Full-Time

AI/ML Software Engineer New Grad

Posted on 8/19/2026

GlobalFoundries

GlobalFoundries

10,001+ employees

Semiconductor foundry delivering specialized chips

Compensation Overview

$86k - $148k/yr

Company Does Not Provide H1B Sponsorship

Austin, TX, USA + 2 more

More locations: Santa Clara, CA, USA | Richardson, TX, USA

In Person

The role is 100% in-office in Dallas, Austin, or San Jose; up to 10% travel is required.

Bachelor's, Master's

Category
Software Engineering (1)
Required Skills
Machine Learning

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Requirements
  • A Bachelor of Science or Master of Science degree in Electrical Engineering, Computer Engineering, Computer Science, or an equivalent field.
  • Expertise in open-source software and central processing unit and system-on-chip architecture, including memory hierarchies, out-of-order execution, vector or single-instruction, multiple-data pipelines, and power management.
  • Basic understanding of system-level memory bandwidth constraints, including DDR and LPDDR bandwidth, latency, and utilization efficiency, with the ability to reason quantitatively about memory-bound and compute-bound workloads.
  • Knowledge of artificial intelligence and machine learning acceleration on edge devices, including neural processing units, dedicated inference accelerators, and digital signal processor-based pipelines.
  • Familiarity with model quantization, sparsity, or other efficiency techniques and their interaction with hardware.
  • Familiarity with artificial intelligence compiler infrastructure, including MLIR-based toolchains, IREE, TVM, TensorFlow Lite, or equivalent.
  • Understanding of how graph representations are transformed, tiled, scheduled, and lowered to hardware.
  • Ability to contribute to technical consensus, write clearly, and calibrate technical depth for different audiences.
  • English fluency in written and verbal communication.
  • United States work authorization.
  • Ability to work 100% in-office in Dallas, Austin, or San Jose.
Responsibilities
  • Execute workload characterization and hardware performance analysis for artificial intelligence and machine learning systems by selecting representative workloads, defining measurement methodology, building support for MIPS products such as the S8200, and projecting system-level key performance indicators.
  • Inform system-on-chip architecture decisions, memory subsystem design, and hardware/software co-optimization strategy through workload analysis.
  • Define software frameworks across the product portfolio, including relevant metrics, accurate measurement methods, pre-silicon estimation, and architectural decision criteria.
  • Leverage and contribute to open-source infrastructure such as MLIR and IREE to implement and validate workload analysis and performance frameworks.
  • Represent software in architectural discussions with hardware teams covering central processing units, system-on-chip designs, memory, and interconnects, as well as software teams covering compilers, runtimes, and machine learning frameworks.
  • Identify critical bottlenecks, including compute throughput, DRAM bandwidth, on-chip memory, data movement latency, and software overhead, and build the case for architectural changes or optimization investments.
  • Present findings and recommendations to senior engineering leadership and product stakeholders through concise architectural recommendations and detailed technical memoranda.
  • Perform activities safely and responsibly and support Environmental, Health, Safety, and Security requirements and programs.
Desired Qualifications
  • Prior contributions to AI compiler toolchains are a significant differentiator.
  • Knowledge of central processing unit hardware features such as AVX, NEON, RVV, AMX, and SME vector or matrix extensions.
  • Knowledge of system-on-chip architecture requirements derived from workload analysis.
  • Contributions to graph lowering in MLIR, IREE, or similar compiler infrastructure.
  • Internal or external publications or contributions to technical standards.
  • Knowledge of RISC-V architecture and vector or matrix extensions.

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify Jobs

Simplify's Take

What believers are saying

  • July 2026 CHIPS Act LOI brings GF $300 million for AI optics research.
  • Q2 2026 communications and data-center revenue jumped 62%, led by silicon photonics.
  • Synopsys ARC and Photeon IVR acquisitions should add $100 million-plus in 2026 services revenue.

What critics are saying

  • Smart mobile was 36% of revenue; memory pricing pressure cuts 2026 demand.
  • IBM’s revived $2.5 billion fraud suit keeps leadership distracted through 2026.
  • Tower Semiconductor litigation can backfire if GF loses, weakening patent leverage.

What makes GlobalFoundries unique

  • GF leads specialty nodes: silicon photonics, RF-SOI, SiGe, and FDX manufacturing.
  • Its Malta, Dresden, and Singapore fabs give customers geopolitical diversification.
  • MIPS plus Synopsys ARC creates software-to-silicon depth for Physical AI customers.

