Full-Time

Process Engineer

Substrate

Substrate

11-50 employees

Develops advanced X-ray lithography chipmaking system

Compensation Overview

$150k - $250k/yr

No H1B Sponsorship

San Francisco, CA, USA

In Person

Must work in several user facilities around the SF Bay Area; travel beyond the Bay Area may be required.

Category
Process Engineering
Requirements
  • 3+ years of hands-on micro- or nanofabrication experience in cleanroom user facilities
  • Demonstrated ability to work safely and collaboratively in a cleanroom user facility
  • Willingness and ability to work in several user facilities around the San Francisco Bay Area several days per week
  • Demonstrated experience handling delicate samples and operating complex fabrication and characterization equipment
  • Fundamental understanding of micro- and nanofabrication considerations such as top-down vs. bottom-up, pattern transfer, material compatibilities, etch selectivity and directionality, and thin film and surface engineering
  • Understanding of the mechanical, optical, and chemical properties of materials which typically determine the performance of nanofabricated devices
  • Strong written and oral communication skills. High attention to detail and organizational skills
  • Ability to solve complex design challenges both independently and as part of a team
  • Ability to collaborate with a large and multidisciplinary technical group
  • B.S. or higher degree in chemical engineering, electrical engineering, materials science, mechanical engineering, physics, or a related discipline in the physical or engineering sciences
Responsibilities
  • Collaborating closely with Substrate’s technical team to conceptualize, design, prototype, and characterize nanofabricated optical devices
  • Hands-on fabrication of MEMS/NEMS devices using techniques such as photo- and electron beam lithography, thin film deposition, and wet and dry etching. This work will be done in several user facilities (primarily around the San Francisco Bay Area, but with the possibility of travel beyond the Bay Area)
  • Iterating through structural designs and tuning lithography, deposition, and etch parameters to optimize processes and improve performance
  • Mechanical, optical, and chemical characterization of thin films using techniques such as profilometry, ellipsometry, and XPS
  • Characterization of pattern fidelity and resolution using techniques such as SEM and AFM
  • Conceptual contributions to fabrication strategies such as design of process flows, material compatibility studies, and mask layout CAD
  • Conceptual contributions to bulk material, nanopatterned structures, and thin film characterization strategies to better study the mechanical, chemical, and optical properties that drive device performance
  • Designing, coordinating, and conducting experiments in various user facilities
  • Contribution to the build-up and installation of Substrate’s own internal research facilities.
  • Recording, processing and interpreting data and results to the wider team
Desired Qualifications
  • 3+ years of hands-on experience in characterization techniques such as electron microscopy and scanning probe microscopy
  • Experience operating a Raith EBPG 5200/5200+, including aligned exposures
  • 1+ years of hands-on experience in inductively coupled plasma etching, with a strong understanding of the principles of plasma etching and recipe parameters
  • Experience in industrial R&D
  • Experience with instrument scoping, procurement, installation, and commissioning
  • Experience with safety procedures and best practices when working with potentially hazardous liquid chemicals

Substrate is developing a new chipmaking system that uses X-ray lithography powered by a proprietary particle accelerator to pattern circuits on silicon wafers. The technology aims to lower lithography costs by about half and is demonstrated at U.S. National Laboratories and in its own facilities. It differentiates itself by pursuing a more vertically integrated U.S. foundry to reduce reliance on overseas fabrication and strengthen supply-chain resilience. The goal is to produce its first chips by 2028 and help bring advanced AI and robotics chips manufacturing back to the United States.

Company Size

11-50

Company Stage

Late Stage VC

Total Funding

$100M

Headquarters

San Francisco, California

Founded

2022

Simplify Jobs

Simplify's Take

What believers are saying

  • Secured $100M funding at $1B valuation from Founders Fund, General Catalyst.
  • Plans $10K wafers by 2030, halving costs versus EUV systems.
  • Met VP JD Vance in March 2025 to cut U.S. semiconductor costs.

What critics are saying

  • ASML's High-NA EUV scales to 2nm by 2028, outpacing Substrate.
  • Particle accelerators fail high-volume due to G-force instability.
  • CEO Proud's non-expertise repeats Intel's 1990s X-ray failures.

What makes Substrate unique

  • Substrate develops particle accelerator-based X-ray lithography rivaling ASML.
  • Vertically integrated U.S. foundry targets AI and robotics chip production.
  • Completed 300mm wafer tool operating at production G-forces in-house.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

Health Savings Account/Flexible Spending Account

Unlimited Paid Time Off

Flexible Work Hours

Remote Work Options

Paid Vacation

Paid Sick Leave

Paid Holidays

Hybrid Work Options

Stock Options

401(k) Retirement Plan

Wellness Program

Mental Health Support

Gym Membership

Phone/Internet Stipend

Home Office Stipend

Corporate Social Events

Company News

Financial Times
Oct 28th, 2025
Silicon Valley chip start-up raises $100mn to take on TSMC and ASML

Substrate plans to use particle accelerators to lower cost of chip manufacturing