Thermal Engineer

What will you do? Responsibilities for this position include but not limited to:

• Perform the thermal design and analysis of semiconductor products, including integrated circuits, packages, modules, and complete systems, ensuring optimal thermal performance and reliability.
• Develop and implement innovative air cooling and liquid cooling solutions for high-power density semiconductor devices, from concept generation to detailed design.
• Conduct thermal simulations using advanced CFD tools (e.g., Icepak, Flotherm, Fluent) to predict temperature distributions, airflow patterns, and heat transfer characteristics.
• Perform thermal design sensitivity analyses, trade-off studies, and optimization to meet performance, cost, and reliability targets
• Perform transient thermal modeling of Rivos packages for thermal/power management.
• Collaborate closely with mechanical, electrical, product engineering, and manufacturing teams to integrate thermal solutions seamlessly into product designs.
• Execute thermal validation testing using wind tunnels, specialized mock-up systems, and other laboratory equipment.
• Utilize data acquisition systems (DAQs), power supplies, thermal cameras, thermocouples, and other relevant instrumentation for accurate thermal measurements.
• Develop and maintain detailed thermal models, documentation, and reports throughout the product development lifecycle.
• Troubleshoot and resolve complex thermal issues during product development, qualification, and field deployment
• Stay abreast of the latest advancements in thermal management technologies, materials, and simulation tools.
• Participate in design reviews, FMEAs, and other quality assurance activities to ensure robust thermal designs.
• Collaborate with CM, OEM and ODM’s to develop mockups, test samples and production parts

Requirements:

• Minimum of 10 years of progressive experience in thermal engineering, specifically within the semiconductor and/or telecom industry.
• Experienced in both air cooling and liquid cooling techniques for high-power electronic devices, covering the entire product lifecycle from development to deployment.
• Experienced in semiconductor packaging. Strong understanding of heat transfer principles (conduction, convection, radiation) and fluid dynamics.
• Proficiency in commercial CFD software packages, including but not limited to Icepak, Flotherm, and other industry-standard tools.
• Hands-on experience with thermal testing methodologies, including the design and execution of experiments using wind tunnels, mock-up systems, and environmental chambers.
• Proven ability to operate and interpret data from Data Acquisition Systems (DAQs), power supplies, thermal cameras, and other relevant thermal measurement equipment.
• Experience with thermal interface materials (TIMs), heat sinks, heat pipes, cold plates, and other thermal management components.
• Useful to have familiarity with OCP thermal/mechanical design guidelines and design of Colo boxes
• Excellent problem-solving skills and a strong analytical mindset.
• Effective written and verbal communication skills, with the ability to present complex technical information clearly and concisely.
• Ability to work independently and as part of a cross-functional team in a fast-paced, dynamic environment.
• Passionate for working in a startup environment. 

Preferred Qualifications:

• Master's degree in Mechanical Engineering required; Ph.D. is a plus.
• Experience with scripting languages (e.g., Python, MATLAB) for data analysis and automation.
• Experience with CAD tools, particularly SolidWorks, for designing and analyzing thermal components and systems.
• Knowledge of reliability testing and failure analysis related to thermal performance.
• Familiarity with industry standards for thermal management in semiconductors.