Full-Time
Linux Kernel Engineer
Posted on 5/16/2026
Intel
10,001+ employees
Pioneers microprocessors, CPUs for PCs
Compensation Overview
$128.9k - $211.2k/yr
Company Historically Provides H1B Sponsorship
Hillsboro, OR, USA
Hybrid
Hybrid work model; split time between on-site at Hillsboro, OR and off-site.
 Software Engineering (1) |
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- Bachelor's degree in Computer Science, Electrical Engineering, or related field with minimum 4 years of experience in the following: Experience with system software, OS development experience. Experience contributing to an open-source project. Experience in C programming and/or debugging tools.
- Design, develop, and maintain Linux kernel features, subsystems and device drivers
- Optimize kernel performance for specific hardware platforms and use cases
- Independently debug kernel issues including crashes, deadlocks, and performance bottlenecks
- Port and adapt kernel code for new hardware architectures and platforms
- Collaborate internally and externally to drive upstream able system software solutions for our Linux
- Participate in code reviews both internally and on public mailing lists
- Provide input for architectural decisions for system-level software design
- Collaborate with software and hardware teams on specifications and requirements
- Contribute to technical documentation and knowledge sharing
- Advanced degree in Computer Science, Electrical Engineering, or related field
- Linux kernel development experience
- 5+ years of Linux kernel or systems programming experience
- Demonstrated upstream Linux kernel contributions
- Track record of delivering complex technical projects independently
- Experience with kernel debugging tools (GDB, ftrace, perf, etc.)
- Experience in the areas of Intel Architecture, memory management, virtualization, performance and scalability, I/O or device drivers.
- Experience collaborating with a diverse, distributed team
- Detail-oriented with strong debugging and troubleshooting skills
- Strong commitment to improving the Linux kernel project and healthy open-source development environments
- Experience developing in an open-source environment
Intel designs and manufactures semiconductor chips, with a focus on microprocessors for personal computers, servers, and other devices. Its core product is the CPU on a single silicon chip, which executes instructions, handles arithmetic and logic operations, and coordinates the work of other computer components. Intel originated in memory chips but shifted decisively to microprocessors in the 1980s, becoming a central supplier for the PC era after the IBM partnership and its famous x86 processor line. This shift, large-scale manufacturing, and close ties with computer makers set Intel apart from competitors who remained focused on memory or other components. The company aims to power computing by delivering high-performance, energy-efficient silicon solutions that drive a wide range of computing devices and applications.
Company Size
10,001+
Company Stage
IPO
Headquarters
Santa Clara, California
Founded
1999
Simplify's Take
What believers are saying
- Apple test production on 18A-P could validate Intel Foundry by 2027.
- Googlebook design-ins with Acer, ASUS, Dell, HP, and Lenovo expand client reach.
- Panther Lake R targets industrial embedded systems needing rugged, deterministic silicon.
What critics are saying
- Apple still sources 90% of chips from TSMC, limiting Intel's volume upside.
- Terafab depends on Elon Musk's execution, funding discipline, and schedule stability.
- Googlebook's premium Chromebook positioning faces weak demand and uncertain app compatibility.
What makes Intel unique
- Intel ties foundry, client, and trust services into one silicon platform.
- 18A and 14A give Intel a credible U.S. leading-edge manufacturing path.
- Intel Trust Authority supplies independent attestation for regulated confidential computing.
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Benefits
We Invest in Your Life and Career: Intel offers a complete and competitive package of benefits1 that demonstrates how much we care for employees and their families through every stage of life.
Great Minds Deserve Great Rewards: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs.
Intel Fuels Career Acceleration: Curiosity drives us to change the world. We provide employees opportunities to expand their knowledge, leadership abilities, and skill set.
Vacation, Holidays, and More: We offer opportunities for employees to refresh and recharge—from paid vacation time and holidays to flexible time off programs.
Health Benefits for the Whole You: We provide multiple benefits and resources to help employees take care of themselves and their families.
