Full-Time

Federal Capture Manager

Federal Capture Management

Posted on 9/13/2025

Intel

Intel

10,001+ employees

Pioneers microprocessors, CPUs for PCs

Compensation Overview

$167.1k - $235.8k/yr

+ Bonus + Stock

No H1B Sponsorship

Washington, DC, USA + 8 more

More locations: Austin, TX, USA | Fairfax, VA, USA | Albuquerque, NM, USA | Santa Clara, CA, USA | Hillsboro, OR, USA | Folsom, CA, USA | Worcester, MA, USA | Phoenix, AZ, USA

Hybrid

Hybrid work model allows employees to split their time between working on-site at their assigned Intel site and off-site.

US Citizenship, US Top Secret Clearance Required

Category
Business & Strategy (1)
Required Skills
Sales
Requirements
  • US Citizenship required.
  • Ability to obtain a US Government Security Clearance.
  • Bachelor's degree in a technical or business field (MBA) or in a STEM related field of study.
  • Minimum 6+ years of experience in roles executing federal capture management, business development, proposal development and writing, sales, or related roles.
  • Experience in federal procurement processes, regulations (e.g. FAR/DFARS), and contracting vehicles.
  • Experience in leading small and medium capture efforts and winning contracts in US Public Sector markets.
  • Experience with Shipley Business Development Lifecycle.
Responsibilities
  • Selects, develops, and evaluates personnel to ensure the efficient operation of program execution.
  • Leads complex business transactions across multiple suppliers, partners, and business units supporting Intel's pathfinding, development, and manufacturing supply chain from the strategy, sourcing, deal conception, negotiation, to execution/contract closure stages while identifying efficiencies and improvements to the program execution lifecycle.
  • Collaborates with Intel engineering/technical and business specialists to synthesize technical, commercial, financial, and industry inputs to build business strategies.
  • Influences business unit or cross-organizational strategies relevant to program goals.
  • Exhibits deep knowledge of government contract regulations and requirements, information security, audit and compliance, and other procedures.
  • Exhibits deep technical knowledge of product development processes and roadmaps for government solution offerings.
  • Leverages technical expertise to align government program technology requirements with Intel's technical capabilities and ensures broad alignment between Intel Government Technologies’ product portfolio and Intel's government contract portfolio.
  • Represents Intel and the program office with external government customers, partners, agencies, and officials.
  • Establishes and maintains relationships with external partners, regulators, auditors, customers, and opinion formers.
Desired Qualifications
  • Active US Government Security Clearance with a minimum of Secret level.
  • Experience with Intel technology, products and or capabilities.
  • Experience pursuing and winning government opportunities in the product development and solution domain.
  • Experience driving government program capture internationally.
  • Experience in leading large scale capture efforts and winning contracts in US Public Sector markets.
  • Proficiency with GovWin and DACIS government business intelligence platforms.

Intel designs and manufactures semiconductor chips, with a focus on microprocessors for personal computers, servers, and other devices. Its core product is the CPU on a single silicon chip, which executes instructions, handles arithmetic and logic operations, and coordinates the work of other computer components. Intel originated in memory chips but shifted decisively to microprocessors in the 1980s, becoming a central supplier for the PC era after the IBM partnership and its famous x86 processor line. This shift, large-scale manufacturing, and close ties with computer makers set Intel apart from competitors who remained focused on memory or other components. The company aims to power computing by delivering high-performance, energy-efficient silicon solutions that drive a wide range of computing devices and applications.

Company Size

10,001+

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

1999

Simplify Jobs

Simplify's Take

What believers are saying

  • Data center and AI revenue surges 22% to $5.1 billion in Q1 2026 amid agentic AI boom.
  • Nova Lake launches H2 2026 with 52 desktop cores and 288MB cache challenging AMD dominance.
  • OpenAI MRC protocol partnership accelerates Intel's networking in 131,000-GPU supercomputers.

What critics are saying

  • Gross margins drop from 41% Q1 to 39% Q2 2026 due to 18A ramp costs and input inflation.
  • TSMC's 2nm volumes outpace Intel 18A yields below 50% by Q4 2026, ceding foundry market.
  • $3.9 billion Mobileye impairment triggers further $1-2 billion write-downs in 2027.

What makes Intel unique

  • Intel pioneers hybrid CPU architectures with Coyote Cove P-cores and Arctic Wolf E-cores in Nova Lake.
  • Intel Capital invests $500 million in China Technology Fund II targeting wireless broadband and clean tech.
  • Intel leads agentic AI CPUs coordinating workloads and memory for autonomous task execution.
  • Intel's 18A foundry node enables custom data center CPUs via Nvidia's $5 billion investment.

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Benefits

We Invest in Your Life and Career: Intel offers a complete and competitive package of benefits1 that demonstrates how much we care for employees and their families through every stage of life.

Great Minds Deserve Great Rewards: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs.

Intel Fuels Career Acceleration: Curiosity drives us to change the world. We provide employees opportunities to expand their knowledge, leadership abilities, and skill set.

