Simplify Logo

Full-Time

Principal Engineer

2.5D/3D Process Development

Updated on 10/10/2024

Celestial AI

Celestial AI

51-200 employees

Optical interconnects for hyperscale data centers

Data & Analytics
AI & Machine Learning

Compensation Overview

$160k - $190kAnnually

Senior, Expert

Santa Clara, CA, USA

Bay area location is required.

Category
Embedded Engineering
Software Engineering
Requirements
  • 15+ years of experience in Semiconductor Packaging, Process and Technology Development
  • Expert level understanding of advanced foundry process node and its interaction with Packaging/assembly/substrate across various package technologies is required
  • Expertise in advanced packaging technologies: knowledge and insight to deliver high density/high performance interconnects with TSVs in various 2.5D/3D package form factors
  • Proven track record of bringing products from Technology development, package design/definition, qualification, NPI through HVM is required
  • Working level understanding of cross-functional packaging areas: package architecture, design rules, BOM, enabling material/process technologies, mechanical, design for manufacturing, reliability, and cost
  • Familiarity with component & system level reliability, testing, and FA
  • Experience with photonics packaging will be preferred but is not necessary
  • Experience in project management and communicating technical and project/program status and issue resolution at the executive level
  • Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability
  • Effective communicator and comfortable engaging with internal cross functional teams as well as domestic and overseas suppliers
  • Excellent attention to detail, process and operationally oriented and self-driven with the ability to work independently and take projects to completion with minimum supervision
  • M.S or Ph.D. in Mechanical Engineering, Materials Science or Physics is required
Responsibilities
  • Work with cross-functional packaging teams and lead TSV, backend stack development at the foundry along with 2.5D/3D CoW process development at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies
  • Actively manage qualification of packages with sensitivity to physics of failures for high thermo-mechanical reliability, while operating within established cost constraints
  • Manage internal and external resources effectively and efficiently towards established corporate milestones
  • Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI

Celestial AI focuses on enhancing the performance of hyperscale data centers through its technology called Photonic Fabric™, which is an optical compute interconnect. This technology improves memory sharing by reducing the total DRAM requirements by up to 35%, leading to significant cost savings for data centers. It achieves this by utilizing optical interconnects that lower power consumption and increase bandwidth capacity, which is crucial for multi-tenant cloud environments where lower latency memory pooling can save around 23%. Additionally, Celestial AI's technology enables the disaggregation of High Bandwidth Memory (HBM) by using optics instead of traditional PCIe connections, addressing future needs for higher bandwidth connections among compute units. The company aims to provide this optical connectivity to data centers, facilitating advancements in Generative AI and other complex computing tasks, positioning itself as a key player in the evolution of advanced computing.

Company Stage

Series C

Total Funding

$337.9M

Headquarters

Sunnyvale, California

Founded

2020

Growth & Insights
Headcount

6 month growth

8%

1 year growth

23%

2 year growth

131%
Simplify Jobs

Simplify's Take

What believers are saying

  • The recent $175 million Series C funding round, led by prominent investors, underscores strong financial backing and growth potential.
  • Appointment of industry veteran Diane Bryant to the Board of Directors brings valuable expertise and credibility to the company.
  • Adoption of Photonic Fabric™ by leading hyperscalers indicates market validation and potential for widespread industry impact.

What critics are saying

  • The highly competitive nature of the high-performance computing market could challenge Celestial AI's ability to maintain its technological edge.
  • Dependence on the successful integration and adoption of Photonic Fabric™ technology by hyperscalers and other partners poses a risk if market acceptance is slower than anticipated.

What makes Celestial AI unique

  • Celestial AI's Photonic Fabric™ technology offers a unique optical compute interconnect that significantly reduces DRAM requirements and power consumption, setting it apart from traditional data center solutions.
  • The company's focus on disaggregating HBM over optics instead of PCIe provides a forward-looking approach to meet future bandwidth and latency needs, unlike competitors relying on conventional interconnects.
  • Strategic collaborations with hyperscalers and AI computing providers enable Celestial AI to address critical performance chokepoints, positioning it as a leader in advanced AI infrastructure.

Help us improve and share your feedback! Did you find this helpful?