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Semicon Taiwan: TRUMPF enables integrated chip cooling for the next generation of AI chips. Advanced packaging requires integrated cooling at the semiconductor level // TRUMPF uses ultrashort-pulse lasers to enable the industrial production of the microstructures needed for this // Ultra-fine structures are created directly within the chip stack. DITZINGEN,GERMANY / TAIPEI,TAIWAN - Media OutReach Newswire - 1 September 2026 - The next generation of high-performance AI chips requires new cooling solutions. At Semicon Taiwan, TRUMPF is showcasing for the first time a new ultrashort-pulse laser application that enables the industrial production of cooling systems integrated into AI chips. "Heat dissipation will become the bottleneck for future AI processors. Without new cooling concepts, the high requirements cannot be met. Our ultrashort-pulse lasers enable the cost-effective production of the microstructures required for this on an industrial scale," says Cathrin Conrad, Business Development Manager at TRUMPF and responsible for chip cooling. With the new laser application, chip manufacturers can flexibly integrate cooling structures into the chip stack. The process is suitable for various materials, such as silicon carbide and diamond. Optimizing Business Workflows Discover more Choosing Investment Platforms AI Boom drives demand for new cooling concepts Manufacturers are increasingly turning to advanced packaging, a cutting-edge semiconductor technology in which chips are stacked or closely interconnected to enable greater computing power in a small space. As a result, heat is increasingly generated inside the chip stack and can only be dissipated to a limited extent using conventional cooling methods, such as cooling server racks or entire data centers. Leading semiconductor manufacturers have therefore included novel cooling solutions for chips in their development roadmaps, such as microfluidic cooling or heat spreaders. This involves incorporating extremely fine structures into the chip package that dissipate heat where it is generated. Semiconductor manufacturers must integrate these cooling structures into materials such as silicon carbide. This material is suitable for demanding applications in the semiconductor industry and efficiently dissipates heat. However, manufacturing the required microstructures poses major challenges for the semiconductor industry, as silicon carbide is extremely hard, the required structures are extremely small, and they are difficult to produce using established etching processes. Hiring Management Consultants TRUMPF lasers enable industrial production of cooling structures This is where TRUMPF's ultrashort-pulse lasers (USP) come into play. "The key advantage of our technology: It is the combination of high laser power, beam-shaping technology, and our many years of application expertise that makes the industrial production of integrated cooling systems in chip stacks possible," says Conrad. The USP lasers ablate the silicon carbide with micrometer precision and create the fine structures. High precision is crucial for reliable cooling. Compared to etching, ultrashort-pulse lasers enable at least five times the processing speed while delivering excellent surface quality and precise geometry of the cooling structures. This allows the semiconductor industry's requirements for both quality and cost-effectiveness to be met simultaneously. After all, in addition to quality, productivity plays a central role for chip manufacturers. Discover more Taking Economics Courses Management Securing Business Loans Studying Engineering Courses Digital photographs in print-ready resolution are available to illustrate this press release. They may only be used for editorial purposes. Use is free of charge when credit is given as "Photo: TRUMPF". Graphic editing - except for cropping out the main motif - is prohibited. Additional photos can be accessed at the TRUMPF Media Pool. Hashtag: #TRUMPF The issuer is solely responsible for the content of this announcement. TRUMPF. TRUMPF is a high-tech company offering manufacturing solutions in the fields of machine tools, laser technology and semiconductor industry. It drives digital connectivity in manufacturing through consulting, platform products and software. TRUMPF is one of the technology and market leaders in highly versatile machine tools for sheet metal processing, in the field of industrial lasers and power electronics. In 2025/26, TRUMPF employed 16,960 people and generated sales of 4.3 billion euros. With about 90 companies, the TRUMPF Group is represented in nearly every European country as well as in North America, South America and Asia. The company has production facilities in Germany, France, the United Kingdom, Italy, Austria, Switzerland, Poland, the Czech Republic, the United States, Mexico and China. Find out more about TRUMPF at www.trumpf.com

TRUMPF makes glass substrates ready for the next generation of AI chips. September 01, 2026 - 19:00 The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a key challenge facing the semiconductor industry: the reliable coating of highly complex glass substrates for the next generation of high-performance AI processors. DITZINGEN, GERMANY / TAIPEI, TAIWAN - Media OutReach Newswire - 1 September 2026 - The race for more powerful AI chips is increasingly shifting to packaging. To pack more computing power into a smaller space in the future, industry leaders are therefore investing in new substrate technologies such as glass substrates. These enable more functions to be integrated into a smaller space and allow data to be transmitted faster and more efficiently within the chip. To achieve this, however, manufacturers must drill millions of microscopic holes into the glass and then coat them with conductive material. Millions of through-holes must be error-free TRUMPF has now developed the first industrial process of its kind that enables the production of such structures with high quality and reproducible results. With its HiPIMS products, the high-tech company is supporting the semiconductor industry in bringing glass substrates for the next generation of high-performance AI processors to series production. "The computing power of modern AI chips is increasing rapidly. As a result, the demand for packaging is also growing. Through-glass vias are considered a promising approach for future generations of chips. However, it is crucial that millions of extremely fine structures can be reliably coated. This is exactly where our HiPIMS technology comes into play," says Piotr Lach, Head of Next Technology Demands at TRUMPF Elektronik. The challenge: The holes in the glass substrates are both very deep and very narrow. Even a small number of incorrectly coated through-vias can render an entire glass panel unusable. For mass production, therefore, reliable processes, consistent results, and a high yield of functional components are crucial. TRUMPF's technology improves process stability and increases production yield compared to conventional methods. This enables TRUMPF to help chip manufacturers economically transition new packaging concepts for AI applications into series production. HiPIMS products precisely direct charged particles into deep