Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES

• Development of thin film materials and processes for
  • Near-field transducer and optical-waveguide subsystems – metal alloys for plasmonic, and dielectric for optical applications
  • Writer materials for 200mm wafers: thermal-mechanical, electrical, magnetic, and other functional materials for energy assisted Perpendicular Magnetic Recording (ePMR)
• Novel processes and materials development for advanced writers with designed optical, magnetic, thermal-mechanical, and electrical performance
• Work with Integration/Photo/Ion mill/CMP/RIE/Plating/Wet process teams to assure thin film processes fit into the framework of the overall process and device architecture
• Robust process routing to improve writer reliability, prevent defects, and prompt Failure Analysis (FA) and resolution
• Comprehensive Failure Mode Effect Analysis (FMEA) and tolerance analysis, for high volume manufacturing
• Aggressive experiment and project managements and wafer tracking

Qualifications

REQUIRED

• PhD degree in one of following areas: Materials Science, Physics, Chemistry, or Engineering
• 7+ years of experiences in wafer fab processes. Experience in thin film magnetic head is preferred
• Familiar with vacuum thin film process technology such as PVD, CVD, IBD, and ALD

SKILLS

• Have good data analysis experience utilizing industry standard solutions
• Effective verbal and written communication skills
• Must be a team player