Principal Thermal Simulation Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro:

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.

Position Overview:

The Thermal Simulation Engineer will be directly involved in developing new and derivative advanced memory (HBM) packaging technologies, driving Micron’s Thermal advantage by designing premier packages in the APTD team. In this position, you will be influencing the Product power maps, die and package architecture, and Si BEOL design rules, finding efficient package structure and materials to mitigate any potential hot spot issues. The scope of your work will be to address all Thermal aspects of 2.5D and 3D advanced packaging development that are related to design, material and process interactions. In this position you will collaborate with package architecture and design, fab/package assembly process integration, BU teams, and customers. We are looking for a passionate, hard-working, and self-motivated individual with the ability to handle multiple tasks and use good time management while being a great teammate who is optimistic and responsible.

Job Responsibilities:

• Maintain knowledge in semiconductor and advanced electronics packaging technologies such as High Bandwidth Memory (HBM), wafer to wafer (W2W), Chip-On-Wafer (COW), Flip Chip, Through Silicon Vias (TSV), etc.

• Work daily with multi-functional global teams, namely product design, product engineering, Technology Development, Business Unit, manufacturing, and external customers to fully understand the product thermal risks and help optimize the packaging design by simulation support.

• Work with internal/external vendors and testing labs to design and implement effective Thermal testing procedures to characterize materials for simulation analysis.

• Use advanced EDA techniques to develop innovative semiconductor packages and package systems using advanced design tools and thermal simulation applications such as ANSYS, Icepak, Flotherm, and evaluate new AI-assisted EDA tools as needed.

• Work with customers and propose new power maps and cooling solutions on SIP level that provide optimal memory performance.

Minimum Requirements:

• M.S. or Ph.D. in Mechanical Engineering or Materials Science with focus on Thermal Engineering.

• 15 years working experience in relevant engineering areas with at least 10 years of experience on Thermal finite element analysis, modeling, and validation of electronic packages in the semiconductor industry.

• Detailed understanding of package thermal budget and thermal compression bonding process as well as Hybrid and other innovative bonding processing methods.

• Experience with engineering tools such as ANSYS Workbench, APDL, Abaqus, ProE, AutoCAD, Solid Works, and MATLAB.

• Good documentation/reporting skills and the ability to build and improve simulation and procedures for accurate and repeatable results.

Preferred Skills and Knowledge:

• Simulation, modeling, and analysis of thermal problems by multi-physics with Icepak, Flotherm.  

• Ability to leverage global team members and develop new thermal characterization methods for new designs.

• Knowledge in product reliability tests like thermal cycling and other environmental stresses. Ability to understand if there is any power cycling vs Temp cycle Rel data correlation.

• Data acquisition experience, visualization techniques, and numerical analysis proficiency in MATLAB, Excel, JMP, etc.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visitmicron.com/careers

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