Full-Time
Senior Place and Route Engineer
Updated on 9/4/2026
Omni Design Technologies
51-200 employees
Licenses high-performance IP cores for SoCs
No salary listed
Bengaluru, Karnataka, India
Hybrid
Bachelor's
 Hardware Engineering (1) |
|---|
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- Physical design experience with recent successful tapeouts in deep-submicron and FinFET technologies.
- Experience with partition-level place-and-route implementation, including floorplanning, clock and power distribution, timing closure, and physical and electrical verification.
- Strong knowledge of physical-design construction and analysis flows and methodologies.
- Ability to execute to stringent schedule and die-size requirements.
- Experience with industry-standard physical-design tools and understanding of their capabilities and underlying algorithms.
- Experience with large system-on-chip or intellectual-property designs operating at frequencies above 500 MHz.
- At least 5 years of experience in place-and-route flows at a product company.
- Working experience with 16 nm FinFET and lower technology nodes.
- Working knowledge of Verilog or VHDL.
- Exposure to low-power techniques.
- Proficiency in Tcl and Python scripting.
- Drive the required digital backend flows to create designs.
- Work closely with the RTL design team to understand partition architecture and drive physical aspects early in the design cycle.
- Resolve physical-design and flow issues, identify potential solutions, and drive execution.
- Perform floorplanning and placement, clock-tree synthesis, and routing.
- Perform layout-versus-schematic, design-rule-check, and antenna checks, and generate GDSII and .lib files.
- Perform electromigration-violation checks and analyze signal-integrity issues such as crosstalk.
- Perform physical verification and IR-drop analysis, and generate SPEF files.
- Execute the full RTL-to-GDSII flow, including floorplanning, clock-tree synthesis, place-and-route, design-rule checking, layout-versus-schematic, signal integrity, and IR-drop analysis.
- Use Cadence place-and-route, floorplanning, IR-drop, and physical-verification tools.
Omni Design Technologies delivers high-performance, ultra-low power IP cores for mixed-signal SoCs that power devices across 5G, LiDAR, automotive networks, AI, image sensing, and IoT. It develops and validates IP blocks and licenses them to chip makers, offering customization and support to ensure seamless integration into customer designs. The cores are designed to work on FinFET processes down to 28nm, with proven silicon such as gigasample low-power ADCs and DACs on TSMC 28nm. The company differentiates itself through validated, silicon-proven IP, deep collaboration with customers and partners (e.g., LeddarTech, MegaChips), and a global design footprint (new Fort Collins design center). Its goal is to enable customers to build sophisticated, power-efficient, mixed-signal SoCs quickly by providing ready-to-license IP plus engineering services that fit their specific needs.
Company Size
51-200
Company Stage
Series A
Total Funding
$35M
Headquarters
Milpitas, California
Founded
2015
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Simplify's Take
What believers are saying
- September 17, 2025 Series A raised over $35 million from CDIB-TEN and others.
- February 6, 2026 CPO development positions Omni for AI data-center interconnect demand.
- 2026 hiring added Hinesh Shah, Poh Sim Gan, and expanded European recruiting.
What critics are saying
- Omni sells IP, so delayed customer tape-outs directly defer revenue recognition.
- Broadcom, Marvell, and Astera Labs compress pricing in optical I/O and data-converter IP.
- If 3nm CPO adoption stalls, Omni remains a niche licensing shop with limited scale.
What makes Omni Design Technologies unique
- Omni Design builds ultra-low-power analog IP for 3nm and 28nm nodes.
- Its 200G-class CPO AFE targets 224Gb/s PAM4 with integrated TX driver and TIA.
- The company spans data converters, optical I/O, radar, and 5G/6G connectivity.
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Growth & Insights and Company News
6 month growth
↑ 21%1 year growth
↑ 21%2 year growth
↑ 21%Omni Design Technologies has announced advancements in its 200G-class Co-Packaged Optics analogue front-end intellectual property portfolio for AI infrastructure. The development includes a high-swing linear transmit driver and low-noise receive transimpedance amplifier using advanced 3nm process technology. The CPO AFE products address power and bandwidth challenges in data centres by positioning optical I/O closer to switch and compute packages, enabling higher density and lower energy consumption per bit. The technology supports 224Gb/s PAM4 throughput with programmable transfer functions for robust link performance. The advancement expands Omni Design's portfolio beyond ultra-high-speed data conversion, targeting both optical and electrical interconnects for AI data centres. The company, founded in 2015 and headquartered in Milpitas, California, specialises in wideband signal processing solutions for AI infrastructure and networking applications.
Omni Design Technologies appoints Hinesh Shah as Vice President of Strategic Sales. Veteran semiconductor sales leader to accelerate global revenue growth and expand strategic customer partnerships across AI, data center, 5G/6G, satellite communication and automotive markets. MILPITAS, Calif., December 18, 2025-(BUSINESS WIRE)-Omni Design Technologies, a leading provider of high-performance, ultra-low power Wideband Signal Processing(TM) solutions, today announced the appointment of Hinesh Shah as Vice President of Strategic Sales. In this role, Shah will lead global sales strategy and execution, focusing on accelerating revenue growth, expanding strategic customer partnerships, and supporting increased demand across key markets. "We are thrilled to welcome Hinesh to the Omni Design leadership team as we execute our strategy to usher in the next phase of rapid growth for the company," said Dr. Kush Gulati, Co-founder, President, and CEO of Omni Design Technologies. "Hinesh's deep experience strategically growing revenue across a broad range of semiconductor technologies is critical as we scale the adoption of our high-performance, ultra-low power Wideband Signal Processing(TM) solutions." Hinesh Shah brings over 25 years of experience accelerating revenue growth and building high-performing sales organizations in the semiconductor industry. Shah previously held leadership positions at prominent semiconductor companies, such as Astera Labs, amsOSRAM, Maxim Integrated, SiTime, and Avago Technologies (now Broadcom). "Omni Design Technologies is a recognized leader in ultra-low power data conversion solutions, a foundation for the next wave of innovation in AI infrastructure, 5G/6G, space-based cellular networks and automotive ADAS (Advanced Driver Assistance Systems)," said Hinesh Shah, Vice President of Strategic Sales, Omni Design Technologies. "I am excited to join this dynamic team and leverage my experience to deepen customer partnerships and drive the strategic initiatives that will define the company's market leadership for years to come." Omni Design Technologies is expanding its team across engineering, product, and sales roles to accelerate innovation and support growing customer demand for its advanced analog and mixed-signal IP portfolio. Open positions can be found at www.omnidesigntech.com/company/careers. Visit Omni Design Technologies at CES 2026, January 6-9, in Las Vegas Omni Design Technologies experts will be onsite at CES 2026 to discuss how its high-performance low-power Wideband Signal Processing(TM) solutions are enabling next-generation AI, data center, 5G/6G, satellite communication, and automotive ADAS applications. To schedule a meeting, please contact [email protected].
Omni Design Technologies, a leader in Wideband Signal Processing™ solutions for the AI data revolution, today announced that it has successfully raised over ...
Omni Design Technologies, a Milpitas, California-based leader in Wideband Signal Processing(TM) solutions for the AI data revolution, raised over $35m in Series A equity financing round.
Omni Design Technologies has secured over $35 million in Series A funding to enhance its leadership in Wideband Signal Processing™ for the AI data revolution.