Full-Time
Solutions Architect
Baya Systems
51-200 employees
Develops software-driven NoC designs for SoCs
No salary listed
Austin, TX, USA
In Person
Master's
 Solution Engineering |
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- 10+ years of experience in designing or supporting complex System-on-Chip (SoC), from architecture definition to tape-out, addressing implementation challenges on advanced process nodes
- 5+ years of experience in a solution architecture or customer-facing technical role is preferred
- Master’s degree in electrical engineering, Computer Engineering, or related field is preferred
- Serve as the primary technical point of contact for general or specialized solutions built on Baya technology, providing guidance and support throughout the product development lifecycle
- Assist in the design and implementation of customized solutions to meet customer-specific requirements
- Develop and deliver technical presentations, demonstrations, and training sessions to customers, partners, and internal teams
- Stay current with industry trends, technologies, and standard methodologies to effectively advise customers on product development strategies
- Provide timely resolution to customer inquiries, issues and concerns, ensuring high levels of customer satisfaction
- Understanding of RAS and reliability for enterprise and infrastructure markets is a plus
- Understanding of functional safety standards and certification
- Excellent communication and interpersonal skills, with the ability to effectively engage with customers, colleagues, and partners at all levels
- The role will involve travel to customer sites and events
- Master’s degree in electrical engineering, Computer Engineering, or related field is preferred
Baya Systems develops intelligent, software-driven Network on Chip (NoC) solutions to improve data movement in System on Chips and chiplets. Its flagship WeaveIP family uses a common transport fabric that can be tailored to any topology and supports custom protocols, with WeaverPro software that models and optimizes the network to meet target workloads, delivering up to 4 TB/s per cluster and scalable to multi-PB/s. The approach combines data-driven topology, a unified fabric for both coherent and non-coherent protocols, and a strong toolchain for performance guarantees and debugging. The goal is to enable scalable, cost-effective AI and data-center systems across AI accelerators, automotive, and IoT.
Company Size
51-200
Company Stage
Series B
Total Funding
$36M
Headquarters
Santa Clara, California
Founded
2023
Get referred to Baya Systems
See people who can refer or advise you
Simplify's Take
What believers are saying
- June-July 2026 partnerships with Openchip and Kandou AI expand commercial credibility fast.
- September 2026 AdoreSys partnership opens China and Asia-Pacific distribution channels.
- Cambridge and Japan expansions position Baya near semiconductor hubs and talent pools.
What critics are saying
- Baya still depends on a few partner wins; one lost socket stalls revenue.
- Synopsys, Cadence, and Arm control adjacent IP ecosystems and can bundle against Baya.
- If chiplet adoption slows in 2027, Baya’s niche fabric IP faces existential demand collapse.
What makes Baya Systems unique
- WeaveIP and WeaverPro jointly model fabric before RTL, cutting chiplet design risk.
- Baya targets AI, HPC, automotive, and edge with protocol-agnostic, software-defined interconnects.
- Openchip, Kandou AI, and Tenstorrent validate Baya’s fabric across real 2026 deployments.
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Benefits
Health Insurance
Dental Insurance
Vision Insurance
401(k) Retirement Plan
Company Equity
Performance Bonus
Growth & Insights and Company News
6 month growth
↑ 18%1 year growth
↑ 18%2 year growth
↑ 36%Baya Systems and AdoreSys expand advanced semiconductor IP in Asia. This post contains affiliate links, and I will be compensated if you make a purchase after clicking on my links, at no cost to you. Baya Systems has recently chosen AdoreSys as a strategic partner to significantly expand the availability of its advanced semiconductor intellectual property throughout China and the broader Asia-Pacific region. This new alliance is designed to directly target the growing regional demand for highly scalable, high-performance system-on-chip architectures. For further insights into hardware components, exploring various optics articles can offer foundational technical context. AdoreSys plans to utilize its extensive regional expertise, strong customer relationships, and specialized technical support to help local chip designers seamlessly integrate Baya's market-leading solutions. Baya Systems is widely recognized for its cutting-edge fabric and cache coherent IP solutions, which optimize power efficiency and data movement in demanding computing environments. Table of Contents Expanding semiconductor horizons in Asia. The strategic collaboration arrives at a critical juncture when modern data centers, artificial intelligence, and advanced automotive applications are driving unprecedented design complexity. Regional developers across key Asian markets will now gain access to closer collaboration, faster deployment cycles, and tailored technical guidance. Driving next-generation computing forward. By streamlining the integration process, both organizations anticipate a major acceleration in time-to-market for regional developers building advanced processors. This agreement not only solidifies Baya Systems' expanding global footprint but also equips Asian semiconductor innovators with world-class intellectual property to tackle modern computational challenges. As the industry continues to evolve rapidly, maintaining an eye on broader technological advancements remains essential for engineering success. Enthusiasts can also explore product reviews to stay informed about related precision tools and hardware innovations. Additional Reading:
