Summer 2026

Electronic Materials and Devices Engineer Intern

Updated on 7/22/2026

Pennsylvania State University

Pennsylvania State University

No salary listed

No H1B Sponsorship

State College, PA, USA

In Person

On-site internship at University Park campus; no remote work.

US Citizenship Required

Category
Electrical Engineering (1)
Required Skills
CAD

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Requirements
  • You will be subject to a government security investigation, and you must be a U.S. citizen to apply.
  • Employment with the ARL will require successful completion of a pre-employment drug screen.
  • Employment with the University will require successful completion of background check(s) in accordance with University policies.
Responsibilities
  • Substrate fabricating, including cutting, dicing, grinding, lapping, and polishing
  • Materials characterization, including microscopy, spectroscopy, and surface profiling
  • Electrical characterization
  • Mechanical and environmental testing
  • Furnace recipe development, loading, unloading, and profiling
  • Ceramic processing, including preparing slurries, tape casting, electroding, and sintering
  • Additive manufacturing / 3D printing, including CAD modelling, preparing slurries/inks, and running printers with a focus on electronics applications
Desired Qualifications
  • Materials Science and Engineering (MatSE)
  • Electrical Engineering (EE)
  • Mechanical Engineering (ME)
  • Chemical Engineering (ChemE)
Pennsylvania State University

Pennsylvania State University

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