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Full-Time

Senior Applications Engineer II

Posted on 3/30/2024

CesiumAstro

CesiumAstro

51-200 employees

Develops phased array communication payloads

Hardware
Aerospace

Senior

Broomfield, CO, USA

Category
Electronics Design Engineering
Electrical Engineering
RF and Microwave Engineering
Telecommunications Engineering
Required Skills
FPGA
Requirements
  • At least 7 years of relevant experience in technical product development or application support.
  • Working knowledge of RF electronics and communication systems.
  • Experience with FPGA and embedded software for applications with software-defined radios.
  • Exceptional technical communication skills.
  • Experience building relationships with technical customers.
  • Experience with the methodical troubleshooting of electronics and software.
  • Working software proficiency in C/C++ or Python.
  • In-depth experience with RF electronics and communication systems, including link budgets.
  • Experience with a broad range of technical areas, such as high-speed digital systems (10+ Gbps), power electronics, FPGAs, DSP, embedded software, and mechanical interfaces (i.e. thermal, dynamics).
Responsibilities
  • Guide technical customers through the use and integration of CesiumAstro products.
  • Author technical application notes, user manuals, and white papers.
  • Transfer customer feedback to our product development teams.
  • Build long-term relationships with technical customers.
  • Rapidly understand, troubleshoot, recreate, and solve customer-reported anomalies.
  • Develop processes and procedures to structure product development and application.
  • Become a technical expert in Cesium’s products in depth to execute the above. This includes state-of-the-art RF, digital, and power electronics; embedded software; FPGAs; DSP; mechanical integration; and end-to-end wireless communication links.
  • Provide technical leadership and direction to the Business Development Team.

CesiumAstro specializes in developing cutting-edge phased array communication payloads for both airborne and space platforms, offering mission-ready solutions tailored for high throughput communication needs utilizing modular hardware and software. This focus on complex engineering solutions and a modular approach positions the company well within the aerospace industry. The collaborative and technology-driven work environment, underlain by a dedication to innovative payload solutions, makes it a promising workplace for professionals eager to engage with top-tier aerospace technologies and contribute to significant industry advancements.

Company Stage

N/A

Total Funding

$120.2M

Headquarters

Austin, Texas

Founded

2017

Growth & Insights
Headcount

6 month growth

22%

1 year growth

41%

2 year growth

92%
INACTIVE