Baya Systems expands Japan presence to target AI and chiplet design. Article by: Baya Systems. Baya Systems is strengthening its Japan presence as semiconductor companies adopt chiplets and scalable architectures for AI and HPC. Baya Systems is expanding its operations into Japan, targeting semiconductor companies, foundries and technology providers developing AI, high-performance computing (HPC), automotive and chiplet-based systems. The company, which develops software-driven, chiplet-ready semiconductor fabric IP, said the expansion includes local technical and field resources to support growing demand for system-level IP in Japan's semiconductor ecosystem. Japan is increasing investment in advanced semiconductor manufacturing and AI infrastructure, creating opportunities for technologies that address data movement, interconnect scalability and system-level design complexity. Baya's modular fabric architecture and design software are intended to optimize communication across complex SoCs and chiplet-based systems, helping reduce data-movement bottlenecks while improving scalability, performance and efficiency. As part of its Japan expansion, Baya is collaborating with Tenstorrent on a test chip currently under development that incorporates Baya's WeaveIP fabric IP. The collaboration is intended to demonstrate scalable, software-defined data movement for AI and compute architectures. "Japan is emerging as one of the most important centers for AI silicon innovation," said Nandan Nayampally, Chief Commercial Officer at Baya Systems. "AI is fundamentally changing semiconductor architecture, from spec to deployment, and as companies adopt chiplet architectures and AI-specific silicon, they need system IP that lets them scale without adding design complexity. Japan represents one of the most exciting opportunities to collaborate with industry leaders shaping the future of AI silicon, and we're ready to support that growth." Under the collaboration, Tenstorrent is incorporating WeaveIP into next-generation chiplet solutions that include systems based on TT-Ascalon, its high-performance RISC-V CPU, and Tensix Neo, its AI accelerator IP. "Tenstorrent is proud to support Japan's rapidly growing semiconductor ecosystem. Our collaboration with Baya brings together high-performance compute and scalable, software-defined data movement to address the growing demands of AI and HPC in chiplet solutions," said Aniket Saha, Vice President of Product Strategy at Tenstorrent. Japan represents the latest expansion of Baya's international operations following its presence in North America, Europe and India. The company plans to develop its footprint through customer engagements, ecosystem partnerships and industry events across the region.
Baya Systems and Kandou AI partner to tackle AI Memory Wall. July 14, 2026 Press play to listen to this content Baya's WeaveIP fabric and WeaverPro software accelerating architecture development for Kandou's 448G copper AI connectivity platform SANTA CLARA, Calif. and SAINT-SULPICE, Switzerland, July 14, 2026 - Baya Systems, a leader in software-defined fabric IP for AI and high-performance computing, and Kandou AI, a pioneer in high-speed connectivity for AI infrastructure, today announced a strategic IP licensing agreement. Kandou AI has licensed Baya's WeaveIP fabric and WeaverPro software platform and is actively deploying both across its architecture and development workflow for the next generation of its connectivity platforms to overcome the memory wall constraining further AI development. The collaboration also demonstrates how software-defined fabric architecture and advanced connectivity work together to address the data movement bottleneck limiting next-generation AI systems. Attacking the Memory Wall AI model growth has outpaced memory bandwidth by orders of magnitude. While compute has scaled 60,000x over two decades, interconnect has managed just 30x. This clear mismatch is stymieing further AI development, since data simply can't move at the speeds compute requires. Kandou AI's patented Copper MIMO technology (aka Chord Signaling) is closing that gap by sending correlated signals at real-time data processing speeds of 448 Gbps and beyond, providing the industry with strong alternatives to optical interconnects for a broad class of AI infrastructure applications. By using Copper Multiple Input Multiple Output (MIMO) technology, Kandou can deliver 10X the efficiency of conventional alternatives at reduced power, costs and greater scalability. The economic impact is direct: faster, denser, cheaper AI systems. While Kandou advances the physical layer of AI connectivity, Baya's software defined fabric platform optimizes data movement for complex heterogeneous compute, memory, I/O on die and across multiple chiplets. Together, the technologies enable customers to architect AI systems that are not only faster, but also easier to design, validate, and scale. "Solving the memory wall is a system-level challenge. Our breakthrough signaling technology is only one part of a broader AI system. We need a fabric architecture that can move data with the precision and efficiency our products demand," said Srujan Linga, Co-Founder and CEO of Kandou AI. "Baya's WeaveIP complements our interconnect technology. We provide physical scalability, with WeaveIP providing logical scalability to system design. Users are seeing in practice that WeaverPro significantly accelerates development timeline". Software-Driven Architecture, Faster to Silicon Kandou AI selected WeaverPro to assist the exploration and validation of on-chip interconnect configurations, such as traffic class