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Benefits

Professional Development Budget

Growth & Insights and Company News

Headcount

6 month growth

-2%

1 year growth

-1%

2 year growth

-1%
Yahoo Finance
Aug 11th, 2026
GlobalFoundries stock swings as tiny 16% segment drives 62% growth

GLOBALFOUNDRIES shares fell 7.2% on Monday to $50.05, despite beating June-quarter revenue estimates and raising its outlook for its fastest-growing segment. The semiconductor foundry's communications infrastructure and data centre market grew 62% year-over-year, driven by demand for silicon photonics and silicon germanium chips used in optical networking equipment. However, this high-growth segment represents only 16% of total revenue, approximately $290 million of the $1.786 billion reported for the quarter. Meanwhile, the company's largest segment, smart mobile devices at 36% of revenue, is expected to decline by a low-teens percentage in 2026 due to memory pricing pressures. Overall company revenue grew just 6% year-over-year. The foundry said it is oversubscribed on silicon germanium capacity through 2027 and is expanding within existing facilities. The stock has shown significant volatility, moving in different directions across four trading sessions following the earnings report.

Yahoo Finance
Aug 5th, 2026
GlobalFoundries raises data-centre growth outlook to 60% as Q2 revenue hits $1.79B

GlobalFoundries reported second-quarter fiscal 2026 revenue of $1.786 billion, up 9% sequentially and 6% year over year. Non-IFRS gross margin expanded to 29.9%, whilst diluted earnings reached $0.46 per share. Communications infrastructure and data-centre revenue surged 62% year over year, driven by silicon photonics and silicon-germanium demand. The company raised its full-year outlook for this segment to 50–60% growth, up from the high-30% range previously expected. Silicon photonics revenue is now projected to more than double in 2026. The firm guided third-quarter revenue of $1.885 billion and earnings per share of $0.51, plus or minus $0.05. GlobalFoundries completed acquisitions of Synopsys' ARC Processor IP Solutions and Photeon Technologies' custom power team, expecting these to contribute $100 million to $120 million in technology-services revenue for 2026.

The Business Journals
Jul 29th, 2026
GlobalFoundries awarded $300M in additional CHIPS Act funds for AI infrastructure research

GlobalFoundries will receive $300 million in US government funding to support research for technology used in artificial intelligence infrastructure. The semiconductor manufacturer's award comes through the CHIPS Act programme. The funding will help develop advanced semiconductor technologies needed for AI systems and related infrastructure.

Yahoo Finance
Jul 11th, 2026
GlobalFoundries exec sells 78% of shares after stock surges 70% in a year

GlobalFoundries Chief Strategy Officer Michael James Hogan sold 2,700 ordinary shares and gifted 100 shares on 8 and 9 July 2026, according to an SEC filing. The transactions reduced his direct shareholding by 78%, leaving him with 795 shares. The sales were executed at $66.83 per share under a pre-arranged Rule 10b5-1 plan. The dispositions occurred after GlobalFoundries shares delivered a 70% one-year return as of 9 July 2026. GlobalFoundries operates as a global semiconductor foundry, manufacturing integrated circuits for telecommunications, automotive, industrial, consumer electronics, and computing sectors. The company reported trailing twelve-month revenue of $6.8 billion and net income of $778 million, with a market capitalisation of $38.2 billion.

Associated Press
Jun 23rd, 2026
GlobalFoundries qualifies SLATE 3D packaging on 9SW RF-SOI platform, cutting die size up to 45%

GlobalFoundries has qualified its SLATE wafer-to-wafer bonding technology on the 9SW radio-frequency silicon-on-insulator platform for production, with volume manufacturing expected in the second half of 2027. The technology enables 3D integration for cellular front-ends, reducing die size by up to 45% for space-constrained mobile applications. Manufactured at GF's 300mm Singapore facility, SLATE allows designers to bond two 9SW wafers and stack large field-effect transistors vertically. The technology supports applications including switches, low-noise amplifiers and antenna tuners in 5G mobile devices and satellite communications. The 9SW platform, introduced in 2023, delivers over 20% efficiency enhancement whilst reducing standby currents for longer battery life. An integrated process design kit is available through GF Connect, with prototyping accessible via GlobalShuttle multi-project wafer programme.