About Celestial AI
With the growth in Generative AI, data center infrastructure it is not just about the System on Chip but about the System of Chips. In the era of Accelerated Computing, data center bottlenecks are no longer limited to compute performance, but rather the system’s interconnect bandwidth, memory bandwidth, and memory capacity. Celestial AI’s Photonic Fabric is the next-generation interconnect technology offering a10X increase in performance and energy efficiency over competitive technologies.
The Photonic Fabric™ is available to our customers in multiple technology offerings, including optical chiplets, optical interposers, and Optical Multi-chip Interconnect Bridges (OMIB). This enables our customers to seamlessly integrate high bandwidth, low power, low latency optical interfaces into their AI accelerators and GPUs. The technology is fully compatible with both protocol and physical layers, including standard 2.5D packaging flows. This ease of integration enables XPUs to have optical interconnects for compute-to-compute and compute-to-memory fabrics that deliver tens of Tbps bandwidth with nano-second latencies.
This innovation empowers hyperscalers to improve the efficiency and economics of AI processing by optimizing the XPUs needed for training and inference and significantly lowering the TCO2 impact. To support customer engagements, Celestial AI is cultivating a Photonic Fabric ecosystem. These tier-1 partnerships consist of custom silicon/ASIC design, system integrators, HBM memory, assembly, and packaging suppliers.
In this role you will utilize your in-depth 2.5D assembly process experience and partner management experience to drive company’s AI products from concept to high volume manufacturing. You will be responsible for managing and driving the assembly process technology development in close collaboration with foundries and OSATs to ensure design for manufacturing, reliability, and cost. Responsibilities will include identification and mitigation of risk to new technologies used in product integration and ensure factory readiness through maturing product during the NPI phase. This job will require you to have hands-on experience in TSV and wafer process development, 2.5D/3D CoW assembly development along with strong project management, written and verbal communication skills as well as a can-do attitude to prioritize and address issues with a high sense of urgency.
We offer great benefits (health, vision, dental and life insurance), collaborative and continuous learning work environment, where you will get a chance to work with smart and dedicated people engaged in developing the next generation architecture for high performance computing.
Celestial AI Inc. is proud to be an equal opportunity workplace and is an affirmative action employer.
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