Growth & Insights and Company News
6 month growth
↑ 0%1 year growth
↑ 0%2 year growth
↑ 1%Intel Panther Lake R appears in Linux patch as ruggedized Panther Lake variant. Panther Lake R appears. Intel appears to be preparing a ruggedized version of Panther Lake for industrial and embedded systems. A new Linux kernel patch posted by Intel introduces Panther Lake R. Surprisingly, this does not refer to 'Refresh,' which is a common letter Intel uses for such systems. Apparently, the patch identifies it as a derivative of Panther Lake with P-cores and low-power E-cores intended for harsh environments. Phoronix reports that the new variant uses model ID 223, while existing Panther Lake SoCs use model ID 204. The separate model ID suggests this is not just a regular Panther Lake chip with a wider operating temperature rating. The patch itself does not confirm all changes, but a new ID usually means the kernel may need to handle the silicon differently in some areas. "Derivative of Panther Lake with P-cores and low power E-cores intended for use in harsh environments." Intel already offers Series 3 for edge and embedded systems. The company says these systems support extended temperature operation, deterministic performance, and 24/7 reliability. Intel's own product page also mentions industrial-grade operating conditions from -40°C to +100°C on select SKUs. So I'm curious, what's the actual difference for Panther Lake R here, even greater temperature support, special features
Intel CEO Lip-Bu Tan joins groundbreaking of 3D Glass Solutions facility in Bhubaneswar. Bhubaneswar: Intel CEO Lip-Bu Tan Sunday said that the Rs 2000 crore 3D Glass Solution project in Bhubaneswar is a major step toward strengthing India's semiconductor ecosystem and advancing global technology collaboration. Joining the groundbreaking ceremony of the Project on virtual mode, the Intel CEO Tan expressed appreciation for the leadership of PM Narendra Modi, whose vision has positioned India as a competitive and trusted semiconductor hub. He also acknowledged Ashwini Vaishnaw and the India Semiconductor Mission for their strategic direction and execution in driving industry growth. Tan extended his gratitude to Odisha CM Mohan Charan Majhi and the government of Odisha for their proactive support and partnership in enabling the project. Emphasizing the future of the semiconductor industry, Tan noted that advanced packaging, heterogeneous integration, and substrate technologies will play a crucial role in performance and innovation. He underscored that 3D Glass Solutions is well-positioned to contribute significantly in this space. Highlighting Odisha's strengths, Tan pointed to its reliable infrastructure, including power, water resources, and a skilled workforce, as key enablers for advanced manufacturing. The new facility is expected to generate high-quality employment, foster local talent, and contribute to building a resilient semiconductor ecosystem in India. Tan concluded by expressing confidence that the project will evolve into a center of excellence, strengthening global supply chains and reinforcing India's role in the semiconductor industry. Odisha CM Majhi today laid the foundation stone for project in Info Valley, Bhubaneswar, in the presence of Union Electronics & IT Minister Aswini Vaishnaw and Odisha Electronics & IT Minister Mukesh Mahalinga. Odisha Chief Secretary Ms. Anu Garg, E & IT Additional Chief Secretary Vishal Dev, Union E & IT Additional Secretary Amitesh Sinha, and 3D Glass Solution President & CEO Babu Mandaba were also present at the event. It may be mentioned here that Intel is associated with 3D Glass Solutions for long.
Intel has launched its Core Series 3 processors, marking the first time in years that non-Ultra Core CPUs feature genuinely new silicon. Codenamed Wildcat Lake, these chips represent a departure from previous non-Ultra models, which relied on the outdated Raptor Lake architecture from 2023's 13th-generation Core family. The new processors use two silicon tiles: a compute tile with up to two Cougar Cove P-cores, four Darkmont E-cores, and Xe3 integrated graphics, plus a platform controller tile. Built on Intel's 18A manufacturing process, they support up to 48GB LPDDR5X-7467 memory and operate at 15W base power. However, the chips' 17 TOPS NPU falls short of Microsoft's 40 TOPS requirement for Copilot+ PC features. Intel claims over 70 designs from partners will launch in coming months.
Intel has hired Samsung Electronics executive vice president Shawn Han to bolster its foundry business as the chipmaker seeks to expand in outsourced chip manufacturing. Han will join Intel next month as general manager of foundry services, reporting to Naga Chandrasekaran, head of Intel's foundry division. The appointment reflects Intel's push to attract customers to its manufacturing operations. Han's extensive experience at Samsung, a major player in contract chipmaking, is expected to support Intel's efforts to compete in the foundry market.
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