Senior Package Design Engineer
Confirmed live in the last 24 hours
Synapse International

11-50 employees

AI-driven recruitment platform
Company Overview
Synapse is a tech-driven recruitment firm that uses advanced AI technology to streamline the hiring process, significantly reducing the time from requirement to hire. The company excels in recruiting for highly specialized roles, assembling standout global teams with ease, and providing unparalleled communication and presentation of high-quality candidates. Testimonials from clients highlight Synapse's ability to understand their business needs and culture, provide valuable feedback on hiring processes, and deliver highly qualified candidates in a timely manner.
Consulting

Company Stage

N/A

Total Funding

N/A

Founded

2013

Headquarters

Marina del Rey, California

Growth & Insights
Headcount

6 month growth

0%

1 year growth

-16%

2 year growth

30%
Locations
El Segundo, CA, USA
Experience Level
Entry
Junior
Mid
Senior
Expert
Desired Skills
Printed Circuit Board (PCB) Design
Cadence Allegro
CategoriesNew
Hardware Engineering
Requirements
  • Ability to exercise judgment within generally defined practices and policies in selecting methods and techniques for obtaining solutions
  • Ability to work on problems of diverse scope where analysis of data requires evaluation of identifiable factors
  • Must be able to communicate to all levels of the organization as well as outside the organization
  • Ability to manage multiple priorities effectively
  • Strong sense of urgency and strong sense of ownership
  • Proactive approach, positive attitude and disposition
  • Self Managed, Disciplined, Decisive, Organized, Driven Performer, Complex Solving Skills
  • A minimum of 4 years of experience with integrated circuit package designs
  • Familiarity with transmission line routing for frequencies above 1 GHz
  • Very proficient with Cadence Allegro Package Designer using SIP Layout
  • Expertise optimizing high density package designs based upon a solid understanding of signal types and routing priorities
  • Problem solving and planning skills
  • US citizenship required
Responsibilities
  • Design BGA packages for high frequency integrated circuits using Allegro Package Designer using SIP Layout
  • Model BGA packaging in 3D and perform tradeoff studies
  • Develop package designs for signals exceeding 50 GHz using RF transmission lines
  • Work with HFSS and package layout engineers to fine tune package layouts
  • Perform other work related duties as assigned
Desired Qualifications
  • Some experience with Allegro PCB Designer or Ansys Q3D is a plus