Full-Time

Principal Physical Design and Integration Lead

Confirmed live in the last 24 hours

Marvell

Marvell

5,001-10,000 employees

Develops semiconductor solutions for data infrastructure

Compensation Overview

$165k - $244.2k/yr

+ Bonus + Equity

Senior, Expert

Company Historically Provides H1B Sponsorship

Westborough, MA, USA

Hybrid

Category
Hardware Engineering
Hardware Validation & Testing
Required Skills
Verilog
Python
Perl
VHDL
Linux/Unix
Requirements
  • Bachelor’s degree in Computer Science, Electrical Engineering, or related fields with 10-15 years of professional experience, or Master’s/PhD with 5-10 years of experience.
  • 3 years of practical experience in physical design at all levels of hierarchy with multiple ASICs/SOCs.
  • Physical design knowledge and experience, from netlist handoff to GDS tape-out.
  • Extensive experience with floorplanning at a sub-system/partition level, considering boundary snap of power/technology and pin assignment.
  • Proficient in running sub-system/partition level signoff, including physical verification (DRC and LVS), along with power integrity (EMIR).
  • Experienced in leading a small team of block-level engineers, coordinating at the sub-system/partition level.
  • Good knowledge of Verilog/VHDL, and a track record of collaboration with RTL team.
  • Good understanding of digital logic and architecture.
  • Proficient in UNIX and shell-based scripting.
  • Knowledge and experience with TCL language.
  • Diligent, detail-oriented, and able to handle assignments with minimal supervision.
  • Must possess good communication skills, be a self-driven individual, and a good team player.
Responsibilities
  • Lead a large complex sub-system/partition through all phases of the design.
  • Be responsible for floorplanning a sub-system/partition, pushing down block boundary and pin assignment to team members.
  • Work with various teams to pull in their required portion of the sub-system, such as DFT and clock distribution teams.
  • Lead a small group of engineers at the block level, ensuring they are progressing, meeting milestones on schedule and quality, and delivering correct outputs.
  • Work closely with block-level PD engineers in debugging and resolving timing and routing issues across all hierarchical levels.
  • Be an active team member on physical design methodology and flow development.
  • Provide technical direction, coaching, and mentoring to employees on your team and others when necessary to achieve successful project outcomes.
  • Write scripts in Perl, Python, and TCL to extract data and achieve productivity enhancements through automation.
Desired Qualifications
  • 5 years of practical experience as a leader of a small team at the sub-system/partition level for multiple ASICs/SOCs.
  • Experience working with timing and clock teams on planning and integration of high-speed clock distribution.
  • 5nm/3nm experience with floor planning.
  • Floor planning and Physical Design with Cadence Innovus.
  • Physical Verification with Siemens Calibre.
  • Power Integrity Signoff with Cadence Voltus.
  • Peripheral IO Pad assignment and associated RDL.
  • Bump assignment planning and collaboration with full-chip and package team.
  • Experience with Analog IP integration and implementation.
  • Knowledge and experience with Python language.
  • Experience with low power design methodology and implementation.
  • Have led or participated in Physical Design and Integration methodology and flow development.

Marvell Technology, Inc. specializes in semiconductor solutions that support data infrastructure for various clients, including telecommunications operators and data centers. The company develops high-performance semiconductor products that facilitate the secure transmission, storage, and processing of data. Their offerings include solutions for computing, security, and networking, which are essential for the growing digital economy, especially with the rise of mobile data and the shift to 5G networks. Marvell operates on a business-to-business model, selling their products to other companies that incorporate them into their own services. Their technology is particularly beneficial for telecommunications operators upgrading to 5G, as it allows for improved network capacity and performance while lowering costs. Marvell aims to be a key partner in enhancing global data infrastructure.

Company Size

5,001-10,000

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

1995

Simplify Jobs

Simplify's Take

What believers are saying

  • Issuance of USD 1 billion bonds boosts R&D investment in AI and 5G sectors.
  • Partnership with Empower strengthens Marvell's power management portfolio for AI data centers.
  • PIVR solution enhances power delivery efficiency in high-performance computing platforms.

What critics are saying

  • Talent shortage in AI and 5G could impact Marvell's innovation capabilities.
  • 2nm technology transition poses challenges in yield and production costs for Marvell.
  • Geopolitical tensions may disrupt Marvell's supply chain and market access.

What makes Marvell unique

  • Marvell's 2nm custom SRAM positions it as a leader in AI infrastructure silicon.
  • Collaboration with Ferric enhances Marvell's power-efficient semiconductor solutions for AI and cloud.
  • Advanced multi-die packaging platform offers cost and performance benefits for data centers.

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Benefits

Health Insurance

401(k) Retirement Plan

401(k) Company Match

Flexible Work Hours

Paid Vacation

Hybrid Work Options

Company News

SDxCentral
Jun 27th, 2025
Ferric, Marvell partner on miniaturized power tech for AI chips

Power conversion specialist Ferric has teamed with Marvell Technology to tackle one of the biggest bottlenecks facing AI and cloud infrastructure: efficient power delivery to increasingly hungry processors.

CBonds
Jun 24th, 2025
New issues: Marvell Technology issued international bonds (US573874AR57, US573874AS31) in the amount of USD 500, USD 500 mln maturing in 2030, 2035 respectively.

On June 23, 2025 issuer Marvell Technology released international bonds (US573874AR57, US573874AS31).• In the amount of USD 500 mln with the coupon rate of 4.75% maturing in 2030. The issues were sold at the price of 99.904% at par.

Forbes
Jun 24th, 2025
Kioxia, StorOne, Phison And Marvell Deliver Storage And Memory For AI

Marvell Technology, Inc. announced that it has expanded its custom technology platform with the launch of a 2nm custom Static Random Access Memory (SRAM), designed to boost the performance of custom XPUs and devices powering cloud data centers and AI clusters.

The Fast Mode
Jun 19th, 2025
Empower, Marvell Launch Integrated Power Solution for AI Data Centers

Empower Semiconductor, the world leader in integrated voltage regulators (IVRs), announced a collaboration with Marvell Technology to develop optimized integrated power solutions for Marvell(R) custom silicon platforms.

EE Journal
Jun 18th, 2025
Marvell Develops Industry's First 2nm Custom SRAM for Next-Generation AI Infrastructure Silicon

Marvell previously introduced its CXL technology for integration into custom silicon to add terabytes of memory and supplemental compute capacity to cloud servers and unveiled custom HBM technology that increases memory capacity by up to 33% while reducing the space and power required for dense high-bandwidth memory (HBM) stacks inside XPUs.