Full-Time

Principal Engineer

2.5D/3D Process Development

Confirmed live in the last 24 hours

Celestial AI

Celestial AI

51-200 employees

Optical interconnects for high-performance computing

Data & Analytics
Hardware
AI & Machine Learning

Compensation Overview

$160k - $190kAnnually

+ Equity Grant

Expert

Santa Clara, CA, USA

Bay area location is required.

Category
Embedded Engineering
Software Engineering
Requirements
  • 15+ years of experience in Semiconductor Packaging, Process and Technology Development
  • Expert level understanding of advanced foundry process node and its interaction with Packaging/assembly/substrate across various package technologies is required
  • Expertise in advanced packaging technologies: knowledge and insight to deliver high density/high performance interconnects with TSVs in various 2.5D/3D package form factors
  • Proven track record of bringing products from Technology development, package design/definition, qualification, NPI through HVM is required
  • Working level understanding of cross-functional packaging areas: package architecture, design rules, BOM, enabling material/process technologies, mechanical, design for manufacturing, reliability, and cost
  • Familiarity with component & system level reliability, testing, and FA
  • Experience with photonics packaging will be preferred but is not necessary
  • Experience in project management and communicating technical and project/program status and issue resolution at the executive level
  • Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability
  • Effective communicator and comfortable engaging with internal cross functional teams as well as domestic and overseas suppliers
  • Excellent attention to detail, process and operationally oriented and self-driven with the ability to work independently and take projects to completion with minimum supervision
  • M.S or Ph.D. in Mechanical Engineering, Materials Science or Physics is required
Responsibilities
  • Work with cross-functional packaging teams and lead TSV, backend stack development at the foundry along with 2.5D/3D CoW process development at OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies
  • Actively manage qualification of packages with sensitivity to physics of failures for high thermo-mechanical reliability, while operating within established cost constraints
  • Manage internal and external resources effectively and efficiently towards established corporate milestones
  • Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI

Celestial AI focuses on enhancing the performance of hyperscale data centers through its technology called Photonic Fabric™, which is an optical compute interconnect. This technology improves memory sharing efficiency, allowing data centers to reduce their Dynamic Random Access Memory (DRAM) needs by up to 35%, leading to significant cost savings. By utilizing optical interconnects, Celestial AI not only lowers power consumption but also increases bandwidth capacity, which is crucial for multi-tenant cloud environments where lower latency memory pooling can save around 23%. Additionally, the technology enables the disaggregation of High Bandwidth Memory (HBM) by using optics instead of traditional PCIe connections, addressing future demands for higher bandwidth in computing. Celestial AI aims to provide data centers with this optical connectivity to support advanced applications like Generative AI, positioning itself as a key player in the evolution of high-performance computing.

Company Stage

Series C

Total Funding

$329.6M

Headquarters

Sunnyvale, California

Founded

2020

Growth & Insights
Headcount

6 month growth

15%

1 year growth

34%

2 year growth

128%
Simplify Jobs

Simplify's Take

What believers are saying

  • Acquisition of Rockley Photonics patents enhances Celestial AI's technological capabilities.
  • Diane Bryant's board appointment strengthens leadership with semiconductor and AI expertise.
  • $175 million Series C funding boosts development and scaling of Photonic Fabric.

What critics are saying

  • Competition from Lightmatter and Ayar Labs threatens Celestial AI's market position.
  • Rapid AI and photonics advancements may render current offerings obsolete.
  • Supply chain vulnerabilities in photonic components could disrupt production schedules.

What makes Celestial AI unique

  • Celestial AI's Photonic Fabric™ offers unique optical compute interconnect technology.
  • The company reduces DRAM requirements by up to 35%, saving billions annually.
  • Celestial AI enables HBM disaggregation over optics, surpassing PCIe limitations.

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