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Full-Time

Advanced Packaging Lead

Confirmed live in the last 24 hours

Untether AI

Untether AI

51-200 employees

AI acceleration using at-memory computing

AI & Machine Learning
Hardware

Senior

Remote in Canada

Category
Hardware Engineering
Electronic Hardware Engineering
System Hardware Engineering
Requirements
  • Experience working with 2.5/3D packaging technologies using CoWoS, EMIB or similar
  • Experience with chiplets, die-to-die interconnects and designs with stacked memories
  • Experience with manufacturing processes, reliability and qualification of advanced packaging designs through production ramp
  • Working knowledge of package design tools and failure analysis
  • Demonstrated success with designs in advanced technology nodes
Responsibilities
  • Develop advanced packaging solutions for next generation AI products
  • Collaborate with internal stakeholders, product, architecture and design to analyze and propose packaging solutions to improve performance, reliability and manufacturability
  • Drive technical decisions, short-term and long-term, on packaging solutions, chiplet strategy and die-to-die interfaces
  • Manage and collaborate with external suppliers, foundry and OSAT to propose leading-edge packaging solutions
  • Review electrical, thermal, mechanical and feasibility data from suppliers and lead analysis through high volume production
  • Resolve quality and integrity issues related to package design
  • Drive long term plans to grow internal capabilities and expertise in these areas

Untether AI specializes in runAI200® devices and tsunAImi® accelerator cards that leverage at-memory computing to accelerate AI inference for various neural networks, such as vision and natural language processing, delivering industry-leading efficiency and improved accuracy. Their groundbreaking chip architecture eliminates the data movement bottleneck in traditional architectures, enabling ultra-efficient and high-performance AI chips for new frontiers in AI applications.

Company Stage

Series B

Total Funding

$165M

Headquarters

Toronto, Canada

Founded

2018

Growth & Insights
Headcount

6 month growth

5%

1 year growth

1%

2 year growth

16%