Director Pee

The Director of Manufacturing Engineering will lead the engineering organization responsible for semiconductor backend assembly processes, including backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI and related technologies. The role oversees process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. The director will be a key player in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to hit quality output target while reaching BIC (best in class) engineering KPI.⸻

Key Responsibilities:

1. Engineering Leadership & Strategy
• Lead and manage the manufacturing engineering team supporting backend assembly operations across multiple product lines.
• Define strategic engineering roadmap for backend PDE technologies in alignment with business objectives.
• Drive cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain.

2. Process Development & Optimization
• Oversee development, qualification, optimization and sustaining of backend assembly processes: backgrinder, laser dicers, die attach, wire bond, flip chip, underfill, mold, singulation, etc.
• Implement and standardize best-known methods (BKMs) and process control strategies to ensure process stability to hit CPK great than 2.0 with proper spec and control limit and high yield as well as fully master the FDC technologies to capture in-line equipment/process abnormalities upfront
• Apply DOE, SPC, FMEA, and root cause analysis (RCA) to drive process robustness and continuous improvement.

3. New Product Introduction (NPI)
• Collaborate with package development and NPI teams to ensure successful transition of new products from development to mass production.
• Drive Design for Manufacturability (DfM) and Design for Assembly (DfA) initiatives.
• Own process readiness, capability demonstration, and yield ramp targets during pilot and production ramp-up to make sure hyper care program successfully executed.

4. Automation & Digital Transformation
• Drive automation roadmap and smart factory initiatives to improve throughput, reduce manual handling, and enhance process control.
• Leverage data analytics, MES, and equipment data integration to improve process monitoring and predictive maintenance.
• Champion Industry 4.0 and AI-driven process optimization where applicable.

5. Cost, Yield & Quality Improvements
• Lead structured problem-solving and engineering solutions to reduce scrap, improve yield, and lower cycle time.
• Collaborate with operations and quality teams to meet customer quality standards and reduce return rate / defects per million (DPPM).
• Drive cost reduction programs via material substitution, process simplification, and productivity improvements.

6. Talent Development & Team Management
• Build, mentor, and retain a high-performing team of engineers (process, automation, tooling, equipment, sustaining).
• Develop career progression and succession planning for key engineering roles.
• Foster a high-performance culture of accountability, innovation, and continuous learning.


Qualifications:

Education
• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering).
• Advanced technical or business degree (e.g., MBA, MSc, PhD) is a plus.

Experience
• 20+ years of experience in semiconductor backend manufacturing with deep expertise in assembly engineering.
• At least 10 years in a senior engineering management role.
• Proven experience in deploying new technologies, scaling NPI, and driving process/yield improvement in high-volume manufacturing.

Technical Skills
• Strong knowledge of backend assembly processes (backgrinder, laser dicer, wire bond, die attach, molding, flipchip, AOI etc.).
• Experience with advanced packaging technologies is a strong plus.
• Proficient in engineering methodologies: Six Sigma, Lean, SPC, FMEA, DOE.
• Familiarity with semiconductor packaging equipment and automation (ASM, DISCO, Kulicke & Soffa, TOWA etc.).

Leadership Skills
• Strategic thinker with strong project management, communication, and stakeholder engagement abilities.
• Hands-on leader able to operate at both strategic and operational levels.
• Strong analytical, data-driven decision-making skills.

Key Performance Indicators (KPIs):
• Assembly process yield and in-line scrap rate
• NPI cycle time and time-to-production readiness
• Engineering issue closure rate
• process CPK > 2.0

• Equipment uptime and OEE
• Engineering team retention and engagement

Work Environment & Travel:
• Primarily site-based in a high-volume manufacturing environment.
• Some travel may be required for corporate meetings, customer audits, vendor development, or multi-site alignment.