Full-Time

Senior or Principal Technical Program Manager

University of Texas at Austin

University of Texas at Austin

No salary listed

Company Does Not Provide H1B Sponsorship

Austin, TX, USA

Hybrid

Hybrid work arrangements may be possible; travel up to 30–50% as needed.

Category
Business & Strategy (1)
Requirements
  • BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
  • Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, redistribution layer/interposer technologies) and heterogeneous integration techniques. You have direct experience developing or managing cutting-edge packaging solutions and understand the nuances of modeling, simulation, and reliability across electrical, thermal, and mechanical domains.
  • Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK creation and integration with major EDA vendor flows. You can effectively interface with process engineers and EDA teams, ensuring packaging solutions integrate smoothly with design and manufacturing workflows.
  • Exceptional communication skills. You know how to simplify the complex, create clear deliverables, and build trust with both technical and business stakeholders. You excel at translating between engineering and market/customer contexts.
  • Startup DNA. You’re energized by ambiguity, act with urgency, and take ownership of outcomes. You thrive in a fast-paced, dynamic environment and aren’t afraid to wear many hats to get the job done.
  • Execution mindset. You have demonstrated experience driving progress across multiple initiatives in a hands-on role, without the need for layers of management. You plan, execute, and deliver—reliably and proactively.
  • Relevant education and experience may be substituted as appropriate.
Responsibilities
  • Lead the planning, execution, and delivery of cross-disciplinary programs supporting TIE’s advanced microsystems roadmap.
  • Develop and manage program scopes, schedules, budgets, and risk mitigation plans to ensure predictable delivery across engineering and manufacturing teams.
  • Coordinate efforts across internal research and development, process development, design automation, and partner organizations to align execution with technology and business objectives.
  • Serve as the central liaison between TIE’s technical teams, university researchers, and external stakeholders—including Department of Defense partners, national labs, and commercial collaborators.
  • Drive metrics-based accountability and communication across all program tracks to ensure transparency and stakeholder confidence.
  • Identify dependencies, anticipate bottlenecks, and proactively resolve issues to maintain momentum in a fast-moving environment.
  • Support the generation of technical documentation, customer deliverables, and integration roadmaps that communicate progress and align with contract requirements.
  • Monitor industry trends in advanced packaging, 3D heterogeneous integration, and chiplet-based architectures, informing program direction and partnership strategy.
  • Other related functions as assigned.
Desired Qualifications
  • MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field.
  • Proven program management chops – end-to-end ownership of complex programs involving multiple customer or partner stakeholders.
  • Experience working directly with subcontractors, vendors, or external partners to define clear expectations, manage deliverables, and hold teams accountable to milestones.
  • Prior experience at a leading semiconductor foundry or packaging house.
University of Texas at Austin

University of Texas at Austin

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