Full-Time

Analog IC Design Engineer

Semtech

Semtech

1,001-5,000 employees

Semiconductors, IoT systems, and cloud connectivity

No salary listed

Dartford District, UK

Hybrid

Hybrid role; in-office Mon-Thu.

Bachelor's, Master's

Category
Hardware Engineering (1)

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Requirements
  • Bachelor’s degree in Electrical Engineering or related technical discipline required
  • 0–2 years of relevant industry experience in Analog IC design required
  • Strong understanding of CMOS/BiCMOS analog circuit design principles and semiconductor device physics
  • Good technical grounding in circuit theory, device behaviour, and design trade-offs (performance, power, area)
  • Experience using Cadence design and simulation tools
  • Strong written and verbal communication skills in English
Responsibilities
  • Work closely with the Design Lead to support chip development and take ownership of key analogue subsystems within larger IC programmes (20%)
  • Deliver circuit and block-level analogue designs that meet performance, power, area, and reliability specifications defined by Product Definition and Marketing teams (20%)
  • Collaborate closely with Layout Engineering teams to ensure post-layout performance alignment, including parasitic awareness and design optimisation (15%)
  • Support end-to-end verification activities, ensuring simulated performance correlates with lab measurements during validation and bring-up phases (10%)
  • Work cross-functionally with Marketing, Product Definition, Test, Verification, Reliability, and Product Engineering teams to ensure design alignment with system requirements (10%)
  • Contribute to innovative circuit solutions and continuous improvement of analogue design methodologies and architectures (10%)
  • Communicate and present technical work clearly and effectively to internal engineering teams and wider project stakeholders (10%)
  • Support design reviews and contribute to technical discussions, ensuring high-quality engineering outputs and adherence to programme schedules (5%)
Desired Qualifications
  • Master’s degree (MSc) or specialised analog IC design training preferred
  • Exposure to RF / high-speed analog design (10GHz+) preferred
  • Experience with Laser Driver and/or TIA circuit design preferred
  • Understanding of RF/analog layout principles including floorplanning, parasitics, matching, ESD, crosstalk, and IR drop
  • Exposure to high-frequency passive design (e.g. inductors, T-coils) and 3D modelling techniques
  • Knowledge of device modelling (Verilog-AMS, SystemVerilog or equivalent)
  • Understanding of DFM, yield optimisation, and semiconductor reliability principles

Semtech makes high-performance semiconductors, IoT systems, and cloud connectivity for telecom, environmental monitoring, and audiovisual markets. Its XR60 5G Router Solution combines 5G and Wi-Fi 6 in a compact, durable device for demanding environments. LoRa enables wide IoT deployments for decarbonization and efficient data collection, while BlueRiver uses AV over IP chipsets to transmit uncompressed 4K HDR video with zero latency over standard Ethernet (SDVoE). The company earns from selling hardware, software, and connectivity services, differentiating itself with an integrated mix of semiconductors, LoRa IoT, and SDVoE video networking to serve niche networking, sustainability, and professional video needs, with a goal to enable reliable connectivity, monitor environments, and accelerate decarbonization and digital transformation.

Company Size

1,001-5,000

Company Stage

IPO

Headquarters

Camarillo, California

Founded

1960

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Simplify Jobs

Simplify's Take

What believers are saying

  • Fiscal Q2 2027 revenue hit $341.9 million; data-center revenue reached $100 million.
  • August 13, 2026 cellular-module sale to Compal adds margin and focus.
  • LoRa-enabled revenue hit a record $58 million, with 65% Q3 growth guidance.

What critics are saying

  • CopperEdge securities class action in California reached class certification on May 20, 2026.
  • Semtech still depends on hyperscalers adopting 1.6T and 3.2T optical ramps by 2027.
  • If AI optics disappoint, Semtech’s growth concentrates in LoRa and shrinks after cellular divestiture.

What makes Semtech unique

  • Semtech’s September 9, 2026 224G TIAs target NPO and CPO optics.
  • LoRa Plus still anchors a broad installed base across industrial IoT.
  • Semtech’s September 8, 2026 triple-gen PON chipset simplifies GPON, XGS-PON, and 50G PON.

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Benefits

Hybrid Work Options

Flexible Work Hours

Company News

Associated Press
Sep 16th, 2026
Semtech launches TDS2621LP surge protector for collaborative robots with 1.6mm² footprint

Semtech Corporation has launched the TDS2621LP, a new addition to its SurgeSwitch family designed to protect industrial robotics and collaborative robots from power surges and electrostatic discharge. The device is purpose-built for 24 V DC power buses in automated manufacturing environments. The TDS2621LP offers a 1.6 mm² footprint, replacing larger conventional protection devices whilst providing IEC 61000-4-5 surge compliance. It delivers a maximum clamping voltage of 35 V at 24 A peak pulse current, with a dynamic resistance of just 32 mΩ. Target applications include cobot electronics, industrial robot input line protection, autonomous mobile robots, and PLC I/O modules. The product is available now in production quantities through Semtech's authorised distribution partners and directly on semtech.com.

