Full-Time

Mechanical Engineer

Posted on 9/11/2026

Deadline 9/14/26
ASML

ASML

10,001+ employees

Manufactures photolithography systems for semiconductors

No salary listed

Company Does Not Provide H1B Sponsorship

Wilton, CT, USA

In Person

Master's

Category
Mechanical Engineering (1)

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Requirements
  • A Master's degree with solid experience, or an equivalent working and thinking level.
  • Experience working independently and unsupervised on complex design engineering tasks.
  • In-depth knowledge of complex tasks or a simple sub-module within the mechanical engineering area of expertise.
  • Basic knowledge of neighboring areas within a module, along with basic module and system knowledge.
  • Mono-disciplinary mechanical engineering knowledge.
  • Basic knowledge of how the engineer's subsystem interacts with other subsystems.
  • Ability to work with technical uncertainty, balance quality and timely delivery, and define design solutions autonomously.
  • Ability to guide one or two engineers on the development of a specific part or module.
  • Ability to adhere to mechanical design ways of working and applicable quality standards.
  • Ability to comply with environmental, health, and safety policies and instructions, identify and mitigate safety risks, and instruct the team in safe working methods.
  • Potential ability to work in environments involving strong magnetic fields, high voltage, and high currents.
  • Legal authorization to access United States-controlled technology before beginning work.
Responsibilities
  • Lead complex technical designs or own modules requiring contributions from several engineers.
  • Oversee linked components within a module and lead mono-disciplinary designs or projects while considering industrialization.
  • Interface with engineers from adjacent or collaborating functional and integrated teams, suppliers, and customers as part of a larger team.
  • Research and carry out activities that support others or fulfill role requirements.
  • Plan and coordinate requirements identification and elicitation, analyze requirements for completion and alignment, document and manage requirements throughout the project, and coordinate verification of the final deliverable.
  • Contribute to feasibility studies from technological and organizational perspectives and document findings.
  • Contribute to engineering solution design, design feasibility testing approaches, and supervise implementation to support solution development and validation.
  • Develop technical concepts, including material choices; make technical choices throughout design phases; solve technical issues; and devise new approaches to problems.
  • Prepare high-level designs for sub-modules, addressing architectural and interface choices, and document them in the relevant systems engineering documents.
  • Detail designs and maintain their documentation.
  • Integrate subsystems into the system, execute configuration management, and provide project support.
  • Develop product specifications and design test procedures and standards.
  • Validate complex test methods and procedures, identify issues, and recommend improvements.
  • Oversee dependencies between project team tasks, assist with planning, signal delivery risks, translate weekly deliverables into daily tasks, maintain the daily task plan, and deliver assigned work.
  • Carry out assigned departmental projects and provide effort estimates for own or similar tasks.
  • Document design choices and specifications throughout all phases, including underlying assumptions and restrictions.
  • Maintain discipline and technology knowledge, contribute to the company's technology base, and support efficient product development, production, use, and maintenance.
  • Conduct regular knowledge transfers and coaching within the team or group.

ASML designs and manufactures photolithography systems for semiconductor manufacturing. Its main products are deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography machines that print circuit patterns on silicon wafers, with EUV enabling smaller features. The company sells these systems to leading chipmakers and earns substantial revenue from installation, maintenance, and upgrades over the machines’ lifetimes. Its goal is to help continue scaling semiconductors by leading in high-end lithography and maintaining strong relationships with customers like TSMC, Samsung, and Intel.

Company Size

10,001+

Company Stage

IPO

Headquarters

Veldhoven, Netherlands

Founded

1984

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Simplify Jobs

Simplify's Take

What believers are saying

  • Reuters said ASML raised 2026 revenue guidance to €43 billion-€45 billion on strong demand.
  • Intel, TSMC, and Samsung committed to High NA, with adoption starting 2028-2030.
  • ASML's 2027-2028 capacity expansion is already largely booked, signaling sustained order visibility.

What critics are saying

  • U.S. lawmakers proposed the MATCH Act in 2026, threatening ASML's China revenue.
  • China represented about 20% of 2026 sales, exposing ASML to export-control shocks.
  • Canon's nanoimprint push and SMEE's DUV progress attack mature-node revenues and long-term dominance.

What makes ASML unique

  • ASML remains the sole EUV lithography supplier, controlling advanced chip-node access.
  • Its High NA EUV platform already runs at four customers and scales toward HVM.
  • The September 8, 2026 Eindhoven campus expands manufacturing capacity and factory automation.

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Benefits

Flexible Work Hours

Remote Work Options

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

0%

2 year growth

0%
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US Treasury yields near 4.79% reflect strong corporate borrowing for AI investments rather than economic weakness, according to analysts Joel Litman and Rob Spivey. They argue that context matters more than absolute rate levels. Companies borrowing at 5% to fund projects returning 30-40% benefit from current rates, whilst those earning less than borrowing costs face pressure. The analysts note that AI-related corporate debt issuance reached roughly $1.5 trillion this year, driving yields higher. Alphabet posted its first negative free cash flow since 2004, burning $5.9 billion in Q2 as capital expenditure hit $44.9 billion. Amazon swung to negative $7.6 billion on a trailing basis. However, negative cash flow can signal productive investment rather than distress, the analysts suggest.

