technical documentation, specifications, and design rationale
  • Occasional travel to support development, integration, or escalated technical investigations
Desired Qualifications
  • Experience writing embedded firmware or a strong working knowledge of embedded firmware development and debugging
  • Experience in the semiconductor manufacturing equipment industry (preferred, not required)
  • Control hardware experience for auto RF matching networks and/or RF generators
  • Experience with Texas Instruments Sitara processors
  • Experience with Analog Devices Blackfin processors
  • Experience with Xilinx Spartan FPGAs
  • Background in Electrical Engineering or Computer Engineering applied to complex, real‑time control systems

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company Size

1,001-5,000

Company Stage

IPO

Headquarters

Almere, Netherlands

Founded

1968

Simplify Jobs

Simplify's Take

What believers are saying

  • AI demand drives GAA, HBM investments, eighth year double-digit growth.
  • Axus acquisition expands compound semiconductors, 3D integration.
  • Q2 2026 revenue forecast €980M beats estimates on robust bookings.

What critics are saying

  • US export bans slash 20-30% China revenue from SMIC in 3-6 months.
  • Applied Materials erodes ALD share in GAA logic within 12-18 months.
  • Samsung, TSMC concentration drops 40% revenue if CapEx delays 6-12 months.

What makes ASM International unique

  • ASM pioneered ALD technology via 1999 Microchemistry acquisition.
  • ASM focuses on deposition for advanced logic, memory, power chips.
  • ASM spun off ASML in 1988 to specialize in epitaxy, ALD tools.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Flexible Work Hours

Remote Work Options

Paid Vacation

Paid Holidays

Wellness Program

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

0%

2 year growth

0%
Yahoo Finance
Mar 4th, 2026
ASM International completes Axus acquisition, launches buyback on AI demand

ASM International has completed its acquisition of Axus Technology, expanding into compound semiconductors and 3D integration, whilst announcing a new share buyback programme and proposed dividend increase. Management linked these actions to strong growth prospects driven by AI-related demand and opportunities in China's semiconductor equipment sector. Trading at approximately €682.60, ASM International has delivered a 23.3% return year to date and 46.7% over the past year. The company currently trades at a price-to-earnings ratio of 42.6 times, below the semiconductor industry average of 49.5 times, whilst maintaining a 23.9% net income margin. The acquisition and capital return plans signal management's focus on both business expansion and direct shareholder returns in the semiconductor equipment market.

Yahoo Finance
Jan 20th, 2026
ASM International beats Q4 with €800M bookings as China orders recover and Q1 outlook rises

ASM International reported preliminary Q4 2025 results with approximately €800 million in bookings and €698 million in revenue, exceeding earlier guidance. The semiconductor equipment maker benefited from recovering Chinese orders, strong advanced logic and foundry demand, and elevated services activity. The company raised its Q1 2026 revenue outlook on a constant-currency basis, suggesting strengthening near-term momentum. However, risks remain around China exposure and customer concentration. ASM's narrative projects €4.6 billion revenue and €1.1 billion earnings by 2028, requiring 12% annual revenue growth. Fair value estimates from the Simply Wall St Community range widely from €216 to €800 per share, reflecting divergent views on the company's prospects in atomic layer deposition and epitaxy tools for advanced semiconductor manufacturing.

KleverStock
Jul 2nd, 2025
ASM Raises RM21.82M on ACE Market

ASM Automation Group Berhad debuted on the ACE Market of Bursa Malaysia at 17 sen, matching its IPO price. The listing raised RM22 million, with RM11.4 million for a new factory, RM2.3 million for machinery, RM2 million for design and development, RM1.92 million for working capital, and RM4.2 million for listing expenses. Managing director Chan Kok Heng highlighted the listing as a milestone, enabling ASM to enhance its innovation and market position in industrial automation.

Utusan Malaysia
Apr 16th, 2025
ASM Signs IPO Underwriting with M&A Securities

ASM Automation Group Berhad has signed an underwriting agreement with M & A Securities for its IPO on the ACE Market of Bursa Malaysia, approved on February 20, 2025. The IPO includes a public issuance of 128.34 million new shares, representing 24% of the enlarged share capital of 534.77 million shares, and an offer for sale of 53.48 million existing shares, 10% of the enlarged share capital. M & A Securities will underwrite 37.44 million shares, with the remainder allocated to selected investors and Bumiputera.

American Society for Microbiology
Mar 27th, 2025
ASM announces the availability of the 2025 AGM materials

ASM announces the availability of the 2025 AGM materials.