Full-Time

Advanced Packaging and Heterogeneous Integration Technology Lead

Posted on 9/20/2024

HRL Laboratories

HRL Laboratories

501-1,000 employees

Develops cognitive systems for human-machine collaboration

AI & Machine Learning
Defense

Compensation Overview

$163.2k - $209.1kAnnually

+ Bonus

Expert

No H1B Sponsorship

Malibu, CA, USA

This position requires onsite presence in Malibu, CA.

US Citizenship Required

Category
Electronics Design Engineering
Electrical Engineering
Requirements
  • More than 15-20 years of hands-on experience with developing novel 2.5D and 3D microelectronic packaging and heterogeneous integration for RF & mmW microsystems.
  • Extensive experience with design of experiments and analysis techniques (electrical, mechanical, thermal, chemical, etc.) needed to develop and assess new process integration modules and techniques.
  • Experience with leading US government proposal and marketing activities.
  • Demonstrated experience developing external partnerships and vendor relationships.
  • Several years of experience in organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research funding.
  • Experience with traditional as well as advanced packaging techniques (e.g. ceramic and laminate chip-level packages, printed circuit boards, SoC, SiP, MCM, HD interposers, etc.).
  • Hands-on experience with semiconductor microfabrication is a plus.
  • Candidates should possess a proven track record of developing novel and successful solutions to complex technical issues.
  • Extensive knowledge of RF/mmW (0.1-200+ GHz) with strong electromagnetic (EM) background is desired.
  • Extensive knowledge of semiconductor microfabrication is desired.
  • Knowledge of multi-physics simulation tools (e.g. ANSYS, COMSOL), high frequency and RF simulation tools (e.g. ADS, MWO, Cadence), electromagnetic simulation tools (e.g. HFSS or CST) is desired.
  • Familiarity with digital, mixed-signal, power and signal integrity is desired.
  • Knowledge of system engineering, program and project management is a plus.
  • Understanding of material science, surface chemistry, semiconductor physics, and thermal/mechanical theory related to electronics processing and assembly techniques is a plus.
  • Ph.D. degree in Electrical Engineering, Mechanical Engineering, Physics, or related scientific discipline.
  • Current U.S. person or US citizen status is required.
  • Active security clearance is a plus.
Responsibilities
  • Lead research and development of novel 2.5D and 3D heterogeneous integration technologies for Radio-Frequency (RF) and Millimeter-Wave (mmW) applications (e.g. next generation RF/mmW Phased-Array Systems), with attention to all facets of this endeavor from conceptual design phase considering electrical, thermal, mechanical design constraint to engineering and manufacturing, as well as verification and validation phase.
  • Address all levels of integration from chip-level to module & microsystem level (e.g. die and wafer stacking, WLFO).
  • Perform theory-driven analyses of candidate approaches.
  • Organize and manage research and development projects to be carried out by technical teams of other domain experts (e.g. in each of the technical areas mentioned above).
  • Provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.).
  • Develop and maintain relationships with relevant vendors and partner organizations.
  • Organize and present results, in written reports, journal papers, and oral presentations.
  • Create and manage work plans to meet or exceed schedule deadlines and technical expectations.
  • Strong leadership and contributions to proposal and marketing efforts required to sustain continued R&D efforts.

HRL Laboratories focuses on research and development of advanced cognitive systems and human-machine collaboration, enhancing human cognitive abilities through artificial intelligence (AI) and machine learning (ML). The company develops solutions like the ICArUS project, which improves how machines interpret information, and the MEMES project, aimed at enhancing human memory. HRL operates on a project-based model, serving clients in defense and high-tech sectors by delivering customized solutions and licensing technologies. The goal is to lead in creating cognitive systems that improve the interaction between humans and machines.

Company Stage

Grant

Total Funding

$1.9M

Headquarters

Malibu, California

Founded

1997

Growth & Insights
Headcount

6 month growth

↑ 0%

1 year growth

↑ 0%

2 year growth

↑ 0%
Simplify Jobs

Simplify's Take

What believers are saying

  • HRL's data center cooling project could revolutionize energy efficiency in the industry.
  • The company's focus on quantum technologies aligns with growing industry trends.
  • HRL's collaboration with General Motors on electric vehicle magnets shows innovation in automotive.

What critics are saying

  • Increased competition in quantum technology could challenge HRL's market position.
  • Reliance on government contracts poses financial risks with potential funding shifts.
  • Regulatory challenges in AI defense systems could delay HRL's projects.

What makes HRL Laboratories unique

  • HRL Laboratories excels in cognitive systems enhancing human-machine collaboration.
  • The company is a leader in AI-driven memory enhancement technologies.
  • HRL's partnerships with Boeing and GM provide unique industry insights and opportunities.

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