Full-Time
Wi-Fi Systems Validation Architect
Posted on 11/23/2025
Intel
10,001+ employees
Pioneers microprocessors, CPUs for PCs
No salary listed
Bengaluru, Karnataka, India
Hybrid
 Hardware Engineering (1) |
|---|
- Engineering degree in Electronics/Computer Science from a reputed college
- 5 years of work experience in Systems Architect role
- 10 years of work experience as in WiFi System Validation, Development and System Debugging
- Proven track record of developing and executing complex system validation strategies for Wi-Fi products
- Architect test systems and validation environments that effectively simulate real-world use cases, environments, and customer scenarios
- Architect end to end system software for a specific technology, product/platform, or market segment, including software structure and bounding box, firmware, drivers, frameworks, cross component, interfaces/interactions/interoperability, protocols, algorithms, and applications
- Responsible for pathfinding and providing the technical direction for software development and validation
- Engages with customers on technical requirements/discussions and interacts with technologists across Intel and within the industry to evaluate feasibility of requirements and determine priorities for development
- Lead the design, planning, and execution of validation strategies for our Wi-Fi solutions
- Work with cross-functional teams, including hardware engineers, firmware developers, product managers, and test teams, to ensure that the Wi-Fi products meet the highest standards of performance, reliability, and interoperability across various environments
- Define and implement best practices for Wi-Fi validation, contributing to the development of next-generation Wi-Fi solutions (Wi-Fi 6, 6E, 7)
- Deep knowledge of Wi-Fi technologies (Wi-Fi 5, Wi-Fi 6, Wi-Fi 6E, Wi-Fi 7), IEEE 802.11 standards, and Wi-Fi Alliance certification processes
- Deep knowledge and experience working in Omnipeek, Wireshark and IxChariot tools
- Debugging, Analysis, reproduction and identification of root cause on Wi-Fi domains
- Collaborate with Research and Development teams to identify design and performance gaps, providing technical feedback and proposing corrective actions
- Ensure that validation environments can effectively simulate diverse network conditions, traffic loads, interference scenarios, and client devices
- Design and implement system-level performance benchmarking and stress testing for various Wi-Fi configurations (e.g., access points, clients, mesh networks, etc.)
- Champions a culture of continuous improvement, ensuring that the validation processes evolve to meet emerging technologies and market demands
- Experience with Wi-Fi chipset, access point, router, and client device architecture
- Proficiency in using Wi-Fi test equipment such as spectrum analyzers, signal generators, protocol analyzers (e.g., Wireshark, AirMagnet), and network simulators
- Experience in designing and optimizing test automation frameworks, using tools such as Python, Robot Framework, or proprietary systems
- Strong problem-solving and troubleshooting skills
- Ability to work in a multi-tasking environment and multi-geo environment
Intel designs and manufactures semiconductor chips, with a focus on microprocessors for personal computers, servers, and other devices. Its core product is the CPU on a single silicon chip, which executes instructions, handles arithmetic and logic operations, and coordinates the work of other computer components. Intel originated in memory chips but shifted decisively to microprocessors in the 1980s, becoming a central supplier for the PC era after the IBM partnership and its famous x86 processor line. This shift, large-scale manufacturing, and close ties with computer makers set Intel apart from competitors who remained focused on memory or other components. The company aims to power computing by delivering high-performance, energy-efficient silicon solutions that drive a wide range of computing devices and applications.
Company Size
10,001+
Company Stage
IPO
Headquarters
Santa Clara, California
Founded
1999
Simplify's Take
What believers are saying
- Data center and AI revenue surged 22% to $5.1B in Q1 2026.
- Apple chip manufacturing talks boost Intel Foundry with 2027 revenue.
- Nvidia invests $5B in Intel for custom data center CPUs.
What critics are saying
- TSMC outpaces Intel's 18A node, compressing Q2 2026 margins to 39%.
- AMD captures CPU share in $120B server market by 2030.
- Overbought RSI at 84.53 triggers 30-50% stock correction soon.
What makes Intel unique
- Intel pioneered the 4004 microprocessor in 1971, launching the CPU era.
- IBM selected Intel's 8088 processor in 1981, fueling PC revolution dominance.
- Intel Capital has invested over $20B since 1991 across 700+ IPOs.
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Benefits
We Invest in Your Life and Career: Intel offers a complete and competitive package of benefits1 that demonstrates how much we care for employees and their families through every stage of life.
