Senior Mechanical Engineer
Device Packaging
Updated on 3/29/2024
IonQ

201-500 employees

General-purpose quantum processor manufacturer
Company Overview
IonQ's mission is to build the world’s best quantum computers to solve the world’s most complex problems. The company has a unique trapped-ion approach combines unmatched physical performance, perfect qubit replication, optical network-ability, and highly-optimized algorithms to create a quantum computer that is as scalable as it is powerful, and that will support a broad array of applications across a variety of industries.
Hardware
B2B

Company Stage

N/A

Total Funding

$784M

Founded

2015

Headquarters

College Park, Maryland

Growth & Insights
Headcount

6 month growth

18%

1 year growth

60%

2 year growth

185%
Locations
Seattle, WA, USA • Toronto, ON, Canada • Washington, DC, USA • Hyattsville...
Experience Level
Entry
Junior
Mid
Senior
Expert
Desired Skills
CAD
Communications
SolidWorks
CategoriesNew
Mechanical Engineering
Design Engineering
Manufacturing Engineering
Mechanical Maintenance and Reliability Engineering
Robotics and Automation Engineering
Thermal and Fluid Systems Engineering
Requirements
  • Bachelors or higher in Mechanical Engineering or relevant field/discipline
  • 5+ years of hands-on electronics or optics device packaging experience, especially with systems which undergo thermal stress cycling
  • 5+ years leading a high-precision R&D packaging development effort in industry
  • Expertise using Solidworks
  • Experience with thermal, electrical, and mechanical modeling of electronics packages in Ansys, COMSOL, or similar
  • Expertise in identifying and using packaging techniques, components, and materials to manage mechanical stress and thermal expansion/contraction
  • Experience with data aggregation and statistical analysis/reporting
  • Excellent communication skills and ability to work on and lead a team
Responsibilities
  • Lead the full packaging development lifecycle of novel hybrid optical and electronic systems; including detailed CAD design, document control, experiment reports and statements of work for internal and external activities,
  • Procure components, tools, fixtures and materials for hands-on characterization, testing, and validation of custom ultra-high vacuum packages for ion traps
  • Coordinate with other quantum system leads to define and explore subsystem interfaces and constraints
  • Scope and set objectives for new technical projects centered on thermomechanical packaging analysis
  • Develop project timelines, identifying key decision dates and completion dates
  • Conduct risk analysis and develop mitigation plans to ensure on-time release and delivery of project deliverables
  • Assist with the transition from research and development to production, including development of first articles and technology demonstrations