Vacation, Holidays, and More: We offer opportunities for employees to refresh and recharge—from paid vacation time and holidays to flexible time off programs.

Health Benefits for the Whole You: We provide multiple benefits and resources to help employees take care of themselves and their families.

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

0%

2 year growth

1%
Staccato Media Private Limited
Apr 19th, 2026
Intel CEO Lip-Bu Tan joins groundbreaking of 3D Glass Solutions facility in Bhubaneswar.

Intel CEO Lip-Bu Tan joins groundbreaking of 3D Glass Solutions facility in Bhubaneswar. Bhubaneswar: Intel CEO Lip-Bu Tan Sunday said that the Rs 2000 crore 3D Glass Solution project in Bhubaneswar is a major step toward strengthing India's semiconductor ecosystem and advancing global technology collaboration. Joining the groundbreaking ceremony of the Project on virtual mode, the Intel CEO Tan expressed appreciation for the leadership of PM Narendra Modi, whose vision has positioned India as a competitive and trusted semiconductor hub. He also acknowledged Ashwini Vaishnaw and the India Semiconductor Mission for their strategic direction and execution in driving industry growth. Tan extended his gratitude to Odisha CM Mohan Charan Majhi and the government of Odisha for their proactive support and partnership in enabling the project. Emphasizing the future of the semiconductor industry, Tan noted that advanced packaging, heterogeneous integration, and substrate technologies will play a crucial role in performance and innovation. He underscored that 3D Glass Solutions is well-positioned to contribute significantly in this space. Highlighting Odisha's strengths, Tan pointed to its reliable infrastructure, including power, water resources, and a skilled workforce, as key enablers for advanced manufacturing. The new facility is expected to generate high-quality employment, foster local talent, and contribute to building a resilient semiconductor ecosystem in India. Tan concluded by expressing confidence that the project will evolve into a center of excellence, strengthening global supply chains and reinforcing India's role in the semiconductor industry. Odisha CM Majhi today laid the foundation stone for project in Info Valley, Bhubaneswar, in the presence of Union Electronics & IT Minister Aswini Vaishnaw and Odisha Electronics & IT Minister Mukesh Mahalinga. Odisha Chief Secretary Ms. Anu Garg, E & IT Additional Chief Secretary Vishal Dev, Union E & IT Additional Secretary Amitesh Sinha, and 3D Glass Solution President & CEO Babu Mandaba were also present at the event. It may be mentioned here that Intel is associated with 3D Glass Solutions for long.

Ars Technica
Apr 16th, 2026
Intel refreshes non-Ultra Core CPUs with new Wildcat Lake silicon for first time

Intel has launched its Core Series 3 processors, marking the first time in years that non-Ultra Core CPUs feature genuinely new silicon. Codenamed Wildcat Lake, these chips represent a departure from previous non-Ultra models, which relied on the outdated Raptor Lake architecture from 2023's 13th-generation Core family. The new processors use two silicon tiles: a compute tile with up to two Cougar Cove P-cores, four Darkmont E-cores, and Xe3 integrated graphics, plus a platform controller tile. Built on Intel's 18A manufacturing process, they support up to 48GB LPDDR5X-7467 memory and operate at 15W base power. However, the chips' 17 TOPS NPU falls short of Microsoft's 40 TOPS requirement for Copilot+ PC features. Intel claims over 70 designs from partners will launch in coming months.

Bloomberg L.P.
Apr 16th, 2026
Intel hires Samsung executive Han to lead foundry services push

Intel has hired Samsung Electronics executive vice president Shawn Han to bolster its foundry business as the chipmaker seeks to expand in outsourced chip manufacturing. Han will join Intel next month as general manager of foundry services, reporting to Naga Chandrasekaran, head of Intel's foundry division. The appointment reflects Intel's push to attract customers to its manufacturing operations. Han's extensive experience at Samsung, a major player in contract chipmaking, is expected to support Intel's efforts to compete in the foundry market.

Microsoft
Apr 14th, 2026
US government acquires 10% stake in Intel through $8.9B chips act conversion

I cannot generate a summary for this article as it is written in German, not English. The task requires me to work with English-language source material to produce an English-language business news summary. If you would like a summary of this article, please provide an English translation of the content, or provide a different article in English.

Yahoo Finance
Apr 14th, 2026
Intel appoints Aparna Bawa as Chief Legal & People Officer to support AI and foundry transformation

Intel has appointed Aparna Bawa as Executive Vice President and Chief Legal & People Officer, overseeing global legal, ethics, compliance, people and culture functions. She will report directly to CEO Lip-Bu Tan. Bawa joins from Zoom during a period of significant transformation at Intel. The company's shares have risen 28.3% over the past week and 42.4% over the past month, trading at $65.17. The combined role places legal risk management, culture and talent decisions under single leadership as Intel reshapes itself around AI, foundry services and major cloud and automotive clients. With recent agreements involving Google, SambaNova and the Terafab project with Tesla, SpaceX and xAI, Intel faces increasingly complex contracts and regulatory exposure. The appointment signals how the company is organising to support long-term execution during operational transformation.

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