Summer 2025
Posted on 3/4/2025
Manufactures photolithography systems for semiconductors
$17 - $53/hr
Company Does Not Provide H1B Sponsorship
San Jose, CA, USA
This position requires onsite presence to attend in-person work-related events, trainings, and meetings.
This position requires onsite presence to attend in-person work-related events, trainings, and meetings.
This position requires onsite presence to attend in-person work-related events, trainings, and meetings.
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ASML designs and manufactures photolithography systems for semiconductor manufacturing. Its main products are deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography machines that print circuit patterns on silicon wafers, with EUV enabling smaller features. The company sells these systems to leading chipmakers and earns substantial revenue from installation, maintenance, and upgrades over the machines’ lifetimes. Its goal is to help continue scaling semiconductors by leading in high-end lithography and maintaining strong relationships with customers like TSMC, Samsung, and Intel.
Company Size
10,001+
Company Stage
IPO
Headquarters
Veldhoven, Netherlands
Founded
1984
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Flexible Work Hours
Remote Work Options
ASML raises 2026 outlook as AI chip demand lifts Q2 earnings. ASML raises 2026 outlook as AI chip demand lifts Q2 earnings. Source: hhahn, CC BY-SA 3.0, via wikimedia commons. Wednesday, July 15, 2026 5:33 AM UTC ASML Holding (AS: ASML) reported stronger-than-expected second-quarter 2026 earnings on Wednesday, fueled by robust demand for artificial intelligence (AI) chip manufacturing equipment and higher sales from its installed base business. The Dutch semiconductor equipment maker also lifted its full-year revenue forecast, reinforcing confidence in long-term AI-driven growth. The company posted net income of €2.92 billion, exceeding analysts' consensus estimate of €2.62 billion. Quarterly net sales climbed to €9.33 billion, up from €8.77 billion in the previous quarter, while gross margin improved to 54%from 53%. Discover more Machine Learning & Artificial Intelligence Econotimes Chief Executive Christophe Fouquet said the quarter outperformed the company's guidance, largely due to stronger-than-expected Installed Base Management sales. He added that continued investments in AI infrastructure and advances in AI technologies are boosting demand for advanced logic and memory chips, giving customers greater confidence to expand production capacity. For the third quarter, ASML expects revenue between €11 billion and €12 billion, well above the consensus forecast of €10.10 billion. Gross margin is projected at 55% to 57%. The company also raised its full-year 2026 revenue guidance to €43 billion to €45 billion, surpassing the market estimate of €39.40 billion. It now expects annual gross margin of 54% to 56%, compared with its previous outlook of 51% to 53%. Reflecting strong order momentum, ASML plans to increase production capacity for its low-NA EUV lithography systems by 30% in 2027 from its planned 2026 output of about 65 units, while evaluating another 30% expansion for 2028. The company also intends to boost DUV immersion system capacity by 30% in 2027 from around 130 units, with additional expansion under review for the following year. Discover more Geographic Reference During the quarter, ASML shipped 86 new lithography systems, up from 67 in the first quarter, while used system sales declined to five from 12. ASML declared an interim dividend of €1.88 per share, payable on August 5, and repurchased approximately €1.1 billion worth of shares under its 2026-2028 buyback program. Ahead of the earnings release, analysts remained optimistic despite export control concerns. Morgan Stanley reiterated ASML as a "Top Pick," highlighting resilient DRAM demand, stronger order visibility, and expanding wafer fabrication spending. Bernstein also raised its price target, arguing that adoption of ASML's High-NA EUV technology, particularly by memory chipmakers, could begin as early as 2027.
