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Principal IC Packaging Engineer
Silicon Technology, Starlink
Confirmed live in the last 24 hours
West Athens, CA, USA
Experience Level
  • Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other applied engineering discipline
  • 7+ years of professional experience in semiconductor assembly and packaging
  • 10+ years industry experience with microelectronics packaging development and production
  • Advanced technical degree
  • Product lifecycle experience from design to production
  • 2D, 2.5D, and/or 3D packaging integration experience
  • Expert in packaging technologies such as BGA, fcCSP, WLCSP, system-in-package SiP, through-silicon-via TSV, through-glass-via TGV, wirebond, AiP, AoP, and/or SoC
  • Solder ball, Cu pillar, hybrid, thermocompression, and novel bonding techniques
  • Deep packaging materials, reliability, and chip package (CPI) experience
  • Semiconductor or silicon wafer processing experience a plus
  • OSAT (outsource semiconductor assembly and test) experience a plus
  • To conform to U.S. Government space technology export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here
  • High-level technical oversight across all Starlink packaging technology and development
  • Drive best-in-class packaging products and module development roadmaps
  • Interface with silicon design teams, supply chain, and vendors (foundries, substrate suppliers, OSATs) for product definition
  • Develop new technologies and establish baselines for assembly and packaging including SMT, flip chip, bonding, molding, underfill, dispense, EMI shielding, lid, and solder ball attach
  • Develop new technologies and establish baselines for wafer level bumping including photolithography, etch, physical vapor deposition (PVD), electroplating, and metrology steps
  • Oversee new product introduction (NPI) and new technology introduction (NTI) for wafer bumping and assembly packaging lines
  • Material and equipment selection to meet quality, reliability, cost, yield, and production targets
  • Cross-functional interface with IC design, materials, thermal, systems, and production teams
  • Implement advanced packaging solutions into SpaceX next generation products

10,001+ employees

Designs, manufactures, & launches rockets and spacecrafts
Company Overview
SpaceX's mission is to make humanity multiplanetary. The company is working on a next generation of fully reusable launch vehicles that will be the most powerful ever built, capable of carrying humans to Mars and other destinations in the solar system.
  • Benefits and Perks - Our employees’ well-being is important to us and essential to our capacity to do extraordinary things. We offer a wide variety of programs to support the health, wellness, and financial security of our employees and their families.
Company Core Values
  • Make History - SpaceX has gained worldwide attention for a series of historic milestones. It is the only private company capable of returning a spacecraft from low-Earth orbit, and in 2012 our Dragon spacecraft became the first commercial spacecraft to deliver cargo to and from the International Space Station. And in 2020, SpaceX became the first private company to take humans there as well.
  • Reusability - SpaceX believes a fully and rapidly reusable rocket is the pivotal breakthrough needed to substantially reduce the cost of space access. The majority of the launch cost comes from building the rocket, which historically has flown only once.
  • Landing - SpaceX’s family of Falcon launch vehicles are the first and only orbital class rockets capable of reflight. Depending on the performance required for the mission, Falcon lands on one of our autonomous spaceport droneships out on the ocean or one of our landing zones near our launch pads.