ESSENTIAL DUTIES AND RESPONSIBILITIES:

Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified, and introduced into production in a timely manner while meeting all mechanical, electrical, performance, reliability, and quality requirements.
Working with cross-functional teams, factories, and other engineers, manages the entire package life cycle process.
Coordinates with factories and contract manufacturers worldwide on the high volume introduction of new packages and assembly processes.
Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging technology required to support business needs
Manages assembly yield improvement and package cost reduction programs
Responsible for maintaining package roadmaps, budgets for the product lines supported and building packaging infrastructure
Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production.
Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFX (Design for exellence) analysis, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework

Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines.
Master’s degree with more than 10 years of relevant work experience, or PhD degree with over 8years of work experience.
Proficient understanding of packaging domains such as SMT, PCBA, solder joint reliability, board level reliability, packaging materials, failure analysis, and PCB layout. Additional knowledge in areas like die attach, wire bond, wafer thinning, and molding is a plus.
Experience in Machine learning and data analytics utilizing AI is a plus.
Exceptional problem-solving skills with expertise in experimental design and statistical analysis.
Excellent written and communication skills, enabling collaboration with global functional teams.
Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives
Constantly track major industry benchmark announcements as it relates to packaging and proactively build awareness of key benchmark strategies.
Assist in developing and maintaining the Package Technology Roadmap, working with global assembly, and packaging teams.
Analyze Package technology roadmaps based on industry benchmarking trends and highlight any emerging gaps and actions needed.
Experience in mentoring or managing junior engineers is a plus.