partitioning, QoS policy and protocol adaptation, before reaching the critical Register-Transfer Level phase of design and development. Because Baya's tiled implementation methodology assembles verified fabric primitives into a configurable architecture, Kandou AI anticipates significant acceleration of development cycles and time to market. "The tiled implementation approach is a genuine competitive advantage for teams working at our pace," Linga continued. "Baya's technical expertise and collaborative engagement has made them a true extension of our own engineering organization." A Partnership Built on Technical Alignment The engagement reflects a broader convergence: both companies are building for an AI infrastructure landscape where data movement, which gates the scaling of compute, is the chief challenge to be solved. It accelerates the trend in the semiconductor industry towards modular AI architectures, where innovation depends on combining best in class connectivity, compute, memory and system fabrics. "Kandou AI represents exactly the kind of customer Baya was designed to serve," said Dr. Sailesh Kumar, Founder and CEO of Baya Systems. "They are attacking a real and fundamental problem, and they need a fabric platform that pushes beyond the data movement limitations of traditional NoC and enables them to realize their ambition. WeaveIP and WeaverPro offer the architectural freedom and implementation velocity to achieve that without compromise." The engagement further validates Baya's growing role as the architectural foundation for next-generation AI infrastructure. As customers increasingly adopt chiplets, heterogeneous compute, and custom AI accelerators, software-defined fabrics are becoming a critical layer for optimizing data movement across the entire system. About Kandou AI Kandou AI is pioneering the next generation of connectivity for AI infrastructure. Its innovative Copper MIMO (aka Chord Signaling) technology - developed over more than a decade and rooted in information theory - enables high-speed, energy-efficient copper-based interconnects that extend performance beyond what conventional SerDes can achieve. Kandou AI is backed by leading technology investors including Maverick Silicon, BVP, Capital Group, SoftBank, Synopsys, Cadence and Alchip. About Baya Systems Baya Systems is a Series B semiconductor IP company pioneering software-defined, chiplet-ready fabric technology for AI, HPC, automotive and edge applications. Its WeaveIP fabric and WeaverPro software platform deliver a unified, protocol-agnostic interconnect solution purpose-built for the demands of next-generation AI systems. Headquartered in Santa Clara, California, Baya Systems is backed by leading technology investors and has been recognized by Frost & Sullivan for Technology Innovation Leadership in Semiconductor IP Interconnect Solutions. Scientists have relied on HPC facilities to help them process large volumes of data, execute... Raw performance has long been the benchmark for success in HPC. However, as AI and... It's easy to get bogged down micromanaging HPC infrastructure. But focus too much on one... The buzz of Hamburg, Germany over the past two days has been LineShine, the Chinese... HPE rolled out several new products at ISC 2026 this week, including support for multi-tenancy... Nvidia this week highlighted an early deployment of its Vera CPU at Los Alamos National...
Baya Systems, a semiconductor fabric IP company, has partnered with Openchip, a European semiconductor and AI systems leader. Openchip has licensed Baya's data-movement platform and Network-on-Chip fabric technology to develop next-generation intelligent compute solutions. Openchip will use Baya's WeaveIP unified fabric and WeaverPro FabricStudio platform to design RISC-V-based multi-chiplet systems for AI workloads. The technology enables architects to model and validate data movement architecture before physical silicon production, reducing development risk and optimising power-performance-area at scale. The partnership supports Baya's European expansion following its Cambridge office opening earlier this year. The company is evaluating locations for its first EU office. Barcelona-headquartered Openchip operates across six European countries: Spain, Italy, Poland, France, Germany and Ireland.
Openchip adopts Baya Systems' WeaveIP fabric for AI and RISC-V platforms. Production Editor Embedded Computing Design June 11, 2026 Baya Systems and Openchip announced the companies have entered a strategic partnership. Openchip is licensing Baya Systems' data-movement platform and Network-on-Chip (NoC) fabric technology to offer solutions enhanced for increasing demands of next-generation intelligent computing. Openchip will employ Baya's WeaveIP unified fabric to design specialized intelligent compute systems for AI workloads. Baya's WeaverPro FabricStudio platform enables Openchip to design and boost the development of RISC-V-based multi-chiplet systems. Openchip reduces development risk, cuts time-to-market, and optimizes power-performance-area (PPA) at scale by using Baya's software-driven platform to model and validate data movement architecture prior to committing to physical silicon. "The communication layer between memory and compute is the critical connective tissue of the AI stack. Our collaboration with Openchip enables them to address data movement explicitly and early to build their state-of-art systems with the performance and efficiency the market now demands within the ever-shrinking time-to-market window," said Dr. Sailesh Kumar, CEO and founder of Baya Systems. Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design's Daily. He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more. Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master's in education.