Lam Research, ASML, and imec Advance High-NA EUV Patterning. Jul 14, 2026 A joint paper from Lam Research, ASML, and imec puts 20 nm metal pitch in focus Driving the news: Lam Research, ASML, and imec presented a joint paper at the 2026 Symposium on VLSI Technology and Circuits showing the first demonstration of pitch 20 nm logic interconnect yield validation with Ru (ruthenium) direct metal etch patterned with single-exposure high-NA EUV and enabled by Lam's Aether(R) technology. Why it matters: Reducing multi-patterning complexity at advanced nodes is critical to sustaining cost, yield, and scaling. Fewer patterning steps makes advanced scaling more manufacturable. The big picture: The continued extension of scaling beyond the limits of 0.33NA EUV resolution has driven the introduction of increased multiple patterning steps, thereby increasing complexity and limiting process windows. As a result, Lam Research Corporation see longer cycle times, restrictions in design, and added cost per layer. High-NA EUV could restore scaling efficiency with direct print. This work shows a credible path toward that goal through integrated ecosystem innovation. Aether is ideal for high-NA EUV because smaller pitch sizes make traditional resist tradeoffs harder to manage; Lam's dry resist and development process improves resolution while reducing defectivity, helping preserve yield and scanner productivity at the dimensions high-NA is designed to print. The research details: * The work demonstrates 10 nm ruthenium metal lines patterned in 20nm pitch with single-exposure high-NA EUV and Aether resist. * The approach reduces dependence on multi-patterning schemes required at advanced nodes. * Lam's Aether technology supports resist and pattern transfer performance with lower defectivity and faster cycle time at high resolution. * The collaboration spans expertise at Lam Research (process), ASML (lithography), and imec (integration and validation). Ru metal lines with 20nm pitch (cross section view and top-down view). Due to hNA single exposure, no pitch walking is present. The bottom line: High-NA EUV will not advance on lithography alone. This result shows how coordinated ecosystem R&D can turn leading-edge research into a more practical path for continued scaling. Read the complete paper in the proceedings of 2026 IEEE/JSAP Symposium on Technology and Circuits: "High Yield Sub 20 nm Ru Direct Metal Etch Enabled by Single-Exposure 0.55NA EUV and dry MOR Technology" Gosia Jurczak is managing director, Engineering Caution Regarding Forward-Looking Statements Statements made in this article that are not of historical fact are forward-looking statements and are subject to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate to, but are not limited to: industry trends, demand, expectations and requirements; the requirements of its customers; and the capabilities and performance of its products. Some factors that may affect these forward-looking statements include: business, economic, political and/or regulatory conditions in the consumer electronics industry, the semiconductor industry and the overall economy may deteriorate or change; the actions of its customers and competitors may be inconsistent with its expectations; trade regulations, export controls, tariffs, trade disputes, and other geopolitical tensions may inhibit its ability to sell its products; supply chain cost increases, tariffs and other inflationary pressures have impacted and may continue to impact its profitability; supply chain disruptions or manufacturing capacity constraints may limit its ability to manufacture and sell its products; and natural and human-caused disasters, disease outbreaks, war, terrorism, political or governmental unrest or instability, or other events beyond its control may impact its operations and revenue in affected areas; as well as the other risks and uncertainties that are described in the documents filed or furnished by Lam Research Corporation with the Securities and Exchange Commission, including specifically the Risk Factors described in its most recent annual report on Form 10-K or subsequent quarterly report on Form 10-Q. These uncertainties and changes could materially affect the forward-looking statements and cause actual results to vary from expectations in a material way. The Company undertakes no obligation to update the information or statements made in this article.
ASML hits historic highs with record $674 billion market capitalization. 12:17, 08.06.2026 Article Content * Analysts Underestimated the Hidden Potential * Betting on the Brainport Campus * The Semiconductor Market Paradox The Dutch technology giant ASML has been officially recognized as the most valuable company in the history of the European stock market. The company's market value reached an unprecedented milestone of $668 billion (as of June 3rd). With this surge, ASML dethroned the Danish pharmaceutical company Novo Nordisk, whose peak valuation stood at $650 billion in June 2024. Analysts Underestimated the Hidden Potential. Powerful catalysts for the surging stock price were synchronized reports by major investment banks, JPMorgan and Morgan Stanley. They published nearly identical research results, asserting that the company could manufacture far more scanners than the market had anticipated: over 110 units without any additional investment in expansion, compared to the previously assumed cap of 90 scanners. Both banks aggressively raised their target price for ASML shares: * JPMorgan: raised from €1,515 to €1,900 * Morgan Stanley: raised from €1,400 to €1,660 As a reminder, ASML holds an absolute monopoly on EUV (Extreme Ultraviolet) lithography scanners. Without these machines, industry giants like TSMC, Samsung, and Intel are physically unable to manufacture next-generation processors. Betting on the Brainport Campus. The company's future growth is tightly linked to a large-scale infrastructure expansion. Morgan Stanley experts attribute the market's confidence to ASML's April announcements regarding the development of the Brainport Industries Campus in Eindhoven. Construction of the new facility is scheduled to begin in the third quarter of 2026. Company representatives commented that this project will serve as the launching pad for a multi-phase expansion designed to permanently resolve capacity shortage concerns for key clients. The Semiconductor Market Paradox. Despite its monopoly position in the sector, ASML has yet to reach a $1 trillion market capitalization. Furthermore, the company's annual stock growth still lags behind the overall explosive pace characteristic of the semiconductor industry. Nevertheless, ASML's current performance stands as an absolute triumph for the European tech sector.
Mistral AI has raised €1.7 billion in a Series C funding round at an €11.7 billion post-money valuation. The round was led by semiconductor equipment manufacturer ASML Holding, with participation from existing investors including DST Global, Andreessen Horowitz, Bpifrance, General Catalyst, Index Ventures, Lightspeed and NVIDIA. The Paris-based AI company will use the funding to advance its scientific research and develop custom decentralised frontier AI solutions for complex engineering and industrial problems. ASML CEO Christophe Fouquet said the partnership aims to generate benefits for ASML customers through AI-enabled products and solutions. Mistral AI CEO Arthur Mensch stated the investment will help address engineering challenges in the semiconductor and AI value chain whilst maintaining the company's independence.
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