Full-Time

Principal / Senior Principal Microelectronic Packaging Mechanical Design Engineer

Confirmed live in the last 24 hours

Northrop Grumman

Northrop Grumman

10,001+ employees

Aerospace and defense technology solutions provider

Cybersecurity
Aerospace
Defense

Compensation Overview

$93k - $173.2kAnnually

+ Bonus

Senior, Expert

Baltimore, MD, USA

Relocation assistance may be available.

US Citizenship, US Top Secret Clearance Required

Category
Design Engineering
Mechanical Engineering
Required Skills
Supply Chain Management
AutoCAD

You match the following Northrop Grumman's candidate preferences

Employers are more likely to interview you if you match these preferences:

Degree
Experience
Requirements
  • Bachelor’s degree with 5 years of experience, a Master’s degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement
  • U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
  • Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
  • Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
  • Proficient with AutoCAD
  • Familiarity with NX or other 3D modeling software
  • Bachelor’s degree with 8 years of experience, a Master’s degree with 6 years of experience or a PhD with 3 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 4 years of applied experience in lieu of degree requirement
  • U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
  • Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
  • Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
  • Proficient with AutoCAD
  • Familiarity with NX or other 3D modeling software
Responsibilities
  • Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
  • Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing
  • Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints
  • Providing technical leadership and mentoring to less experienced personnel
Desired Qualifications
  • Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
  • Active DoD Secret Clearance or higher
  • Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
  • Familiarity with thermal and structural analysis considerations, methodologies, and software tools
  • Experience with hands-on assembly and testing of prototype electronic hardware
  • Experience in a technical leadership role on a cross-functional product development team

Northrop Grumman provides advanced aerospace and defense technology solutions, focusing on areas such as autonomous systems, cybersecurity, and space operations. The company develops and integrates complex systems that support government and commercial clients, particularly the U.S. Department of Defense and international allies. Its products and services include systems for command and control, intelligence, surveillance, and reconnaissance (C4ISR), as well as logistics and modernization solutions. Northrop Grumman differentiates itself from competitors through its extensive research and development efforts and a strong track record in securing long-term contracts, which provide a stable revenue stream. The company's goal is to maintain its leadership position in the aerospace and defense market by continuously innovating and delivering comprehensive solutions that meet the evolving needs of its clients.

Company Stage

IPO

Total Funding

$192.2M

Headquarters

Falls Church, Virginia

Founded

1939

Simplify Jobs

Simplify's Take

What believers are saying

  • Increased demand for autonomous systems boosts Northrop Grumman's innovation in unmanned vehicles.
  • The U.S. DoD's budget rise for missile defense aligns with Northrop's interceptor production.
  • Digital transformation in defense is supported by Northrop's adoption of Planisware Enterprise.

What critics are saying

  • International competitors like BAE Systems are expanding in the U.S. defense market.
  • Supply chain issues may delay the B-21 Raider program, affecting contract deadlines.
  • Government demand for enhanced cybersecurity could raise operational costs for Northrop Grumman.

What makes Northrop Grumman unique

  • Northrop Grumman excels in autonomous systems, like the Manta-Ray drone for the U.S. Navy.
  • The company integrates AI in C4ISR systems, enhancing real-time data processing capabilities.
  • Northrop Grumman's Mission Robotic Vehicle targets the growing space-based defense systems market.

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Benefits

Health Insurance

Life Insurance

Disability Insurance

Paid Vacation

Paid Holidays

Relocation Assistance

Performance Bonus