WPGX Fox 28
Sep 9th, 2026
Semtech sets bar for 224G optical connectivity.

Semtech sets bar for 224G optical connectivity. * 1 hr ago Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things ("IoT") devices worldwide, today introduced a family of 224G linear Transimpedance Amplifier (TIA) and driver solutions, designed to accelerate the deployment of Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) architectures for AI/ML clusters, hyperscale data centers and next-generation networking platforms. Semtech's new 224G linear TIA and driver portfolio - the GN1838L, GN42T380 and GN42M380 - is designed to accelerate NPO and CPO architectures for AI/ML clusters and hyperscale data centers. As AI workloads continue to drive unprecedented demand for bandwidth and connectivity, traditional optical architectures face increasing challenges in power consumption, thermal management, signal integrity, and system density. By bringing high-performance optical interfaces closer to the switching and compute silicon, NPO and CPO architectures offer a path toward significantly higher bandwidth density and improved system-level efficiency. "Near-packaged and co-packaged optics are entering their initial ramp in 2026, and the shift toward NPO and CPO architectures reflects a broader industry response to the power and scaling bottlenecks facing AI back-end networks," said Sameh Boujelbene, vice president, data center switch and AI networks market research at Dell'Oro Group. "As hyperscalers move these architectures from trials to deployment, the underlying TIA and driver technology becomes a critical enabler of that transition." Designed for 224G Linear Optical Architectures Semtech's new products include the GN1838L and GN42T380, the industry's first linear octal TIAs, and the GN42M380 linear octal Mach-Zehnder Modulator (MZM) driver, optimized for 1.6T, 3.2T, 6.4T, and 12.8T optical engines (OEs). The 224G TIA and driver portfolio optimizes for CEI-224G-Linear and Open CPX interfaces and linear architectures, with very strictly specified space and power dissipation requirements. "AI infrastructure is fundamentally changing the requirements for optical connectivity," said Amit Thakar, vice president, signal integrity product marketing at Semtech. "At 224G per lane, designers need more than bandwidth. They need signal integrity, power efficiency, flexibility, and system-level visibility. Our TIAs and driver solutions are purpose-built to give NPO and CPO developers the building blocks to scale optical I/O while addressing the power and density challenges of next-generation AI systems." Enabling NPO and CPO at Scale The GN1838L TIA offers 500μm channel pitch and the GN42T380 offers a 375μm channel pitch, giving customers flexibility in OE design choices. These TIAs can be used in side-by-side configuration with the photonics integrated circuit (PIC) or placed directly on top of the PIC, giving customers maximum flexibility. Both TIAs include an Automatic Gain Control (AGC) stage and output driver featuring programmable Continuous Time Linear Equalization (CTLE) and support both Manual and Automatic Gain Control (MGC and AGC) modes. The bandwidth is optimized to achieve low peaking, low input referred noise (IRN), and good group delay with minimal distortion. The devices offer several programmable performance optimization features, including output equalization, and are designed to interface with a wide variety of optical input signals, while optimizing performance at the switch or ASIC input. The GN42M380 driver offers 375μm channel pitch and supports a variety of modulators, including Silicon Photonics (SiPho), Indium Phosphide Mach-Zehnder Modulator (InP MZM) and Thin-Film Lithium Niobate (TFLN). The GN42M380 delivers low group delay and minimal Total Harmonic Distortion (THD), ensuring superior driver performance. Programmable Continuous Time Linear Equalization (CTLE) is included to help compensate for intersymbol interference (ISI) due to the input signal transmission path. It also offers flexible biasing, making it compatible with MZMs from various vendors. The driver output swing is configurable, and on-chip equalization enables precise tuning of electrical and optical performance. The TIA and driver family integrates several diagnostics and performance tuning features that can be accessed through device pads and the I[2]C interface. Availability Contact Semtech for the availability of the GN1838L, GN42T380 and GN42M380 product family. Customers and partners are invited to visit Semtech at Booth #11C52 during CIOE 2026, Sept. 9-11, in Shenzhen, China, to learn more about the portfolio and meet with Semtech's technical experts. About Semtech Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected IoT devices worldwide. Its global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit WPGXFox28 at Semtech.com or follow WPGXFox28 on LinkedIn or X. Semtech and the Semtech logo are registered trademarks or service marks of Semtech Corporation or its subsidiaries. All other trademarks, service marks and trade names mentioned in this press release are the property of their respective owners. Media gallery

TMCnet
Sep 8th, 2026
Semtech Delivers 10G PON Chipset for Triple-Generation 50G OLT Modules

