Compensation Overview

The Advanced Controller Development (ACD) is part of Samsung’s Memory Business Unit, the industry’s technology and volume leader in DRAM, NAND Flash.  ACD’s vision is to solve key problems of Cloud & Data center by developing the new technology for memory and storage. We are an integral part of Samsung’s strong R&D focus & lab innovation engine. We work closely with development teams to bring feature innovation to product roadmaps.

Come join the team that is creating new computing system architectures needed to support emerging machine learning applications, data analytics and edge computing. You’ll focus on enhancement of memory and storage capability by developing the prototype controller and optimizing it for mass production.

What You’ll Do

• Design and/or provide guidance on data path in HBM buffer die
• Participate in defining architecture of PHY design for TSV
• Perform timing and power analysis on data path in HBM buffer die
• Work closely with HBM development team and SoC team to come up with the best architectural solutions
• Participate in the definition of HBM buffer die architecture
• Guide physical design team on SI/PI

Location: Hybrid with at least 3 days in office in San Jose, CA office location remainder of time to work remotely

Job ID # 41923

What You Bring

• Bachelors with 15+ years of relevant industry experience, or Masters with 13+ years or PhD with 10+ years in electrical engineering or related technical field preferred
• Experience in data path design of HBM including buffer die
• Expert level knowledge in HBM data path from a buffer die to a core die through TSV
• Extensive knowledge of CMOS circuit design and device physics
• Extensive knowledge of schematic entry and simulation using Finesim and/or Hspice
• Well versed in DRAM and HBM technology
• Self-motivated problem-solver with an ability to work well in a team
• Resourceful Achiever: self-motivated and proactive, you flex to try new approaches and creatively solve problems 
• Devoted Professional: you are diligent and deliberate in your work, leveraging your expertise to deliver results without ego  
• Thoughtful Collaborator: you build relationships across teams, offering help and welcoming ideas from others to drive work forward in an inclusive manner
• Experience in custom circuit design in memory process
• Experience in HBM buffer die and/or core die design
• Experience and/or knowledge of the emerging technologies (UCIe, Processing in memory) in server memory and storage systems
• Highly motivated with good verbal and written communication skills
• Creativity in problem solving
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.

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