Full-Time

Wafer Fab/Process Engineer

Confirmed live in the last 24 hours

Teledyne

Teledyne

11-50 employees

Industrial & Manufacturing
Aerospace
Consumer Goods

Junior, Mid

No H1B Sponsorship

Chalfont, PA, USA

US Citizenship Required

Category
Electronics Design Engineering
Electrical Engineering

You match the following Teledyne's candidate preferences

Employers are more likely to interview you if you match these preferences:

Degree
Experience
Requirements
  • Experience and hands-on skills in semiconductor wafer fab and processing
  • Knowledge of semiconductor wafer processes and related chemicals
  • Attention to details and good observation
  • Independent thinking and working independently
  • Thrive for process improvement and high-quality processing
  • Good verbal, written and presentation communication skills
  • Basic computer proficiency using Microsoft Office
  • Displays exemplary ethics and business conduct and performs work cognizant of safe work practices
Responsibilities
  • Compound semiconductor wafer fabrication/processing
  • Photolithography
  • Wet and dry etchings
  • Thin film depositions, including metal and dielectric films
  • Wafer cleaning and surface passivation
  • Wafer polishing
  • Infrared focal plane array fabrication
  • Wafer fab/process metrology tests
Desired Qualifications
  • Experience in semiconductor wafer fab/processing and/or manufacturing of infrared sensors or other photoelectronic components is a plus.

Company Size

11-50

Company Stage

IPO

Total Funding

N/A

Headquarters

Thousand Oaks, California

Founded

1960

Simplify Jobs

Simplify's Take

What believers are saying

  • Acquisition of Excelitas Technologies enhances Teledyne's aerospace and defense electronics market position.
  • Partnership with Pilot John International expands Teledyne's reach in the aviation market.
  • Launch of Forge 1GigE SWIR camera series appeals to high-performance imaging solution industries.

What critics are saying

  • Increased competition in drone technology from companies like DJI and Parrot.
  • Potential supply chain vulnerabilities due to reliance on semiconductor components.
  • Regulatory challenges in defense sector could impact global operations.

What makes Teledyne unique

  • Teledyne's Black Hornet 4 Nano-Drone won the Defense Innovation Unit's Blue UAS Challenge.
  • Teledyne's Z-Trak 3D Apps Studio offers advanced in-line 3D machine vision applications.
  • Teledyne's Cerberus XL C-UAS platform addresses emerging security threats with counter-drone technology.

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Benefits

Hybrid Work Options

Company News

HR Tech Wire
Feb 18th, 2025
Teledyne FLIR's Black Hornet 4 Nano-Drone Selected as Winner of the Defense Innovation Unit's Blue UAS Challenge

Teledyne FLIR Defense, part of Teledyne Technologies Incorporated (NYSE:TDY), announced that its Black Hornet(R) 4 Personal Reconnaissance System has been selected as a winner of the Blue UAS Refresh.

Defence Blog
Jan 14th, 2025
Teledyne FLIR wins contract for USCG aircraft sensors

Teledyne FLIR wins contract for USCG aircraft sensors.

Bakersfield.com
Jan 9th, 2025
Teledyne HiRel Semiconductors Releases High-Power RF GaN Switch (30 MHz to 5 GHz)

Teledyne HiRel Semiconductors releases High-Power RF GaN Switch (30 MHz to 5 GHz).

MarketBeat
Dec 5th, 2024
Maven Securities LTD Invests $1.08 Million in Teledyne Technologies Incorporated (NYSE:TDY)

Maven Securities LTD invests $1.08 million in Teledyne Technologies Incorporated (NYSE:TDY).

GlobeNewswire
Nov 26th, 2024
Teledyne launches Z-Trak 3D Apps Studio software tools for in-line 3D measurement and inspection

WATERLOO, Canada, Nov. 26, 2024 (GLOBE NEWSWIRE) - Teledyne DALSA is pleased to introduce Z-Trak(TM) 3D Apps Studio, a suite of software tools developed for in-line 3D machine vision applications.