Summer 2026
Posted on 6/13/2026
Pioneers microprocessors, CPUs for PCs
No salary listed
No H1B Sponsorship
Hillsboro, OR, USA + 1 more
More locations: Folsom, CA, USA
Hybrid
Hybrid work model: on-site at Intel Hillsboro (OR) or Folsom (CA) with on-site and remote/off-site days.
Intel designs and manufactures semiconductor chips, with a focus on microprocessors for personal computers, servers, and other devices. Its core product is the CPU on a single silicon chip, which executes instructions, handles arithmetic and logic operations, and coordinates the work of other computer components. Intel originated in memory chips but shifted decisively to microprocessors in the 1980s, becoming a central supplier for the PC era after the IBM partnership and its famous x86 processor line. This shift, large-scale manufacturing, and close ties with computer makers set Intel apart from competitors who remained focused on memory or other components. The company aims to power computing by delivering high-performance, energy-efficient silicon solutions that drive a wide range of computing devices and applications.
Company Size
10,001+
Company Stage
IPO
Headquarters
Santa Clara, California
Founded
1999
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We Invest in Your Life and Career: Intel offers a complete and competitive package of benefits1 that demonstrates how much we care for employees and their families through every stage of life.
Great Minds Deserve Great Rewards: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs.
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Intel gets a packaging bump. Intel shares jumped more than 12 per cent after Chipzilla signed the company which sounds like a sneeze Hitachi for advanced packaging work aimed at AI and data centres. Intel announced a partnership with Hitachi to co-develop and produce advanced semiconductor packaging technologies. The deal focuses on high-performance kit for data centres, artificial intelligence systems and high-end computing. Chipzilla has been under pressure from investors and customers after manufacturing delays and rising competition from TSMC and Samsung Electronics. The Hitachi deal gives it another way to talk about progress without waving another delayed node roadmap around. The two companies will work on technologies that stack multiple chips together to improve speed and cut energy use. Hitachi brings materials science and precision manufacturing experience, which Chipzilla clearly thinks it could use. The collaboration will focus on hybrid bonding and other next-generation packaging methods. These techniques allow finer connections between silicon components, boosting bandwidth between processors, memory and accelerators while reducing latency and power draw. Chipzilla has pushed advanced packaging as one of its key weapons against foundry rivals. Its EMIB and Foveros technologies already appear in products including some Xeon processors and the Ponte Vecchio data centre GPU. Working with Hitachi could speed development of more sophisticated stacking methods for future products. The Japanese industrial giant has long supplied critical materials and equipment to the global semiconductor industry. The share jump reflected investor relief after Chipzilla's market value took a kicking for three years. Shares had fallen more than 60 per cent from their 2021 peak before the announcement. The Hitachi pact is part of a wider supply-chain strategy. Chipzilla has been expanding its foundry services business to attract customers that might otherwise hand everything to TSMC. The company has broken ground on new fabs in Ohio, Arizona and Germany as it tries to rebuild manufacturing capacity in the US and Europe. Support from the CHIPS and Science Act has brought billions in grants and loans to offset the eye-watering capital costs. Hitachi sees the deal as a way to expand in advanced packaging. The company already makes specialised materials used in semiconductor assembly and has invested in thermal management and high-density interconnects. Analysts reckon the collaboration could help both companies tackle technical problems slowing progress across the sector. As transistors hit atomic-scale dimensions, raw processing gains from lithography alone are getting harder to find. Chiplet architectures have already shown their worth in graphics processors and server CPUs from AMD and Nvidia. That makes packaging less of a back-room engineering detail and more of a frontline fight. Industry observers expect initial prototypes within 12 to 18 months, followed by possible commercialisation if big customers approve. The technologies could support server processors, AI accelerators, networking chips and scientific computing systems. Chipzilla has picked up design wins for its upcoming Lunar Lake and Arrow Lake consumer processors. The Hitachi partnership gives investors another reason to believe the turnaround story is not entirely held together with tape. Jun 12, 2026
Joan Tafoya, former director at Meta, Intel & Sandia: why swarming every problem slows teams. by Jamie Flinchbaugh on 06-11-26 | / | / | / | Joan Tafoya joins Jamie Flinchbaugh on People Solve Problems for a conversation built around one deceptively simple question: how do you coach problem solving when the person in front of you is difficult to coach? Joan, a former director at Meta, Intel, and Sandia National Laboratories with nearly 38 years of experience, brings a perspective shaped by leading large, globally dispersed teams and by watching problem-solving succeed and fail at scale. Joan opens by describing her own growth as a leader. In her early years as an engineer and manager, she was focused on results and often grew frustrated when people did not solve problems the way she would have. Over time, she recognized that she could not advance until she taught others to think differently, not to think like her, but to think more deliberately about problem-solving itself. She points to a turning point while running a manufacturing line at Intel, where a constant stream of people asking for the next step left her burning out. The shift she made was to narrate her own thinking out loud so others could follow it, and to ask people what they were thinking rather than supplying every answer. That experience leads to one of the central themes of the episode. Joan is honest that her move toward coaching began partly as self-preservation, but she came to see it as something larger. She realized her team did not always share the same picture