Laser Module Packaging Engineer

Lightmatter builds chips that enable extreme-scale artificial intelligence computing clusters. If you’re a collaborative engineer or scientist who has a passion for innovation, solving challenging technical problems, and doing impactful work like building the world’s first optical computers, consider joining the team at Lightmatter!

Lightmatter is looking for a technical lead to drive Laser Module development required across multiple product lines for the company. You will be part of a cross-functional team consisting of silicon photonics, analog, packaging, and system engineers to drive various Laser Module development from concept to high-volume production. You will be responsible for performing design optimization across optical, mechanical, and thermal domains and working closely with vendors to develop assembly flow to deliver high yielding & reliable laser package modules that meet product requirements. This position offers a unique opportunity to bring innovative concepts in laser technology to market. It provides significant opportunities to innovate by solving complex interactions across silicon photonics, packaging technologies, and system architectures.

Responsibilities

• Collaborate with silicon photonics, package, and systems teams to understand the overall laser module performance targets.
• Perform necessary mechanical and/or thermal design studies to assist in Laser Module development from concept phase through high-volume manufacturing.
• Perform necessary photonic simulations using Zemax or equivalent to define requirements for various components in the laser module.
• Actively manage suppliers and vendors to ensure timely project execution.
• Collaborate with cross-functional teams, including hardware designers, PCB layout engineers, and system architects to ensure seamless integration of the Laser Module and support throughout the product development lifecycle.
• Document and communicate results, design guidelines, and recommendations to internal stakeholders, management, and customers.

• B.S. with 8 years of experience, M.S. with 6 years of experience, or Ph.D. with 3 years of experience in Electrical or Mechanical Engineering, Physics, Material Science, or a relevant field.
• At least 5 years of experience in Semiconductor Laser technology, module development, process integration, and qualification.
• Expertise in photonics numerical simulation tools such as Zemax.
• Knowledge of different component (Mux, isolator, SOA, etc) requirements within a laser module and ability to design and optimize to meet the product performance/reliability targets.
• Knowledge of Mechanical design processes and software experience using CAD tools such as Solidworks.
• Understanding of electrical requirements such as driver circuit on board requirements and layouts.
• Understanding of packaging thermals and mechanical consideration such as heat transfer, mechanical strain, and stress.
• Ability to establish key interaction of photonic devices and package technology interaction; suggest methods to resolve and drive solutions.

Preferred Qualifications

• Hands-on experience in precision bonding processes, including die-die edge attach (butt coupling), die to lens attach, and fiber attach processes, and wire bond.
• Excellent verbal and written communication skills to effectively collaborate with cross-functional teams and present findings to stakeholders.
• Exposure to quality and reliability requirements for optical components.

• Comprehensive Health Care Plan (Medical, Dental & Vision)
• Life Insurance (Basic, Voluntary & AD&D)
• Generous Time Off (Vacation, Sick & Public Holidays)
• Paid Family Leave
• Short Term & Long Term Disability
• Training & Development
• Flexible, hybrid workplace model
• Stock Option Plan
  

Lightmatter recruits, employs, trains, compensates, and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.