Senior Hardware Engineer

What you will be doing:

• Hardware Design: Lead the development of high-speed, high-performance hardware schematics for PCBs, ensuring the designs meet functional, electrical, and mechanical specifications.
• Signal Integrity: Perform detailed signal integrity analysis and simulations (including but not limited to reflection, crosstalk, impedance matching, and transmission line effects) to ensure robust high-frequency signal transmission and minimal noise interference.
• Thermal Analysis: Conduct thermal simulations and analysis on PCB designs to assess and mitigate heat generation and ensure efficient thermal management. Optimize component placement and design layout to enhance heat dissipation.
• Simulation & Tools: Utilize industry-standard tools such as SPICE, HyperLynx, CST, Ansys, or similar for signal integrity and thermal simulations to validate design performance before physical prototyping.
• Collaboration: Work closely with cross-functional teams, including software engineers, mechanical engineers, and manufacturing teams, to ensure that the hardware design integrates seamlessly into the overall system.
• Design Optimization: Recommend and implement design changes based on simulation results to improve the signal integrity and thermal performance of the product.
• Documentation: Provide detailed design documentation, simulation reports, and analysis results for internal review and manufacturing handoff.
• Problem Solving & Troubleshooting: Investigate and resolve design-related issues during the validation and testing phase, including signal and thermal anomalies.

What you bring to this role:

• Experience: Minimum of 5 years of hands-on experience in hardware design, signal integrity analysis, and thermal simulation, ideally within a high-performance or embedded systems environment.
• Skills:
• Strong expertise in schematic capture and PCB design tools (e.g., Altium, OrCAD, Cadence).
• Proficiency in signal integrity analysis tools (e.g., HyperLynx, SIwave, ADS, CST).
• Experience in performing thermal analysis using tools such as Ansys Icepak, FloTHERM, or similar.
• Solid understanding of PCB manufacturing processes and design for manufacturability (DFM).
• Familiarity with high-speed circuit design principles, including impedance control, differential pairs, and high-frequency components.
• Problem-Solving: Excellent analytical and problem-solving skills with the ability to independently drive design improvements.
• Communication: Strong written and verbal communication skills with the ability to present complex technical concepts to non-technical stakeholders.
• Team Player: Ability to work in a fast-paced, collaborative environment and contribute to multiple projects simultaneously.

Bonus points for the following:

• Experience with multi-layer high-speed PCB designs.
• Familiarity with FPGA and microcontroller and high-speed memory interface designs.
• Knowledge of advanced thermal management techniques, such as heat sinks, vias, and thermal vias.
• Experience with simulation automation and scripting is a plus.