Full-Time
Principal Applications Engineer
Omni Design Technologies
51-200 employees
Licenses high-performance IP cores for SoCs
No salary listed
Milpitas, CA, USA
In Person
 Sales & Solution Engineering (1) |
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- Solid understanding of integrated circuit design technology and analog design.
- Experience in high-performance mixed-signal design in advanced CMOS processes.
- Familiarity with high-speed, high-resolution analog-to-digital (ADC) or digital-to-analog (DAC) data converters and their use in leading edge designs.
- Experience in conducting technical presentations and training, as well as product demos to customers, including development of customized presentations and other collateral.
- Must possess strong written and verbal communication skills with an ability to work with teams spread across geographic locations.
- Must have ability to work independently and productively with high quality output and results in a fast paced and dynamic environment.
- Should be able to seek help proactively as well as share knowledge.
- Assist customers in adopting Omni Design IP through training & demos, presentations, solving technical issues and leading technical engagements
- Understanding of customer’s analog and mixed-signal design challenges, especially at advanced process nodes, and guiding them in refining their requirements and successfully integrating Omni Design IP in their products.
- Work with Sales to identify new opportunities, prioritize them and develop winning sales strategies.
- Communicate customer requirements and feedback to marketing and engineering for issue resolution and to improve product features and quality.
- Help the team in managing customer priorities and trade-offs.
Omni Design Technologies delivers high-performance, ultra-low power IP cores for mixed-signal SoCs that power devices across 5G, LiDAR, automotive networks, AI, image sensing, and IoT. It develops and validates IP blocks and licenses them to chip makers, offering customization and support to ensure seamless integration into customer designs. The cores are designed to work on FinFET processes down to 28nm, with proven silicon such as gigasample low-power ADCs and DACs on TSMC 28nm. The company differentiates itself through validated, silicon-proven IP, deep collaboration with customers and partners (e.g., LeddarTech, MegaChips), and a global design footprint (new Fort Collins design center). Its goal is to enable customers to build sophisticated, power-efficient, mixed-signal SoCs quickly by providing ready-to-license IP plus engineering services that fit their specific needs.
Company Size
51-200
Company Stage
Series A
Total Funding
$35M
Headquarters
Milpitas, California
Founded
2015
Simplify's Take
What believers are saying
- Secured over $35M Series A funding to lead AI data revolution signal processing.
- Appointed Hinesh Shah VP Sales to accelerate revenue in AI, 5G/6G, automotive.
- Joined Intel Foundry April 2024 for advanced nodes in radar and LiDAR applications.
What critics are saying
- TSMC 3nm capacity prioritizes Apple, NVIDIA, delaying Omni's CPO AFE access.
- Broadcom, Marvell commoditize AI optical interconnects, slashing IP licensing.
- Broadcom or Analog Devices acquires Omni's IP portfolio within 18-36 months.
What makes Omni Design Technologies unique
- Omni Design delivers ultra-low power Wideband Signal Processing IP for 3nm CPO AFEs.
- Specializes in high-speed ADCs and DACs validated on TSMC 28nm for AI and 5G SoCs.
- Partners with Aura for AI-native digital radar in ADAS and autonomous vehicles.
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Company News
Omni Design Technologies has announced advancements in its 200G-class Co-Packaged Optics analogue front-end intellectual property portfolio for AI infrastructure. The development includes a high-swing linear transmit driver and low-noise receive transimpedance amplifier using advanced 3nm process technology. The CPO AFE products address power and bandwidth challenges in data centres by positioning optical I/O closer to switch and compute packages, enabling higher density and lower energy consumption per bit. The technology supports 224Gb/s PAM4 throughput with programmable transfer functions for robust link performance. The advancement expands Omni Design's portfolio beyond ultra-high-speed data conversion, targeting both optical and electrical interconnects for AI data centres. The company, founded in 2015 and headquartered in Milpitas, California, specialises in wideband signal processing solutions for AI infrastructure and networking applications.
Omni Design Technologies appoints Hinesh Shah as Vice President of Strategic Sales. Veteran semiconductor sales leader to accelerate global revenue growth and expand strategic customer partnerships across AI, data center, 5G/6G, satellite communication and automotive markets. MILPITAS, Calif., December 18, 2025-(BUSINESS WIRE)-Omni Design Technologies, a leading provider of high-performance, ultra-low power Wideband Signal Processing(TM) solutions, today announced the appointment of Hinesh Shah as Vice President of Strategic Sales. In this role, Shah will lead global sales strategy and execution, focusing on accelerating revenue growth, expanding strategic customer partnerships, and supporting increased demand across key markets. "We are thrilled to welcome Hinesh to the Omni Design leadership team as we execute our strategy to usher in the next phase of rapid growth for the company," said Dr. Kush Gulati, Co-founder, President, and CEO of Omni Design Technologies. "Hinesh's deep experience strategically growing revenue across a broad range of semiconductor technologies is critical as we scale the adoption of our high-performance, ultra-low power Wideband Signal Processing(TM) solutions." Hinesh Shah brings over 25 years of experience accelerating revenue growth and building high-performing sales organizations in the semiconductor industry. Shah previously held leadership positions at prominent semiconductor companies, such as Astera Labs, amsOSRAM, Maxim Integrated, SiTime, and Avago Technologies (now Broadcom). "Omni Design Technologies is a recognized leader in ultra-low power data conversion solutions, a foundation for the next wave of innovation in AI infrastructure, 5G/6G, space-based cellular networks and automotive ADAS (Advanced Driver Assistance Systems)," said Hinesh Shah, Vice President of Strategic Sales, Omni Design Technologies. "I am excited to join this dynamic team and leverage my experience to deepen customer partnerships and drive the strategic initiatives that will define the company's market leadership for years to come." Omni Design Technologies is expanding its team across engineering, product, and sales roles to accelerate innovation and support growing customer demand for its advanced analog and mixed-signal IP portfolio. Open positions can be found at www.omnidesigntech.com/company/careers. Visit Omni Design Technologies at CES 2026, January 6-9, in Las Vegas Omni Design Technologies experts will be onsite at CES 2026 to discuss how its high-performance low-power Wideband Signal Processing(TM) solutions are enabling next-generation AI, data center, 5G/6G, satellite communication, and automotive ADAS applications. To schedule a meeting, please contact [email protected].
Omni Design Technologies, a leader in Wideband Signal Processing™ solutions for the AI data revolution, today announced that it has successfully raised over ...
Omni Design Technologies, a Milpitas, California-based leader in Wideband Signal Processing(TM) solutions for the AI data revolution, raised over $35m in Series A equity financing round.
Omni Design Technologies has secured over $35 million in Series A funding to enhance its leadership in Wideband Signal Processing™ for the AI data revolution.