Lead innovation and development of novel 2.5D and 3D semiconductor integration processes for RF and dense high speed mixed signal electronics applications, with attention to all facets of this endeavor (e.g. RF electrical performance of both passive and active components, thermal-mechanical constraints, chemical / metallurgical issues, manufacturability/cost constraints, etc.). Address all levels of integration from chip-level integration (e.g. die and wafer stacking, WLFO) to package and PCB. Perform theory-driven analyses of candidate approaches. Organize and manage research and development projects to be carried out by technical teams of other domain experts (e.g. in each of the technical areas mentioned above). Provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.). Develop and maintain relationships with relevant vendors and partner organizations. Organize and present results, in written reports, journal papers, and oral presentations. Create and manage work plans to meet or exceed schedule deadlines and technical expectations. Lead and contribute to proposal and marketing efforts required to sustain continued R&D efforts.

 

More than 5 years of experience in developing, characterizing, and exercising semiconductor manufacturing processes and corresponding electronics packaging. More than 5 years of experience with design of experiments and analysis techniques (electrical, mechanical, thermal, chemical, etc.) needed to develop and assess new process tools and techniques. Demonstrated experience developing external partnerships and vendor relationships. Several years of experience in organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research funding. Familiarity with commercial packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, etc.) and integrated circuit processing and integration techniques.

Deep understanding of material science, surface chemistry, semiconductor physics, and thermal/mechanical theory related to electronics processing and assembly techniques. Familiarity with high-speed electrical characterization methods. Use of Microsoft Office tools (Word, Excel, Powerpoint) and proficiency in writing for reporting.

B.S. degree in Electrical Engineering, Physics, or related scientific discipline. M.S. preferred. 

Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment. Ability to work well in a team and independently. Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.

 

Current U.S. person status

The base salary range for this full-time position is $120,715 - $150,895 + bonus + benefits.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.