Job Description

• The ASIC Packaging Engineer is a part of the team of IC package development and supports the team development activities for specific or multidisciplinary areas – feasibility of Mechanical Structure; Material compatibility; Thermal solutions; Manufacturing capability and package Qual process.
• Coordinate with WD worldwide NAND and Controller design teams in the Die-Package Co-design (Israel, India, USA) and multiple Product Development groups within the company.
• Coordinate with factories worldwide on the Eng Samples deliveries, Package Qualification plan. Support of manufacturing ramp and introduction of new assembly processes. Manages assembly yield improvement and package cost reduction programs. 
• Represent Package Engineering Org in cross-functional teams and ensures that packages are characterized, qualified and transferred in production in a timely manner while meeting all electrical, performance, reliability and quality requirements.

Qualifications

• This position requires a candidate with BE / MS degree in in Mechanical, Material or Electrical / Electronic Engineering (VLSI) or equivalent with 4-6 years of relevant work experience in IC packaging assembly industry.
• Knowledge of advanced microelectronic packaging highly required including Wirebond / Flip chip interconnect technologies, Bump types, Substrate design rules, Planning bump layout for manufacturability etc.  Knowledge of materials / mechanical aspects of packaging needed.
• Knowledge of Package signal integrity and power integrity principles is required. Knowledge of EMI, HFSS, HSPICE is a plus. Hands-on experience with oscilloscopes, network analyzers and spectrum analyzers also a plus.
• Practical skill in AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques required.
• Ability to daily multi-tasking in different projects, manage and meet tight deadlines of packaging deliverables as a part of multidisciplinary team as well as excellent communication and interpersonal skills required.