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Full-Time

Package Design Engineering Lead

Confirmed live in the last 24 hours

Groq

Groq

201-500 employees

Develops real-time AI inference hardware and software

Hardware
AI & Machine Learning

Compensation Overview

$208.8k - $420.4kAnnually

+ Equity + Benefits

Expert

Remote in USA

Category
Electronics Design Engineering
Electrical Engineering
Required Skills
Cadence Allegro
Requirements
  • Bachelors or M.S. in Electrical Engineering, Mechanical Engineering or Material science required
  • 10 or more years of industry experience/exposure with hands on experience in Semiconductor Packaging Design, Process and Technology Development
  • Hands on experience in industry standard tools like Cadence APD/Allegro
  • HVM experience with RDL designs for advanced packaging solutions
  • Ability to build strong relationships
  • Good written and oral communication skills; strong technical documentation skills
  • Good interpersonal skills; a history of mentoring junior engineers and interns a huge plus
  • Highly self-motivated and directed; self-confidence and self-starter
  • Keen attention to detail
  • Proven analytical and problem-solving abilities
  • Ability to effectively prioritize and execute tasks in a high-pressure environment
  • Experience working in a team-oriented, collaborative environment
Responsibilities
  • Lead chip package design process including chip PAD ring, define substrate interconnect scheme
  • Drive packaging effort end to end from concept to NPI, HVM, meet Cost/Manufacturability/Signal integrity/Flip chip assembly, Mechanical & Thermal requirements
  • Co-work with chip design team to optimize package design via chip floorplan, bump and package ball out, stack up and physical routing based on system requirements
  • Co-work with chip design, product engineering teams to come up with optimum substrate/ RDL solution to meet schedule/cost/component and system level requirements
  • Work closely with Foundry and OSAT partners to develop and bring up new substrate/ RDL technology from definition to prototyping to HVM
  • Own and execute Flip chip packages in single chip, 2.5D/3D in material optimization, NPI, CPI, package qualifications of component and board level, failure analysis
  • Drive definition of DFM/DFT/DOE/FMEA , material selection, improving critical process window

At Groq, the focus on real-time AI solutions through a Language Processing Unit™ and a deterministic Tensor Streaming architecture allows the company to excel in delivering ultra-low latency AI inference at scale. This specialized approach not only enhances technology performance but also simplifies processes for developers, accelerating production timelines and improving return on investment. Additionally, Groq's commitment to domestically-based supply chains supports higher sustainability and reliability in operations, making it an effective workplace for driving forward-thinking AI technology solutions.

Company Stage

Series C

Total Funding

$408.6M

Headquarters

Mountain View, California

Founded

2016

Growth & Insights
Headcount

6 month growth

24%

1 year growth

33%

2 year growth

6%
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Simplify's Take

What believers are saying

  • Groq's recent $300 million Series D funding round, led by BlackRock, values the company at $2.5 billion, indicating strong investor confidence and financial stability.
  • The launch of public demos on platforms like Hugging Face Spaces allows users to interact with Groq's models, potentially increasing user engagement and adoption.
  • Groq's rapid query response times, significantly faster than competitors like Nvidia, position it as a leader in AI inference speed.

What critics are saying

  • The competitive landscape with established players like Nvidia poses a significant challenge to Groq's market penetration.
  • High expectations from investors following substantial funding rounds could pressure Groq to deliver rapid and consistent innovation.

What makes Groq unique

  • Groq's open-source Llama AI models outperform proprietary models from tech giants like OpenAI and Google in specialized tasks, showcasing their superior tool use capabilities.
  • Groq's processors, known as LPUs, are claimed to be 10x faster and 1/10 the price of current market options, providing a significant cost-performance advantage.
  • The company's participation in the National AI Research Resource (NAIRR) Pilot highlights its commitment to responsible AI innovation and real-time AI inference.