Semtech Delivers 10G PON Chipset for Triple-Generation 50G OLT Modules TMCnet News [September 08, 2026] | / | Semtech Delivers 10G PON Chipset for Triple-Generation 50G OLT Modules Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things ("IoT") devices worldwide, today announced an industry-first chipset for 10G passive optical network (PON) optical line terminal (OLT) applications. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260908772887/en/ Semtech's GN7153C OLT combo IC and GN28L46 burst-mode TIA form an integrated chipset for 10G PON OLT applications, supporting GPON, XGS-PON and 50G PON in a single SFP-DD module. As network operators globally begin scaling to 50G PON deployments, equipment vendors need to support multiple generations of PON technology-GPON (2.5Gbps), XGS-PON (10Gbps) and 50G PON, all within a space-constrained SFP-DD module form factor. Furthermore, 50G OLT systems require high SFP-DD port density making module power a critical design priority. The GN7153C OLT combo IC and GN28L46 burst-mode transimpedance amplifier (TIA) bring a new level of integration, low power and design flexibility to optical module manufacturers and broadband system vendors developing next-generation fiber broadband infrastructure. The chipset pairs the GN7153C, a 10G PON OLT combo IC integrating a dual-rate burst-mode limiting amplifier and laser bias driver outputs, with the GN28L46, a high-sensitivity burst-mode TIA. Together, they form a tightly integrated solution for 10 gigabit symmetric passive optical network (XGS-PON) applications compliant with ITU-T G.9807.1 standards. The GN7153C uses lower supply voltages to deliver up to 400mW of savings per port, across a fully populated 16-port optical line terminal, that aggregates to 6.5W of system-level power savings. The GN28L46 has an accurate Received Signal Strength Indicator (RSSI) mirror, together with the burst-mode sample-and-hold circuit in the GN7153C, that improves accuracy and eliminates the need for standalone RSSI controllers, further reducing component count and BOM cost. "The GN7153C enables module suppliers and system vendors to realize the promise of 50G PON infrastructure," said Amit Thakar, vice president, signal integrity product marketing at Semtech. "By integrating the SOA driver, on-chip RSSI and dual TOSA bias driver outputs into a single device-and pairing it with the industry-leading sensitivity of the GN28L46 TIA-we are giving our customers the design flexibility and power efficiency they need to build the next generation of triple-gen optical line terminal modules." The GN7153C and GN28L46 chipset is currently available for sampling. Volume production is scheduled for September 2026. Semtech will showcase the GN7153C and GN28L46 chipset at CIOE 2026, Sept. 9-11 in Shenzhen, China, at Booth #11C52. Learn more at http://www.semtech.com/optical. About Semtech Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected IoT devices worldwide. Its global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit Fog Computing World at Semtech.com or follow Fog Computing World on LinkedIn or X. Semtech and the Semtech logo are registered trademarks or service marks of Semtech Corporation or its subsidiaries. All other trademarks, service marks and trade names mentioned in this press release are the property of their respective owners. SMTC-P View source version on businesswire.com: https://www.businesswire.com/news/home/20260908772887/en/ [ Back To TMCnet.com's Homepage] |

Cablefam
Aug 27th, 2026
HDMI&USB-C: new developments in the audio and video cable industry.

