Technologist

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Lead the research and development of semiconductor process technologies, specializing in Western Digital Flash BU’s latest 3D NAND and emerging memories.
• Innovate and drive the implementation of pioneering process modules, conducting materials research and integrating disruptive schemes.
• Lead the advancement of process technology development across various vendors, local fabrication facilities, and coordination with our Japanese facilities.
• Evaluate, select, and oversee the implementation of new process equipment for wafer fabrication, ensuring alignment with technology roadmaps and quality standards.
• Harness advanced RIE (Reactive Ion Etching) processing techniques, focusing on high aspect ratio dielectric and conductor etching for semiconductor memory device fabrication.
• Spearhead research and development efforts on innovative processes and materials to enhance technology capabilities.
• Analyze structural data using cutting-edge SEMs/TEMs and employ statistical analysis software to optimize process parameters.
• Collaborate closely with cross-functional engineering teams, including design, integration, and device, to ensure seamless process integration and product development.
• Occasionally travel to fabs in Yokkaichi, Japan, for short-to-mid stay engagements.

Qualifications

REQUIRED:

• This is an experienced position seeking a candidate with either a master’s degree with at least 9 years of relevant experience, or a PhD degree with at least 6 years of relevant experience in the fields of Chemical Engineering, Materials Science & Engineering, Electrical Engineering, or equivalent engineering discipline with Semiconductor Fabrication background.
• The individual candidate will have an industry experience in high aspect ratio etching using advanced Dielectric and Conductor etch tools and possess in-depth knowledge of plasma physics.
• The individual should have good knowledge of fundamental device physics and processing that are used in the semiconductor industry (RIE, Lithography, Thin Films, Metrology etc.) so that they can solve process related issues.
• Knowledge and experience with Metrology and Optical characterization techniques is desired.
• The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment, be self-motivated and self-directed, and have demonstrated the ability to work well with people and have a strong track record in innovation.
• A proven desire to work as a team member, both on the same team and outside of the team is critical.

SKILLS:

• Ability to troubleshoot and analyze complex problems, ability to multi-task and meet deadlines is required.
• Excellent communication (written and verbal) and interpersonal skills are a pre-requisite.
• Fluency in Japanese language is a plus, facilitating seamless communication with team members and partners in Japan.