Full-Time
Staff Engineer
DRAM Field Application
SK hynix
5,001-10,000 employees
Compensation Overview
$140k - $180k/yr
San Jose, CA, USA
In Person
Authorized to work in the US.
 Sales & Solution Engineering (2) |
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- A bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field is required.
- Ten to fifteen years of experience in Field Application Engineering, customer technical support, or semiconductor/memory-related roles is required.
- A strong working knowledge of DRAM products, memory architecture, and DRAM operation principles is required.
- Proven experience managing complex customer qualifications, system-level debugging, and technical issue resolution is required.
- Excellent analytical, problem-solving, and decision-making skills are required.
- Strong communication skills with the ability to explain complex technical concepts to customers and internal stakeholders are required.
- Authorized to work in the United States is required.
- Serve as the primary senior technical interface for key customers, providing expert guidance on DRAM products, system integration, and issue resolution.
- Master’s degree in a relevant technical field.
- Extensive experience in the semiconductor industry, preferably DRAM or memory products.
- Hands-on experience with DRAM quality management, reliability, and failure analysis processes.
- Experience leading major customer accounts or strategic programs.
- Strong presentation and documentation skills.
- Fluent bilingual communication in English and Korean, with experience working in global, customer-facing environments.
Company Size
5,001-10,000
Company Stage
IPO
Headquarters
Seoul, South Korea
Founded
1983
Simplify's Take
What believers are saying
- Yongin project groundbreaking in early 2025 adds four AI-optimized fabs by 2027.
- P&T7 plant starts construction April 2026 for HBM mass production by 2028.
- Big tech firms finance expansions securing dedicated AI memory capacity through 2027.
What critics are saying
- Samsung qualifies HBM4 by 2027 eroding SK Hynix's 70% supply share.
- Customer-financed lines lock production flexibility starting Q3 2026.
- 77 trillion KRW capex through 2030 triggers refinancing crisis if AI demand softens in 2028.
What makes SK hynix unique
- SK Hynix controls 70% of HBM4 supply for Nvidia's Vera Rubin platform.
- HBM3E breakthrough in 2024 anchors AI infrastructure leadership.
- 57% global HBM market share by revenue as of Q4 2025.
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Your Connections
People at SK hynix who can refer or advise you
Benefits
Health Insurance
Paid Vacation
Paid Holidays
Paid Parental Leave
401(k) Company Match
Educational reimbursement
Donation Matching and volunteering opportunities
Corporate discount programs
Health Insurance
Paid day offs: PTO + Company Holidays + Happy Fridays
Company News
Manufacturers have started developing DDR6 RAM with an eye on 2028. By Daniel Whitaker Game Journalist at 7GrandSteps | Reviews and Gameplay Articles Last updated: May 05, 2026 Samsung, SK hynix, and Micron - the biggest names in memory - have quietly started work on DDR6 standardization. JEDEC hasn't signed off on final specs yet, but companies are already coordinating with substrate suppliers to get test samples out the door. The initial clocking target is 8,800 MT/s (roughly on par with top DDR5 modules), with a roadmap that hopes to push toward 17,600 MT/s later on. To keep signals usable at those rates, the proposed physical approach shifts from DDR5's 2x32-bit lanes to a 4x24-bit arrangement, i.e., narrower lanes but more parallel channels. Classic DIMM connectors create real physical limits, so the supply chain is looking to CAMM2 as a form factor that preserves signal paths better - whether it becomes dominant depends on board-level adoption and vendor buy-in. Expect early customer validations in 2027; broader commercialization and mass shipments are penciled in for 2028-2029, primarily aimed at AI DCs (AI data centers). That timeline still assumes a lot of integration work (PHY IP, thermal behavior, supply logistics, etc.), so consider these dates provisional rather than carved in stone.
SK Hynix is accelerating investment in its US NAND flash subsidiary Solidigm as AI-driven demand for storage grows. The company has deployed over $100 million to its Sacramento research and development centre, completing its five-year investment target 18 months ahead of schedule. Solidigm, acquired from Intel in 2020 for approximately $9 billion, posted its first annual profit in 2024 after three years of losses. The turnaround comes as AI datacentres drive surging demand for enterprise solid-state drives, Solidigm's main product. NAND prices have risen for 15 consecutive months, reaching record highs. SK Hynix has climbed to second place in the SSD market through Solidigm. The company recently opened an office in San Jose to strengthen collaboration with major technology clients including Nvidia, Apple and Google.
SK hynix has invested in Semidynamics to co-develop memory-centric AI infrastructure optimised for data movement and access efficiency in large language models and AI inference applications. The partnership aims to align memory technologies with AI processing demands to improve performance and scalability. However, the company faces a US International Trade Commission investigation launched on 26 March 2026 into alleged patent infringement involving certain NAND and DRAM memory chips. The probe, following a complaint by MonolithIC 3D Inc., could affect SK hynix's access to the US market. Investors are evaluating the long-term benefits of the AI infrastructure partnership against near-term regulatory and intellectual property uncertainties. The ITC has not yet determined the investigation's merits.
SK hynix has developed new high-capacity AI computer drives and will begin supplying Dell Technologies in April as its first global IT enterprise partner. The memory chipmaker is offering 1TB and 2TB versions using 321-layer QLC NAND technology, which stores four bits per cell to increase capacity. The technology delivers up to 56% faster writes and over 23% better write power efficiency compared with previous generations. IDC expects QLC NAND to comprise 61% of the global PC and notebook SSD market by 2027, up from 22% last year. SK hynix plans to extend 321-layer NAND to enterprise SSDs for data centres and Universal Flash Storage for smartphones. The company is pursuing petabyte-scale SSDs that could replace hard disk drives for storing large AI datasets.
Semidynamics, a Barcelona-based advanced computing company, has secured a strategic investment from SK hynix to develop memory-centric AI inference chips. The investment reflects a shared belief that memory architecture, rather than compute power alone, will determine the economics of next-generation AI inference. The company is building AI infrastructure designed to address memory bottlenecks that constrain current systems. Its proprietary Gazzillion technology enables significantly greater memory capacity than conventional HBM-based systems, supporting larger models and contexts whilst reducing cost per token. Semidynamics recently completed a 3nm silicon tape-out with TSMC, marking a significant milestone for a European semiconductor company. The partnership will explore co-optimising Semidynamics' architecture with next-generation memory technologies. The company has raised €45 million in non-dilutive funding from European innovation programmes and employs over 150 engineers.