Full-Time

Thermal Engineer

Systems Engineering

Confirmed live in the last 24 hours

Qualcomm

Qualcomm

10,001+ employees

Develops semiconductors and wireless technologies

Compensation Overview

$220.2k - $330.4k/yr

+ Bonus + RSU Grants

Senior, Expert

Company Historically Provides H1B Sponsorship

Santa Clara, CA, USA

Category
Thermal and Fluid Systems Engineering
Mechanical Engineering
Requirements
  • Master’s degree in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.
  • 5+ years of hands-on experience in thermal modeling within the high-tech industry.
  • Strong background in heat transfer fundamentals, with a solid understanding of conduction, convection, and radiation.
  • Proficiency with CFD modeling tools (e.g., Celsius EC, Flotherm, Icepak).
  • Understanding of electronics cooling technologies (passive and active).
  • Knowledge of packaging technologies, server design, and thermal management materials.
  • Proven ability to work independently and collaboratively within a cross-functional team environment.
  • Strong technical documentation skills and excellent written and verbal communication.
Responsibilities
  • Perform die/package/system-level thermal modeling to analyze and optimize server package and system thermals.
  • Support thermal design of packages and systems from concept through detailed design and manufacturing readiness.
  • Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, packaging, system, and customer requirements.
  • Conduct thermal testing to validate and improve thermal models and solutions, enhancing accuracy and robustness.
  • Research thermal management materials and solutions for advanced electronics.
  • Develop and maintain documentation, guidelines, and tools to support design processes and project success.
  • Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers.
Desired Qualifications
  • Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.
  • 10+ years of hands-on experience in thermal modeling within the high-tech industry.
  • Understanding of OCP product designs and industry best practices.
  • Engineering design and industry experience with high-end servers.
  • Expertise in conducting CFD simulations with thermal modeling tools (e.g., Celsius EC, Flotherm, Icepak).
  • Proficiency with thermal testing (e.g., DAQ, LabVIEW, thermocouples, airflow measurements, thermal chambers) for computer hardware.
  • Proficiency in programming languages (e.g., Python, C/C++, MATLAB) for data analysis and tool development.
  • Experience with CAD tools (e.g., SolidWorks, Creo).

Qualcomm develops and commercializes advanced wireless technologies and semiconductor products. The company designs and manufactures integrated circuits that are essential for mobile devices, automotive applications, and Internet of Things (IoT) devices. Qualcomm's products work by enabling enhanced connectivity and efficient power management, which improves the performance of smart devices and networks. Unlike many competitors, Qualcomm also generates revenue through licensing its extensive patent portfolio, allowing other companies to use its technologies. The goal of Qualcomm is to drive the evolution of connectivity and performance in various electronic applications.

Company Size

10,001+

Company Stage

IPO

Headquarters

San Diego, California

Founded

1985

Simplify Jobs

Simplify's Take

What believers are saying

  • Wi-Fi 7 technology expansion boosts Qualcomm's broadband market share opportunities.
  • Snapdragon G series growth aligns with rising demand for handheld gaming devices.
  • Symmetry Partners' investment indicates strong confidence in Qualcomm's future growth.

What critics are saying

  • Apple's C1 modem outperforms Qualcomm, threatening its modem market share.
  • Snapdragon 8s Gen 4 introduction may cause brand confusion and impact sales.
  • VNPT collaboration risks reputation if XGS-PON Wi-Fi 7 underperforms expectations.

What makes Qualcomm unique

  • Qualcomm leads in semiconductor innovation with Snapdragon 8s Elite and Gen 4 development.
  • Collaboration with VNPT Technology showcases Qualcomm's strength in Wi-Fi 7 broadband services.
  • Snapdragon G series targets the growing handheld gaming market with specialized platforms.

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Benefits

Premium-free health coverage

Onsite health & fitness centers

Retirement programs

Disability & life insurance programs

Tuition reimbursement

Product discounts

Flexible time off

Parental leave

Company News

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Snapdragon 8s Elite Key Info Appears Online

The popular chipset maker Qualcomm is currently working on the upcoming Snapdragon 8s Elite and it is expected to be announced in the near future.

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Qualcomm's Snapdragon Lineup Might Get More Confusing with the Snapdragon 8s Gen 4

Recent leaks, particularly from reliable source Digital Chat Station, suggest that Qualcomm is working on a chip labeled SM8735, which was initially believed to be the Snapdragon 8s Elite.

Trade Show News
Mar 24th, 2025
Qualcomm CEO Cristiano Amon to Deliver Keynote at COMPUTEX 2025

TAIPEI, March 24, 2025 /PRNewswire/ - TAITRA (Taiwan External Trade Development Council) announced that Cristiano Amon, Qualcomm Incorporated President and CEO, is invited to be the speaker at COMPUTEX 2025 Keynote, sharing his vision of the transformative impact of AI on device experiences and ecosystems.

Wireless Design Online
Mar 24th, 2025
Springboard To The Future: How VNPT's Embrace Of 10G Fiber And Wi-Fi 7 Unlocks Next-Gen Broadband Services

VNPT Technology, the innovation arm of VNPT Group, collaborated with Qualcomm Technologies and its Qualcomm Dragonwing NPro 7 Platform to deploy the Vietnam's first commercial XGS-PON Wi-Fi 7 service in October 2024.

MarketBeat
Mar 23rd, 2025
Symmetry Partners LLC Invests $253,000 in QUALCOMM Incorporated (NASDAQ:QCOM)

Symmetry Partners LLC invests $253,000 in QUALCOMM Incorporated (NASDAQ:QCOM).