Manager Siph Packaging Architecture

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

Build and lead a highly technical team of SiPh packagedesign and modeling engineers to deliver industry leading electro-optical transceivers using GF’sPhotonix platformand advanced packaging 2.5D and 3D co-packaged optic form factorsmeeting customer requirements. The candidate will bring a strong focus onthermal, mechanical, electrical, and opticalchip package co-design.  Focus on product and moduleperformance,  reliability, packaging design rules, materials selection criteria, definition of electrical, photonicand thermal definition for chiplet and product modules as well as reliability qualification approaches.

A successful candidate would possessassembly knowledge and expertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnect and packaging solutions with present state-of-the-art electrical interconnect solutions.  It is expected that options for optical fiber attach will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on-wafer and chip on substrate  using a variety of assembly technologies.

Responsibilities: 

• Drives high engagement and trust within their team and between teams to deliver beyond expectations. 

• Delivers results providing training and cross training to ensure high team continuity and effectiveness. 

• Drives team to use latest AI techniques for increased efficiency and productivity. 

• Leads team to establishment of manufacturing driven design rules and guidelines.

• Ensures that all packaged products meet a standardized set of quality expectations by driving product packaging design reviews, materials selection and FMEAs of customer packaging concepts. 

• DrivesSiPhadvanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems. 

• Provides tools and complex analysis for manufacturability, cost, and quality.

• Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customersand market to avoid costly re-designs.

• Ensures standardization of site-based quality processes are executed appropriately

• Drives discipline and qualification robustness through a consistent global designprocesses

• Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:

• Perform project management and data analysis 

• Support new customer products with innovative design solutions and technology design rules

• Work with cross function teams to resolve technical & yield concerns

• Develop and improve test structures that enable fast and rigorous characterization of process

• Drive CIP (Continuous improvement plans) to deliver organizational goals

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs 

Required Qualifications:

• MS +7, or PhD + 5 or more years of experience

• Experience in bringing packaged products from development into production.

• Experience with HFSS, Zmax, Flotherm, or other design and modeling tools.

• Package design and layout knowledge

• Strong written and spoken English communication skills

Preferred Qualifications: 

• Materials science, thermal, mechanical, simulation background.

• Experience with failure analysis, design of experiments, & packaging process integration.

• Validated record of photonic and electrical interconnect innovation and product releaseinternally or with an OSAT ecosystem.

• Expert in chip package interaction for 2D, 2.5D, 3D, 3.5DSiPh advanced packaging.

• Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.