structures HiPIMS is a particularly high-performance coating process. TRUMPF's industrially manufactured HiPIMS generators produce a highly ionized plasma with a higher proportion of electrically charged particles than conventional methods. These ions can be precisely controlled using additional electric and magnetic fields and directed into deep, narrow structures. This results in a significantly more uniform coating, even in deep trenches. HiPIMS generates significantly higher ionization, leading to a higher density of deposited molecules. "This improves the quality of the coating. The technology helps increase manufacturing yield and lays the foundation for cost-effective mass production of future AI chips," says Lach. A Pioneer in the Industry TRUMPF has many years of experience with HiPIMS technologies in industrial production environments. The company launched its first HiPIMS solutions for other application areas many years ago and has continuously refined the technology. Today, this high-tech company has extensive experience gained from real-world manufacturing processes. "For our customers, it's not just about technological performance. What matters most is that processes can be scaled and replicated consistently worldwide. With our industrialization expertise and technological lead, we support leading chip manufacturers in bringing advanced packaging technologies into mass production quickly and reliably," says Lach. TRUMPF covers several key technologies for advanced packaging In addition to HiPIMS, TRUMPF offers other technologies for advanced packaging. These include ultrashort-pulse lasers for the production of through-glass vias, as well as plasma power supplies for coating and etching processes in semiconductor manufacturing. Together, these technologies form an important foundation for the production of high-performance chips for artificial intelligence, data centers, and high-performance computers. Digital photographs in print-ready resolution are available to illustrate this press release. They may only be used for editorial purposes. Use is free of charge when credit is given as "Photo: TRUMPF". Graphic editing - except for cropping out the main motif - is prohibited. Additional photos can be accessed at the TRUMPF Media Pool. Hashtag: #TRUMPF The issuer is solely responsible for the content of this announcement. TRUMPF. TRUMPF is a high-tech company offering manufacturing solutions in the fields of machine tools, laser technology and semiconductor industry. It drives digital connectivity in manufacturing through consulting, platform products and software. TRUMPF is one of the technology and market leaders in highly versatile machine tools for sheet metal processing, in the field of industrial lasers and power electronics. In 2025/26, TRUMPF employed 16,960 people and generated sales of 4.3 billion euros. With about 90 companies, the TRUMPF Group is represented in nearly every European country as well as in North America, South America and Asia. The company has production facilities in Germany, France, the United Kingdom, Italy, Austria, Switzerland, Poland, the Czech Republic, the United States, Mexico and China. Find out more about TRUMPF at

One turret station, zero secondary tapping: A floor-space strategy for sheet metal shops. Sheet metal shops often treat tapping as a necessary secondary operation: parts come off the turret punch press, move to a drill/tap center or bench, and wait. That waiting area is not just a scheduling problem - it is floor space, work-in-process inventory, and extra handling. Turret tapping changes this by moving thread production into the punch press itself. Modern servo-electric turret punch presses already offer faster cycle times and lower energy use than hydraulic models while supporting punching, forming, marking, and tapping in one setup. When a tapping tool occupies a turret station, a punched or extruded hole can be threaded in the same program that cuts the blank and forms features. Parts leave the machine complete. How turret tapping works in the punch stroke. In a turret tapping station, the press positions the sheet under the tool and drives a tap into a previously punched or extruded hole. Synchronized stroke depth, feed rate, and tap retraction produce a formed thread without moving the part to another machine. Servo-electric presses provide the repeatable ram control needed for pitch accuracy, especially in thin gauge material where only a few threads engage. Tooling is the limiting factor. Thick-turret tapping systems have proven capable of threading a wide range of sheet metals when hole diameter and extrusion height are prepared correctly. Haiyu's 85-series turret tapping tools are compatible with Amada, Trumpf, and Prima Power presses, letting shops add tapping as a standard tool change rather than a standalone work cell. For progressive stamping operations, the same one-step principle applies in the die. Haiyu in-die tapping machines tap M1-M10 threads directly during the stamping stroke, with up to 21 holes and built-in tap breakage detection. Whether the thread is produced in a turret press or inside a stamping die, the secondary tapping bench disappears. Thread quality without the secondary bench. A frequent concern is thread consistency. On a dedicated tapping machine, an operator can feel torque and react. In a turret press, quality comes from repeatable stroke length, controlled feed rate, and correct hole preparation. Pre-punched holes need accurate diameters and, in thin materials, an extruded collar to provide additional thread engagement. When those inputs are stable, a CNC turret can produce threads with consistent pitch and depth because program values replace operator variability. Secondary tapping also introduces quality risks from re-clamping, misalignment, and mixed lots. Keeping the part on one machine preserves datums and reduces handling damage. It also shortens the process chain: punching, forming, marking, and tapping without moving the sheet reduces setup and part handling - a principle already demonstrated by multitasking punch/laser systems. Floor space and the one-step equation. Every dedicated tapping bench needs a footprint, an operator, fixtures, and a queue of parts waiting for attention. Replace it with one or two turret stations, and that floor area returns to production or disappears entirely. Because turret punches offer quick tool changes and high material efficiency, adding tapping to an existing program does not require a new machine - just a tool station and the right CAM sequence. The cost logic is straightforward: one-step tapping removes a secondary operation, cuts labor per part, reduces work-in-process, and frees floor space for higher-value work. Shops that once avoided threaded holes in turret-punched parts can now quote them as standard, which is why high-mix fabricators continue to expand product lines around the turret punch. Turret tapping is not a compromise for low volumes; it is a space and labor strategy for shops that want complete parts off one machine. By selecting the right tapping tool for your press - or moving thread forming into the die with an in-die tapping unit - sheet metal manufacturers can eliminate the secondary tapping bench and the floor space, handling, and cost that come with it.