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Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Job Summary:

Hybridization Mechanical Engineer or Material Science Engineer - is a hands-on position for executing and supporting the manufacturing activities of infrared and visible focal plane array (FPA) assemblies. The engineer would provide technical (production and development) leadership in the FPA fabrication process and would work regularly alongside the FPA production team in the cleanroom. The engineer would be responsible for the execution of flip-chip bonding across all programs at Teledyne.

Essential Duties and Responsibilities:

• Determines conditions for various processes, including etching, flip-chip bonding, polishing, and AR coating.

• Reviews components and assembly designs to optimize producibility.

• Determines tooling needed for production.

• Determines and tracks the key process controls/measurements needed to verify success and to meet assembly specifications.

• Prepares and presents workflows, work instructions, and Manufacturing Readiness review charts.

• Works with cleanroom staff to fabricate prototype parts.

• Trains operators in the use of documentation and tooling.

• Tracks issues as they arise and leads teams to solving them.

• Oversees inspections, data analysis, and documentation.

• Frequently works with Enterprise Resource Planning (ERP) system for tracking and reporting of data.

• Contribute to manufacturing trouble shooting and conduct failure analysis and identify root causes.

• Manages efforts in the development and execution of a risk management plan during the design and fabrication of focal plane arrays.

Qualifications & Competencies:
 

To perform the job successfully, an individual should demonstrate the following qualifications and competencies:

• Knowledge of flip-chip bonding and assembly processes, including epoxy bonding, polishing, substrate removal and Anti-Reflection Coating.

• Strong background in opto-electronic semiconductor devices or similar area of knowledge.

• Experience in DOE, product and technology development.

• Experience in project management, risk assessment/management, cost account management, cost estimation and engineering planning is highly desired.

• Effective communication (written and verbal) of very complex ideas and the ability to communicate at any level of audience.

• Strong technical writing and communication skills are required to complete whitepapers, proposals, technical reports, and support customer reviews.

• Advanced computer proficiency using Microsoft Office Suite (Word, Excel & PowerPoint)

• Displays exemplary ethics and business conduct and performs work cognizant of safe work practices.

Education and/or Experience:

Bachelor’s or Master’s Degree with three (3) years of experience; or equivalent combination of education and experience.

Other Qualifications:

• US Citizenship with ability to attain/maintain government security clearance.

• U.S. Person for access to ITAR-Controlled Technical Data

#TS&I

Salary Range:

Pay Transparency

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​