RELOCATION ASSISTANCE: Relocation assistance may be available

CLEARANCE TYPE: SecretTRAVEL: Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people’s lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation’s history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they’re making history.

Northrop Grumman Mission Systems is seeking a Principal / Senior Principal Microelectronic Packaging Mechanical Design Engineer to join our team of qualified, diverse individuals. This position will be located in Linthicum, Maryland.

Overview:

You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman’s world-class radar, ESM and communications systems, that are fielded on a multitude of airborne, marine, ground-based, and space military platforms. You’ll support multiple projects spanning the product lifecycle, from R&D to full-rate production. Some example AESA products can be viewed at this website: https://www.northropgrumman.com/what-we-do/air/active-electronically-scanned-array-aesa-radars/ As an integral part of the Engineering and Sciences team, you will be responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman’s world-class radar, ESM and communications systems.

Roles and Responsibilities include:

Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.
Providing technical leadership and mentoring to less experienced personnel.

This position may be filled as a Principal Microelectronic Packaging Mechanical Design Engineer or a Senior Principal Microelectronic Packaging Mechanical Design Engineer

This position is contingent on the ability to obtain/maintain a US Secret Clearance or higher and contract award

Basic Qualifications for Principal Microelectronic Packaging Mechanical Design Engineer:

Bachelor’s degree with 5 years of experience, a Master’s degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement
U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
Proficient with AutoCAD
Familiarity with NX or other 3D modeling software

Basic Qualifications Senior Principal Microelectronic Packaging Mechanical Design Engineer:

Bachelor’s degree with 8 years of experience, a Master’s degree with 6 years of experience or a PhD with 3 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement.
U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
Proficient with AutoCAD
Familiarity with NX or other 3D modeling software

Preferred Qualifications:

Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
Active DoD Secret Clearance or higher
Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
Familiarity with thermal and structural analysis considerations, methodologies, and software tools
Experience with hands-on assembly and testing of prototype electronic hardware
Experience in a technical leadership role on a cross-functional product development team

This positions standard work schedule is a 9/80. The 9/80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off.

As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including:

Medical, Dental & Vision coverage
401k
Educational Assistance
Life Insurance
Employee Assistance Programs & Work/Life Solutions
Paid Time Off
Health & Wellness Resources
Employee Discounts

Link to Benefits: https://totalrewards.northropgrumman.com/

Salary Range: $93,000.00 - $139,600.00Salary Range 2: $115,400.00 - $173,200.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate’s experience, education, skills and current market conditions.Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

Principal / Senior Principal Microelectronic Packaging Mechanical Design Engineer

Northrop Grumman

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