of success, and that alignment on both the problem and the desired outcome mattered as much as effort. Coaching, in her telling, became the way to build a group of trusted people who could carry the work forward and free her to take on new challenges. Joan also reflects on the challenge of coaching highly credentialed experts. At Sandia National Laboratories, she built a department focused on lean and problem-solving practices in an environment where nearly everyone held a PhD. Rather than pretending to match their technical depth, she earned credibility by listening carefully, reflecting what she heard, and asking sharper questions, especially about the knowledge gaps standing between the team and its next breakthrough. Prioritization is another area Joan explores in depth. Drawing on her time at Meta, she describes a culture that was learning to balance speed with reliability. Her first prioritization question is not whether a problem is important but whether her team is the one best suited to solve it. She warns against the instinct to swarm every visible problem, comparing it to a kindergarten soccer team chasing the ball. She also looks for quick wins that build momentum and morale without draining resources from larger work. On ideation, Joan emphasizes starting with clarity. She often opens sessions with a silent exercise in which everyone writes down the problem statement and what success would look like, which surfaces a wider range of views and avoids groupthink. She values bringing contrarians into the room, while noting that a contrarian works best when given clear expectations about how to contribute rather than simply being allowed to push back. Joan closes with advice for young engineers hoping to lead in fast-paced, demanding environments. She believes people grow most while they are struggling and pushing past what feels comfortable, and she encourages giving yourself grace during those stretches while still choosing to step into the discomfort. It is a fitting end to a conversation that treats problem-solving as something every person can learn and every leader can nurture. You can connect with Joan Tafoya on LinkedIn
Intel Panther Lake R appears in Linux patch as ruggedized Panther Lake variant. Panther Lake R appears. Intel appears to be preparing a ruggedized version of Panther Lake for industrial and embedded systems. A new Linux kernel patch posted by Intel introduces Panther Lake R. Surprisingly, this does not refer to 'Refresh,' which is a common letter Intel uses for such systems. Apparently, the patch identifies it as a derivative of Panther Lake with P-cores and low-power E-cores intended for harsh environments. Phoronix reports that the new variant uses model ID 223, while existing Panther Lake SoCs use model ID 204. The separate model ID suggests this is not just a regular Panther Lake chip with a wider operating temperature rating. The patch itself does not confirm all changes, but a new ID usually means the kernel may need to handle the silicon differently in some areas. "Derivative of Panther Lake with P-cores and low power E-cores intended for use in harsh environments." Intel already offers Series 3 for edge and embedded systems. The company says these systems support extended temperature operation, deterministic performance, and 24/7 reliability. Intel's own product page also mentions industrial-grade operating conditions from -40°C to +100°C on select SKUs. So I'm curious, what's the actual difference for Panther Lake R here, even greater temperature support, special features
Intel CEO Lip-Bu Tan joins groundbreaking of 3D Glass Solutions facility in Bhubaneswar. Bhubaneswar: Intel CEO Lip-Bu Tan Sunday said that the Rs 2000 crore 3D Glass Solution project in Bhubaneswar is a major step toward strengthing India's semiconductor ecosystem and advancing global technology collaboration. Joining the groundbreaking ceremony of the Project on virtual mode, the Intel CEO Tan expressed appreciation for the leadership of PM Narendra Modi, whose vision has positioned India as a competitive and trusted semiconductor hub. He also acknowledged Ashwini Vaishnaw and the India Semiconductor Mission for their strategic direction and execution in driving industry growth. Tan extended his gratitude to Odisha CM Mohan Charan Majhi and the government of Odisha for their proactive support and partnership in enabling the project. Emphasizing the future of the semiconductor industry, Tan noted that advanced packaging, heterogeneous integration, and substrate technologies will play a crucial role in performance and innovation. He underscored that 3D Glass Solutions is well-positioned to contribute significantly in this space. Highlighting Odisha's strengths, Tan pointed to its reliable infrastructure, including power, water resources, and a skilled workforce, as key enablers for advanced manufacturing. The new facility is expected to generate high-quality employment, foster local talent, and contribute to building a resilient semiconductor ecosystem in India. Tan concluded by expressing confidence that the project will evolve into a center of excellence, strengthening global supply chains and reinforcing India's role in the semiconductor industry. Odisha CM Majhi today laid the foundation stone for project in Info Valley, Bhubaneswar, in the presence of Union Electronics & IT Minister Aswini Vaishnaw and Odisha Electronics & IT Minister Mukesh Mahalinga. Odisha Chief Secretary Ms. Anu Garg, E & IT Additional Chief Secretary Vishal Dev, Union E & IT Additional Secretary Amitesh Sinha, and 3D Glass Solution President & CEO Babu Mandaba were also present at the event. It may be mentioned here that Intel is associated with 3D Glass Solutions for long.
Intel has launched its Core Series 3 processors, marking the first time in years that non-Ultra Core CPUs feature genuinely new silicon. Codenamed Wildcat Lake, these chips represent a departure from previous non-Ultra models, which relied on the outdated Raptor Lake architecture from 2023's 13th-generation Core family. The new processors use two silicon tiles: a compute tile with up to two Cougar Cove P-cores, four Darkmont E-cores, and Xe3 integrated graphics, plus a platform controller tile. Built on Intel's 18A manufacturing process, they support up to 48GB LPDDR5X-7467 memory and operate at 15W base power. However, the chips' 17 TOPS NPU falls short of Microsoft's 40 TOPS requirement for Copilot+ PC features. Intel claims over 70 designs from partners will launch in coming months.