Full-Time
Principal Physical Design Engineer
Confirmed live in the last 24 hours
NXP Semiconductors
10,001+ employees
Designs and manufactures semiconductor products
No salary listed
Senior, Expert
Company Historically Provides H1B Sponsorship
Bengaluru, Karnataka, India
- Bachelor’s or Master’s degree in Electrical or Electronics Engineering
- 7-12 years of hands-on experience in Physical Design Implementation activities in latest technology nodes (5nm or lower)
- Candidate should have good knowledge of signoff domains STA/PD/PV/PDN from live projects, practical experience of the associated EDA tools
- Ability to use scripting languages / automation of Physical Implementation methodology creation and deployment.
- Lead the end-to-end physical implementation of complex hierarchical subsystem including child partition
- Responsibilities include complete ownership of subsystem across all physical implementation domains i.e., Synthesis, Floor-planning, Place and Route, CTS, LEC/CLP
- Prior experience as a Subsystem lead is strongly preferred
NXP Semiconductors designs and manufactures semiconductor products that are crucial for various electronic devices. Their products serve multiple markets, including automotive, industrial, mobile, and communication infrastructure. NXP's offerings include advanced solutions for automotive electronics, secure identification, wireless connectivity, and embedded processing. For instance, they develop 4D imaging radar chips for self-driving cars and secure devices for Internet of Things (IoT) applications. Unlike many competitors, NXP focuses on creating secure connections and infrastructure, which is essential for a smarter world. Their goal is to lead in the semiconductor industry by providing efficient and secure solutions, while also expanding into the 5G infrastructure market and supporting software-defined vehicle applications.
Company Size
10,001+
Company Stage
IPO
Headquarters
Eindhoven, Netherlands
Founded
2004
Simplify's Take
What believers are saying
- NXP's S32K5 MCU family enhances zonal SDV architectures, boosting automotive market share.
- Partnership with Prime Batteries strengthens NXP's position in energy storage solutions.
- S32R47 imaging radar processors double processing power, advancing autonomous driving capabilities.
What critics are saying
- Leadership transition with CEO retirement may cause strategic instability in 2025.
- Rapid cybersecurity threat evolution could challenge NXP's AI-driven automotive security solutions.
- Integration challenges of S32K5 MCUs may delay adoption by automotive OEMs.
What makes NXP Semiconductors unique
- NXP leads in automotive electronics with advanced 4D imaging radar chips.
- The company pioneers secure tri-radio devices for IoT applications.
- NXP's OrangeBox 2.0 integrates AI and post-quantum cryptography for vehicle safety.
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Benefits
Remote Work Options
Professional Development Budget
Company News
NXP Semiconductors has announced the impending launch of its next-generation OrangeBox 2.0 connectivity domain controller, promising artificial intelligence (AI) technology and post-quantum cryptography aimed at keeping future software-defined vehicles safe.
Romanian lithium-ion battery manufacturer Prime Batteries Technology, founded and controlled by Romanian entrepreneur Adrian Polec, has entered into a collaboration with Arrow Electronics and NXP Semiconductors to launch a next-generation battery energy storage system - BESS platform, according to
S32R47 family are NXP’s highest performing radar processors, addressing the demanding requirements of Level 2+ to 4 autonomous drivingHigher resolution sensing enables advanced use cases like detection of vulnerable road users (VRUs) and lost cargoMore compute capability allows OEMs to develop advanced applications like navigation on autopilot while meeting the demands of tomorrow’s software-defined vehicles (SDVs) at scaleEINDHOVEN, The Netherlands, May 08, 2025 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space. The third generation of imaging radar processors delivers up to twice the processing power versus the previous generation, alongside improved system cost and power efficiency. In combination with NXP’s mmWave radar transceivers, power management and in-vehicle networking solutions, the S32R47 family meets functional safety ASIL ISO 26262 ASIL B(D) requirements and prepares the automotive industry for new levels of autonomous driving.According to Yole Intelligence’s Status of the Radar Industry 2024 report, by 2029, approximately 40% of vehicles entering the road will be passenger cars with driving automation Level 2+(L2+)/ Level 3 (L3) as well as an increasing number of vehicles with Level 4 (L4). To serve the fast-growing autonomous driving market for SDVs, automotive OEMs and tier 1 suppliers need to improve radar performance as it is essential for safe, advanced autonomy features such as piloted driving or fully automated parking.“The S32R47 can efficiently process three times, or more, antenna channels in real time than today’s production solutions. It enables improved imaging radar resolution, sensitivity and dynamic range - required by demanding autonomous driving use cases - while still meeting the stringent power and system cost targets set by OEMs for volume production,” said Meindert van den Beld, Senior Vice President & General Manager, Radar & ADAS.Imaging radar leverages richer point cloud data for more detailed modeling of the environment
Kurt Sievers will retire as President and CEO of NXP Semiconductors at the end of 2025.
At embedded world Exhibition&Conference 2025, NXP Semiconductors showcased a modern brewing facility demonstration in their booth, powered by Gateworks SBCs running CODESYS SoftPLC and integrated with Ignition SCADA integration.