HDMI&USB-C: new developments in the audio and video cable industry. 08/27/2026 08/31/2026 With the continuous growth of 8K video, enterprise conference room renovation, home theater, and various professional studio projects, the standards for audio and video transmission cables and supporting chips continue to iterate. Recently, multiple overseas standard organizations, wire manufacturers, and semiconductor companies have successively released updates to promote further upgrades of engineering grade and consumer grade audio and video wiring products. HDMI 2.1a welcomes important amendment, adding Cable Power cable power supply function. * HDMI LA officially released HDMI 2.1a Amendment 1 on August 25, 2026, introducing the new feature of HDMI Cable Power. * For active HDMI cables over 5 meters in length, the new standard allows the cable to directly obtain power from the signal source device, eliminating the need for an external power adapter. The cable distinguishes between the signal source end and the display end, and belongs to a unidirectional structure. If the interface is reversed, the device will not be damaged, but signal transmission cannot be completed normally. * This function mainly solves the power supply problem of long-distance active HDMI wiring in engineering installation and home theater scenes, reduces on-site adapter wiring, and simplifies the construction of the entire audio-visual system. The newly launched long-distance active HDMI 2.1 products in the future will gradually implement this new specification. Kordz releases passive HDMI 2.1 cables for engineering and marine use, to be showcased at CEDIA Expo 2026. * Overseas professional AV cable manufacturer Kordz will release the R.4 series passive HDMI cable products on August 18, 2026. * The product fully supports 48Gbps bandwidth and is compatible 8K@60Hz, All HDMI 2.1 core functions such as eARC and VRR. The product is divided into machine room rack version and ocean ship version. The ship model adopts LSZH low smoke halogen-free sheath, and the joints are reinforced with locking structure to enhance the ability to resist electromagnetic interference. * All products have been certified by DPL Labs third-party laboratory and come with a lifetime warranty. This series of products will be exhibited at the CEDIA Expo in Denver, USA in September. The requirements for HDMI cable shielding, fire resistance, and mechanical durability are constantly increasing in high reliability scenarios such as maritime, yacht, and commercial computer rooms. Semtech launches SDI HDMI conversion chip to lower the threshold for AV over IP device development. * On August 26, 2026, Semtech released the GS12170 bridge chip to the public. The chip realizes bidirectional conversion between SDI signals and HDMI signals, with the characteristics of small size and low power consumption, and is widely compatible with video extenders, signal converters, 4K monitors, and studio equipment. * Synchronize and open up free SDVoE software management tools to help hardware manufacturers reduce the development difficulty of AV over IP devices based on Ethernet transmission. In studio and large conference room projects, the market demand for HDMI SDI conversion equipment and network cable transmission audio and video solutions is continuously increasing. Teledyne LeCroy updates USB4 2.0 cable protocol testing plan. * Testing equipment manufacturer Teledyne LeCroy will update its testing equipment on August 25, 2026, adding the ability to test asymmetric links of USB4 V2.0 and Thunderbolt 5 cables. * Overseas brand owners and import distributors are paying increasing attention to the performance testing of USB-C and USB4 high-speed cables. Wires need to pass complete protocol testing in order to avoid bandwidth shortages, abnormal video output, compatibility failures, and reduce terminal project failures and after-sales issues during use. PureLink joins SDVoE Alliance to expand USB-C audio and video solutions for enterprise conference rooms. * German AV manufacturer PureLink announced on August 26, 2026 that it has officially joined the SDVoE alliance, further improving the entire wiring solution for BYOD's built-in equipment conference rooms. Cablefam will focus on iterating USB-C to HDMI products and HDBaseT6A Ethernet transmission systems for educational institutions and corporate conference room renovation projects. * In the European market, enterprise conference room renovation projects remain active, with USB-C serving as a unified input interface, driving a large demand for the procurement of adapters, audio and video cables, and network cable wiring kits. Summary. * From a series of recent overseas technological updates and new product releases, it can be seen that the professional audio and video cable industry has two clear directions: on the one hand, high-speed interface protocols such as HDMI and USB4 continue to upgrade, and active cable power supply and signal conversion chips are constantly optimized; On the other hand, in engineering, maritime, and commercial conference room scenarios, more emphasis is placed on third-party certification, shielding performance, fire-resistant sheaths, and overall installation convenience. * The industry exhibition CEDIA Expo 2026 is about to open, and there will be more AV cabling new products released to the public in the future, which is worth continuing to pay attention to. Faq. * Will the Cable Power feature of HDMI 2.1a be compatible with older HDMI devices? * Cable Power belongs to the newly added amendment feature of HDMI 2.1a, which is only supported by the new active HDMI cable. Old devices can transmit audio and video signals normally, but they cannot use the ability to draw power from the signal end. Long distance wiring may still require an external power adapter. * What is the core difference between engineering grade HDMI cables and regular consumer HDMI cables? * Enhanced shielding and anti-interference measures have been implemented for the engineering project, with some using LSZH low smoke halogen-free outer covers and locking structures at the joints. It has third-party certification and is suitable for long-term stable operation in computer rooms, yachts, and commercial projects; Ordinary household cables do not meet commercial installation standards. * Why does USB4 cable need to undergo protocol compliance testing? * Many USB-C cables on the market have the same appearance, but there are significant differences in bandwidth and video output capabilities. The cable that has undergone complete protocol testing can avoid bandwidth shrinkage, video flicker, compatibility failures, and reduce the after-sales risk of B-end projects.

Yahoo Finance
Aug 26th, 2026
Semtech's data center revenue hits record $100M as 1.6T adoption drives 91% YoY growth

Semtech Corporation reported fiscal second-quarter 2027 adjusted earnings of 71 cents per share on revenue of $341.9 million, topping consensus estimates of 62 cents and $328.4 million respectively. Data centre revenue reached a record $100 million, up 39% sequentially and 91% year over year, driven by 800-gig strength and the start of its 1.6T FiberEdge ramp. CEO Hong Hou said 1.6T FiberEdge should exceed 50% market share by fiscal year-end. The company guided third-quarter net sales to $410 million, representing 20% sequential and 54% year-over-year growth at the midpoint. Semtech expects data centre revenues to rise 45% sequentially and about 160% year over year. Management said the company is more than 70% booked for the next fiscal year, with 3.2T design windows opening in roughly 12 months.