Full-Time

Postdoctoral Fellow

Posted on 5/9/2026

University of Texas at Austin

University of Texas at Austin

Compensation Overview

$70k/yr

No H1B Sponsorship

Austin, TX, USA

In Person

Category
Mechanical Engineering (1)
Required Skills
Autodesk CFD
FEM/FEA
Requirements
  • A PhD received within the last 3 years in Mechanical Engineering or a closely related discipline with a focus on heat/mass transfer, fluid mechanics, and interfacial sciences.
  • Experience with experiments and modeling (traditional Computational Fluid Dynamics modeling).
  • Experience with finite element analysis and/or software packages like Comsol or ANSYS.
Responsibilities
  • Conduct and lead applied and fundamental research in the areas of microelectronics thermal management and advanced packaging.
  • Serve as part of a larger team of engineers-scientists working on cutting edge advancements in heterogeneous integration.
  • Other related functions as assigned.
Desired Qualifications
  • Familiarity with microelectronics packaging and heterogeneous integration.
  • Familiarity with reliability characterization.
University of Texas at Austin

University of Texas at Austin

View

Company Size

N/A

Company Stage

N/A

Total Funding

N/A

Headquarters

N/A

Founded

N/A