Yahoo Finance
Sep 8th, 2026
ASML breaks ground on new €350,000m² Eindhoven campus to boost manufacturing capacity

ASML has begun constructing a new industrial campus in the Brainport region, Netherlands. The company held a groundbreaking ceremony on 8 September 2026 at Brainport Industries Campus North, which was attended by Dutch Prime Minister Rob Jetten. The multi-phase development will span approximately 350,000 square metres and provide capacity for up to 20,000 workplaces. The first phase, expected to complete in 2029, will house at least 3,000 employees relocating from existing ASML locations. The campus will feature a new flow factory implementing ASML's next-generation manufacturing operating model for the TWINSCAN factory. This model aims to enable faster, more efficient and higher-scale module production and installation.

Yahoo Finance
Sep 8th, 2026
ASML secures TSMC and Samsung commitments for $400M EUV machines as AI demand drives chip production race

ASML has secured commitments from Samsung and TSMC to adopt its latest High NA EUV lithography equipment, joining Intel in using machines costing $400 million each. Samsung will begin high-volume manufacturing with the technology by 2028, whilst TSMC plans to start from 2030. The companies also agreed to shift from 6-inch to 12-inch photomasks, a move expected to increase throughput by 40% and reduce costs. ASML's chief technology officer Marco Pieters called this "a significant step in productivity". ASML is the sole manufacturer of EUV lithography equipment necessary for producing advanced AI accelerators. TSMC had previously hesitated to adopt the more expensive High NA machines, questioning whether productivity gains justified the cost.

Sifted
Sep 2nd, 2026
Exclusive: Samsung, Nvidia, ASML and Scaleup Fund back Mistral in €3bn fundraise

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Wccftech
Sep 2nd, 2026
China trails ASML's advanced EUV chip making technology by 10 years, says investment bank UBS as progress is stuck at ASML's 2004 level.

China trails ASML's advanced EUV chip making technology by 10 years, says investment bank UBS as progress is stuck at ASML's 2004 level. Ramish Zafar - Sep 2, 2026 at 04:26pm EDT China is unlikely to match Dutch chip manufacturing ASML's EUV machines for ten years, suggests a new report from investment bank UBS. EUV lithography scanners are a key link in the global advanced chip manufacturing industry, and without them, making the latest chips is complicated and costly. US restrictions on China prevent the country's major chip manufacturers from acquiring the EUV machines, and UBS outlines that China can overcome the gap for older immersion-based DUV lithography much sooner than it can for EUV technology. Chinese EUV chip manufacturing technology development is similar to ASML's in 2004, says UBS. Back in 2003 and 2004, ASML was conducting functional and vacuum testing for its EUV tools in order to reduce production risks for 45-nanometer and more advanced nodes. During the same time period, advanced mirrors capable of working with 13.5 nm wavelengths were being developed, and since traditional light sources were limited to working with EUV, ASML was also working to develop laser and plasma technologies. Now, ASML is focused on developing high-NA EUV lithography systems, which use mirrors and optics with high numerical aperture mirrors to increase focus and sharpness. Both these systems mark a significant upgrade over traditional DUV systems that initially relied on air and then ultra-pure water for certain phases of the lithography process. Now, a fresh report from investment bank UBS claims that when it comes to EUV development, China's progress is similar to where ASML was in 2004. Consequently, the bank believes that the Asian country will be unable to achieve parity with ASML in EUV over the next ten years. The bank notes that ASML continues to depend heavily on China for its sales, with 33% of the firm's 2025 sales coming from the country to mark a significant jump over the 10% before 2020. The conclusion regarding EUV progress is based on patents, according to the investment bank. The two firms that UBS believes are important when it comes to manufacturing equipment are the state-backed Shanghai Micro Electronics Equipment (SMEE) and startup Shanghai Yuliangsheng Technology Co., Ltd. However, instead of EUV, these firms need to be watched for deep ultraviolet (DUV) development, says UBS. The bank adds that as opposed to EUV, China can catch up to ASML in immersion DUV lithography within two to five years. Immersion lithography, also called wet lithography, uses a layer of ultra-pure water to reduce the light's wavelength and increase resolution and depth of focus. Yet, despite the advances, the country will continue to rely on ASML due to differences in yield and throughput, believes UBS. However, the bank models its bear case for ASML on new restrictions on DUV sales to China and adds that it expects China to represent 15% to 20% of ASML's sales in 2027. About the author: Ramish is a seasoned technology writer and editor with more than a decade of experience. He specializes in semiconductor fabrication and market analysis. With a background in finance and supply chain management - via his bachelors in Finance and a micromasters in supply chain management from MIT - Ramish combines financial rigor with deep industry insight to deliver accurate and authoritative coverage. Follow Wccftech on Google to get more of its news coverage in your feeds.