Great Minds Deserve Great Rewards: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs.
Intel Fuels Career Acceleration: Curiosity drives us to change the world. We provide employees opportunities to expand their knowledge, leadership abilities, and skill set.
Vacation, Holidays, and More: We offer opportunities for employees to refresh and recharge—from paid vacation time and holidays to flexible time off programs.
Health Benefits for the Whole You: We provide multiple benefits and resources to help employees take care of themselves and their families.
Growth & Insights and Company News
6 month growth
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↑ 1%Intel CEO Lip-Bu Tan joins groundbreaking of 3D Glass Solutions facility in Bhubaneswar. Bhubaneswar: Intel CEO Lip-Bu Tan Sunday said that the Rs 2000 crore 3D Glass Solution project in Bhubaneswar is a major step toward strengthing India's semiconductor ecosystem and advancing global technology collaboration. Joining the groundbreaking ceremony of the Project on virtual mode, the Intel CEO Tan expressed appreciation for the leadership of PM Narendra Modi, whose vision has positioned India as a competitive and trusted semiconductor hub. He also acknowledged Ashwini Vaishnaw and the India Semiconductor Mission for their strategic direction and execution in driving industry growth. Tan extended his gratitude to Odisha CM Mohan Charan Majhi and the government of Odisha for their proactive support and partnership in enabling the project. Emphasizing the future of the semiconductor industry, Tan noted that advanced packaging, heterogeneous integration, and substrate technologies will play a crucial role in performance and innovation. He underscored that 3D Glass Solutions is well-positioned to contribute significantly in this space. Highlighting Odisha's strengths, Tan pointed to its reliable infrastructure, including power, water resources, and a skilled workforce, as key enablers for advanced manufacturing. The new facility is expected to generate high-quality employment, foster local talent, and contribute to building a resilient semiconductor ecosystem in India. Tan concluded by expressing confidence that the project will evolve into a center of excellence, strengthening global supply chains and reinforcing India's role in the semiconductor industry. Odisha CM Majhi today laid the foundation stone for project in Info Valley, Bhubaneswar, in the presence of Union Electronics & IT Minister Aswini Vaishnaw and Odisha Electronics & IT Minister Mukesh Mahalinga. Odisha Chief Secretary Ms. Anu Garg, E & IT Additional Chief Secretary Vishal Dev, Union E & IT Additional Secretary Amitesh Sinha, and 3D Glass Solution President & CEO Babu Mandaba were also present at the event. It may be mentioned here that Intel is associated with 3D Glass Solutions for long.
Intel has launched its Core Series 3 processors, marking the first time in years that non-Ultra Core CPUs feature genuinely new silicon. Codenamed Wildcat Lake, these chips represent a departure from previous non-Ultra models, which relied on the outdated Raptor Lake architecture from 2023's 13th-generation Core family. The new processors use two silicon tiles: a compute tile with up to two Cougar Cove P-cores, four Darkmont E-cores, and Xe3 integrated graphics, plus a platform controller tile. Built on Intel's 18A manufacturing process, they support up to 48GB LPDDR5X-7467 memory and operate at 15W base power. However, the chips' 17 TOPS NPU falls short of Microsoft's 40 TOPS requirement for Copilot+ PC features. Intel claims over 70 designs from partners will launch in coming months.
Intel has hired Samsung Electronics executive vice president Shawn Han to bolster its foundry business as the chipmaker seeks to expand in outsourced chip manufacturing. Han will join Intel next month as general manager of foundry services, reporting to Naga Chandrasekaran, head of Intel's foundry division. The appointment reflects Intel's push to attract customers to its manufacturing operations. Han's extensive experience at Samsung, a major player in contract chipmaking, is expected to support Intel's efforts to compete in the foundry market.
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Intel has appointed Aparna Bawa as Executive Vice President and Chief Legal & People Officer, overseeing global legal, ethics, compliance, people and culture functions. She will report directly to CEO Lip-Bu Tan. Bawa joins from Zoom during a period of significant transformation at Intel. The company's shares have risen 28.3% over the past week and 42.4% over the past month, trading at $65.17. The combined role places legal risk management, culture and talent decisions under single leadership as Intel reshapes itself around AI, foundry services and major cloud and automotive clients. With recent agreements involving Google, SambaNova and the Terafab project with Tesla, SpaceX and xAI, Intel faces increasingly complex contracts and regulatory exposure. The appointment signals how the company is organising to support long-term execution during operational transformation.