Lead Package Design Engineer @ Tenstorrent

Lead Package Design Engineer

Posted on 2/17/2023

INACTIVE

Locations

Santa Clara, CA, USA

Experience Level

Entry

Junior

Mid

Senior

Expert

Requirements

BS/MS/PhD in EE/ECE/ME/ChemE or related disciplines
More than 10 years of experience in advanced packaging design and implementation
Hands-on experience with modeling thermo-mechanical stress and/or SI/PI
Well versed in advanced packaging techniques including InFO, CoWoS, FoCoS, EMIB variants, hybrid bonding
Excellent understanding of circuit, mechanical, and thermodynamic fundamentals
Experience with optical module integration is an asset

Responsibilities

All aspects of package design including SI/PI, STA, routing, reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
All aspects of package planning including pre/post silicon bring up, yield improvements, qualification, failure analysis, and system implementation
Collaborating with design engineers to develop a portfolio of chiplets that meets a huge range of price-performance design points while optimizing re-use
Meeting specifications for high speed interfaces such as HBM, DDR, GDDR, PCIE, 112G SerDes
Overseeing OSAT and substrate suppliers
Managing the production of the IC package, including monitoring the manufacturing process and ensuring that the package is produced to the required quality and reliability standards

The Tenstorrent team combines technologists from different disciplines who come together with a shared passion for AI and a deep desire to build great products. We value collaboration, curiosity, and a commitment to solving hard problems. Find out more about our culture.

The person hired for this role will lead package design for high-performance chiplets and SOCs. They will be involved in all stages, from concept to high-volume manufacturing, and will be responsible for designing packaging solutions that meet industry leading power, performance, and cost targets. The work will be done alongside a group of highly experienced engineers across various domains of the AI/ML chip.

Responsibilities

All aspects of package design including SI/PI, STA, routing, reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
All aspects of package planning including pre/post silicon bring up, yield improvements, qualification, failure analysis, and system implementation
Collaborating with design engineers to develop a portfolio of chiplets that meets a huge range of price-performance design points while optimizing re-use
Meeting specifications for high speed interfaces such as HBM, DDR, GDDR, PCIE, 112G SerDes
Overseeing OSAT and substrate suppliers
Managing the production of the IC package, including monitoring the manufacturing process and ensuring that the package is produced to the required quality and reliability standards

Experience & Qualifications

BS/MS/PhD in EE/ECE/ME/ChemE or related disciplines
More than 10 years of experience in advanced packaging design and implementation
Hands-on experience with modeling thermo-mechanical stress and/or SI/PI
Well versed in advanced packaging techniques including InFO, CoWoS, FoCoS, EMIB variants, hybrid bonding
Excellent understanding of circuit, mechanical, and thermodynamic fundamentals
Experience with optical module integration is an asset

Locations:

Austin, TX | Santa Clara, CA

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

51-200 employees

Website

Computer processor architecture manufacturer

Company Overview

Tenstorrent is on a mission to address the rapidly growing compute demands for software 2.0. The company designs processors that are optimized for neural network inference, training and can also execute other types of parallel computation.

Company Core Values

Collaboration
Curiosity
Commitment to solving hard problems